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Semiconductor device having a flexible printed circuit

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G09G-003/36
출원번호 UP-0249523 (2008-10-10)
등록번호 US-7622797 (2009-12-02)
우선권정보 JP-2003-014034(2003-01-22)
발명자 / 주소
  • Yamazaki, Shunpei
  • Takayama, Toru
  • Maruyama, Junya
  • Goto, Yuugo
  • Ohno, Yumiko
  • Arai, Yasuyuki
  • Shibata, Noriko
출원인 / 주소
  • Semiconductor Energy Laboratory Co., Ltd.
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 0  인용 특허 : 54

초록

To provide a thin film device which becomes possible to be formed in the portion which has been considered impossible to be provided with such device by the conventional technique, and to provide a semiconductor device which occupies small space and which has high shock resistance and flexibility, a

대표청구항

What is claimed is: 1. A semiconductor device comprising: a panel comprising: a substrate having a front surface and a rear surface; a pixel portion formed over the front surface of the substrate; and a driver circuit formed over the front surface of the substrate, wherein an integrated circuit is

이 특허에 인용된 특허 (54)

  1. Duthaler Gregg M. ; Kazlas Peter T. ; Drzaic Paul S., Assembly of microencapsulated electronic displays.
  2. Ding, Yi-Chuan; Lee, Xin Hui; Chen, Kun-Ching, Chip scale package and manufacturing method.
  3. Muramatsu Eiji,JPX, Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device.
  4. Kawasaki Yuji,JPX ; Yamazaki Shunpei,JPX, Device for altering the output conditions of an information processing device according to input states at the user's k.
  5. Bridges, Ronald P., Disconnect switch for switching capacitive currents.
  6. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Display device and method of fabricating involving peeling circuits from one substrate and mounting on other.
  7. Hadley, Mark Alfred; Eisenhardt, Randolph Wilfred, Double-metal background driven displays.
  8. Yamazaki, Shunpei; Yamamoto, Kunitaka; Arai, Yasuyuki, Electro-optical device and manufacturing method thereof.
  9. Shunpei Yamazaki JP; Jun Koyama JP; Yoshiharu Hirakata JP; Takeshi Fukunaga JP, Electrooptical device.
  10. Shimoda, Tatsuya; Inoue, Satoshi; Miyazawa, Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same.
  11. Shimoda,Tatsuya; Inoue,Satoshi; Miyazawa,Wakao, Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same.
  12. Nakatsuka Yasuo,JPX, Film carrier and laminate type mounting structure using same.
  13. Miyano Ichiro,JPX ; Serizawa Koji,JPX ; Tanaka Hiroyuki,JPX ; Shinoda Tadao,JPX ; Sakaguchi Suguru,JPX, Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof.
  14. Spitzer Mark B. ; Gale Ronald P. ; Jacobsen Jeffrey, Head mounted liquid crystal display system.
  15. Vu Duv-Pach (Taunton MA) Dingle Brenda (Mansfield MA) Cheong Ngwe (Boston MA), High density electronic circuit modules.
  16. Vu Duy-Phach ; Dingle Brenda ; Cheong Ngwe, High density electronic circuit modules.
  17. Arai Michio,JPX ; Yamauchi Yukio,JPX ; Sakamoto Naoya,JPX ; Nagano Katsuto,JPX, Hybrid integrated circuit component.
  18. Michio Arai JP; Yukio Yamauchi JP; Naoya Sakamoto JP; Katsuto Nagano JP, Hybrid integrated circuit component.
  19. Yamazaki, Shunpei; Inukai, Kazutaka, Light emitting device and electrical appliance.
  20. Kawakami, Hisanori; Endo, Kogo, Light source device, illumination device liquid crystal device and electronic apparatus.
  21. Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Mansfield MA), Liquid crystal display having essentially single crystal transistors pixels and driving circuits.
  22. Moden Walter L. ; King Jerrold L. ; Brooks Jerry M., Low profile multi-IC chip package connector.
  23. Inoue Satoshi,JPX ; Shimoda Tatsuya,JPX, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  24. Inoue, Satoshi; Shimoda, Tatsuya, Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device.
  25. Yamazaki,Shunpei; Takayama,Toru; Maruyama,Junya; Ohno,Yumiko; Tanaka,Koichiro, Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance.
