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Image capturing device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H04N-005/225
  • H01L-021/00
출원번호 UP-0994634 (2004-11-23)
등록번호 US-7616250 (2009-11-23)
우선권정보 JP-2004-218913(2004-07-27)
발명자 / 주소
  • Watanabe, Naoyuki
  • Honda, Toshiyuki
  • Akutagawa, Yoshito
  • Moriya, Susumu
  • Kobayashi, Izumi
출원인 / 주소
  • Fujitsu Microelectronics Limited
대리인 / 주소
    Westerman, Hattori, Daniels & Adrian, LLP
인용정보 피인용 횟수 : 18  인용 특허 : 11

초록

An image capturing device is disclosed that includes a light receiving element having a light receiving surface, a plate-like transparent member provided on the light receiving surface of the light receiving element, and resin provided to at least the periphery of the plate-like transparent member.

대표청구항

What is claimed is: 1. An image capturing device, comprising: a support substrate; a light receiving element provided on the support substrate, the light receiving element having a light receiving surface; a spacer provided on the light receiving element; a plate-like transparent member provided ov

이 특허에 인용된 특허 (11)

  1. Butt Sheldon H. (Godfrey IL) Smith ; III Edward F. (Madison CT) Gyurina F. Dennis (West Haven CT), Casing for electronic components.
  2. Abramovich Irit,ILX, Color image sensor with embedded microlens array.
  3. Thomas P. Glenn ; Steven Webster, Image sensor package having sealed cavity over active area.
  4. Dunmore, Simon Jon; Davenport, Michelle; Cawthorne, Michael Anthony, Inhibition of amylin release.
  5. Webster, Steven; Arellano, Tony; Hollaway, Roy Dale, Integrally connected image sensor packages having a window support in contact with a window and the active area.
  6. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  7. Minami Itsuji,JPX, Objective optical member with air gap for endoscope imaging unit.
  8. Mostafazadeh,Shahram; Smith,Joseph O., Packaging of a semiconductor device with a non-opaque cover.
  9. Bolken, Todd O.; Cobbley, Chad A., Sealed electronic device packages with transparent coverings.
  10. Todokoro Shigeru (Fujisawa JPX) Nakane Hiroshi (Yokohama JPX) Maeda Satoru (Yokohama JPX), Tracking servo system for optical-disc information reproducing apparatus.
  11. Takayama, Jun, Transparent member in a solid-state image pick-up apparatus supported through use of micro-lenses larger in size than pixel micro-lenses and a method for producing the micro-lenses and transparent member.

이 특허를 인용한 특허 (18)

  1. Feldman, Michael R.; Morris, James E.; TeKolste, Robert D., Camera system and associated methods.
  2. Vittu, Julien C., Dual overmolded reconstructed camera module.
  3. Iwasaki, Masanori; Ozawa, Ken; Matsuzawa, Nobuyuki; Hobara, Daisuke; Kimura, Nozomi, Imaging apparatus and camera system.
  4. Iwasaki, Masanori; Ozawa, Ken; Matsuzawa, Nobuyuki; Hobara, Daisuke; Kimura, Nozomi, Imaging apparatus and camera system.
  5. Iwasaki, Masanori; Ozawa, Ken; Matsuzawa, Nobuyuki; Hobara, Daisuke; Kimura, Nozomi, Imaging apparatus and camera system.
  6. Iwasaki, Masanori; Ozawa, Ken; Matsuzawa, Nobuyuki; Hobara, Daisuke; Kimura, Nozomi, Imaging apparatus and camera system for improving image quality.
  7. Iwasaki, Masanori; Ozawa, Ken; Matsuzawa, Nobuyuki; Hobara, Daisuke; Kimura, Nozomi, Imaging apparatus and camera system with light-transmitting laminated material.
  8. Itoi, Kiyokazu; Fukuda, Toshiyuki; Takayama, Yoshiki; Nishio, Tetsushi; Maruo, Tetsumasa, Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device.
  9. Itoi, Kiyokazu; Fukuda, Toshiyuki; Takayama, Yoshiki; Nishio, Tetsushi; Maruo, Tetsumasa, Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device.
  10. Vittu, Julien C., Overmolded reconstructed camera module.
  11. Vittu, Julien C., Overmolded reconstructed camera module.
  12. Minamio, Masanori; Komatsu, Tomoko; Itoi, Kiyokazu; Fukuda, Toshiyuki, Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method therefor.
  13. Jun, Hyunsu, Semiconductor package.
  14. Tsuduki, Koji; Komori, Hisatane; Matsuki, Yasuhiro; Hamasaki, Satoru, Solid-state image pickup device.
  15. Nakashiba, Yasutaka, Solid-state image sensing device.
  16. Bonkohara, Manabu, Solid-state imaging device, method of fabricating the same, and camera module.
  17. Min, Myung-An, Window structure, method of manufacturing the same, electronic device equipped with a camera including a window structure and method of manufacturing the same.
  18. Min, Myung-An, Window structure, method of manufacturing the same, electronic device equipped with a camera including a window structure and method of manufacturing the same.
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