  26. Yamazaki Shunpei,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Method for producing display device.
  27. Yamazaki,Shunpei; Nakajima,Setsuo; Arai,Yasuyuki, Method for producing display device.
  28. Sayyah, Keyvan, Method for transferring semiconductor device layers to different substrates.
  29. Brian S. Doyle, Method of delaminating a thin film using non-thermal techniques.
  30. Yamazaki,Shunpei; Takemura,Yasuhiko; Nakajima,Setsuo; Arai,Yasuyuki, Method of manufacturing a display device having a driver circuit attached to a display substrate.
  31. Arai Michio (Tokyo JPX) Yamauchi Yukio (Kanagawa JPX) Sakamoto Naoya (Kanagawa JPX) Nagano Katsuto (Kanagawa JPX), Method of manufacturing a hybrid integrated circuit component having a laminated body.
  32. Yamazaki,Shunpei; Arai,Yasuyuki; Teramoto,Satoshi, Method of manufacturing a semiconductor device.
  33. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Method of manufacturing a semiconductor device using a metal which promotes crystallization of silicon and substrate bo.
  34. Shunpei Yamazaki JP; Yasuyuki Arai JP; Satoshi Teramoto JP, Method of manufacturing flexible display with transfer from auxiliary substrate.
  35. Takayama, Toru; Maruyama, Junya; Yamazaki, Shunpei, Method of peeling off and method of manufacturing semiconductor device.
  36. Imasu, Satoshi; Yoshida, Ikuo; Hayashida, Tetsuya; Yamagiwa, Akira; Takeura, Shinobu, Process for mounting electronic device and semiconductor device.
  37. Yamazaki,Shunpei; Takayama,Toru; Maruyama,Junya; Ohno,Yumiko, Semiconductor chip and method for manufacturing the same.
  38. Katsuyuki Naitoh JP; Kenji Toyosawa JP, Semiconductor device and liquid crystal module adopting the same.
  39. Kuwabara,Hideaki; Takayama,Toru; Goto,Yuugo; Maruyama,Junya; Ohno,Yumiko; Yamazaki,Shunpei, Semiconductor device and manufacturing method thereof.
  40. Kuwabara,Hideaki; Maruyama,Junya; Ohno,Yumiko; Takayama,Toru; Goto,Yuugo; Arakawa,Etsuko; Yamazaki,Shunpei, Semiconductor device and method for manufacturing the same.
  41. Yamazaki Shunpei,JPX ; Arai Yasuyuki,JPX ; Teramoto Satoshi,JPX, Semiconductor device employing resinous material, method of fabricating the same and electrooptical device.
  42. Yamazaki,Shunpei; Takayama,Toru; Maruyama,Junya; Goto,Yuugo; Ohno,Yumiko; Arai,Yasuyuki; Shibata,Noriko, Semiconductor device with pixel portion and driving circuit, and electronic device.
  43. Tatsuya Shimoda JP; Satoshi Inoue JP; Wakao Miyazawa JP, Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method.
  44. Zavracky Paul M. (Norwood MA) Fan John C. C. (Chestnut Hill MA) McClelland Robert (Norwell MA) Jacobsen Jeffrey (Hollister CA) Dingle Brenda (Norton MA) Spitzer Mark B. (Sharon MA), Single crystal silicon arrayed devices for display panels.
  45. Bernkopf, Jan, Split-fabrication for light emitting display structures.
  46. Bellaar Pieter H.,NLX, Stacked chip assembly.
  47. Yoshida Yuichi,JPX, Stacked semiconductor device.
  48. Yamauchi, Kazushi; Matsushita, Takeshi, Thin film device and method of manufacturing the same.
  49. Grigg, Ford B.; Jackson, Timothy L., Thin flip--chip method.
  50. Hawke Robert E.,CAX ; Patel Atin J.,CAX ; Binapal Sukhminder S.,CAX ; Divita Charles,CAX ; McNeil Lynn,CAX ; Fletcher Thomas G.,CAX, Three dimensional packaging configuration for multi-chip module assembly.
  51. Zavracky Paul M. ; Zavracky Matthew ; Vu Duy-Phach ; Dingle Brenda, Three dimensional processor using transferred thin film circuits.
  52. Shimoda, Tatsuya; Inoue, Satoshi, Three-dimensional device.
  53. Vu Duy-Phach ; Dingle Brenda ; Cheong Ngwe K., Transferred flexible integrated circuit.
  54. Yamazaki Shunpei,JPX ; Takemura Yasuhiko,JPX ; Nakajima Setsuo,JPX ; Arai Yasuyuki,JPX, Using a temporary substrate to attach components to a display substrate when fabricating a passive type display device.
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