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Thermal management apparatus and method for a circuit substrate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 UP-0906795 (2005-03-07)
등록번호 US-7623349 (2009-12-02)
발명자 / 주소
  • Refai Ahmed, Gamal
  • Shaw, John
  • Fung, Adrian
출원인 / 주소
  • ATI Technologies ULC
대리인 / 주소
    Vedder Price P.C.
인용정보 피인용 횟수 : 16  인용 특허 : 29

초록

The present disclosure relates to thermal management apparatus for a circuit substrate having heat generating components mounted on one or both sides thereof. The apparatus and method includes a circuit assembly having a first thermally conductive layer disposed on each side of the circuit substrate

대표청구항

What is claimed is: 1. An electronic device comprising: a housing having an upper panel and a lower panel being spaced apart to define a gap, the lower panel at least partially defining a mounting surface; a motherboard coupled to the mounting surface; a circuit substrate assembly mounted to the mo

이 특허에 인용된 특허 (29)

  1. Taylor Billy K. (Columbia SC), Apparatus for using an active circuit board as a heat sink.
  2. Morton David M. (Eau Claire WI), Board-mounted thermal path connector and cold plate.
  3. Cresse William M., Card support and cooler bracket.
  4. Hood ; III Charles D. ; Broder Damon W. ; Holloway Eric B., Combination electromagnetic shield and heat spreader.
  5. Boudreaux, Brent A.; Zeighami, Roy M.; Belady, Christian L., Cooling apparatus for stacked components.
  6. Shuff Gregg Douglas, Electrical circuit cooling device.
  7. Gebs Bernhart Allen (Richmond IN), Flexible shielded cable.
  8. Baucom Allan S. (Townsend MA) Foster Mark J. (Acton MA) Bovio Michele (Boston MA), Heat dissipating arrangement in a portable computer.
  9. Ali Ihab A. ; Hermerding James ; Bhatia Rakesh, Heat dissipation apparatus and method.
  10. Nakagawa Tsuyoshi,JPX ; Neho Yasushi,JPX ; Sakamoto Naoyuki,JPX ; Ohashi Shigeo,JPX ; Ohmura Yoshito,JPX ; Iwama Yukiko,JPX ; Nakajima Tadakatsu,JPX ; Kondo Yoshihiro,JPX ; Iwai Susumu,JPX ; Matsushi, Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates.
  11. Patel Chandrakant (Fremont CA), Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate.
  12. Tzeng Wen-Shian V. ; Saccuzzo Ronald ; Mitchell Jonathan E., Heat-shrinkable jacket for EMI shielding.
  13. Alcoe, David James, Low-stress compressive heatsink structure.
  14. Haines,Michael D., Method and apparatus for protecting a die ESD events.
  15. Byers, Charles Calvin; Keaffaber, Todd; Scott, Andrew F., Mounting of mezzanine circuit boards to a base board.
  16. James F. Stevenson, Multifunctional laminate structure and process.
  17. Katsumata Akio (Yokohama JPX) Hirata Seiichi (Yokosuka JPX) Fujieda Shinetsu (Kawasaki JPX) Shimozawa Hiroshi (Yokohama JPX), Plastic molded semiconductor device having waterproof cap.
  18. Oberlin,Gary E.; Myers,Bruce A.; Degenkolb,Thomas A.; Peugh,Darrel E., Power electronic system with passive cooling.
  19. Wolf, Kuno; Koelle, Gerhard; Zaremba, Juergen; Jacob, Wolfgang; Wallrauch, Alexander; Ruf, Christoph; Schmid, Ralf; Urbach, Peter; Bireckoven, Bernd; Krauss, Hans-Reiner; Scholz, Dirk, Power semiconductor module.
  20. Saneinejad Mohsen ; Kim David K. J. ; Waters Mark H., Pressure compliantly protected heatsink for an electronic device.
  21. Kermaani Kaamel M. ; Ho Raymond Kai, Printed circuit board with integrated cooling mechanism.
  22. Hoffman Scott, Single mount and cooling for two two-sided printed circuit boards.
  23. Belady, Christian L.; Harris, Shaun L.; Williams, Gary Wayne; Boudreaux, Brent A., Stack up assembly.
  24. Harris, Shaun L., Stack up assembly.
  25. Smith Grant M. ; Tamarkin Vladimir K., Stacked circuit board assembly adapted for heat dissipation.
  26. Davidson Howard L. (San Carlos CA) Nishtala Satyanarayana (Santa Clara CA), Stacking heatpipe for three dimensional electronic packaging.
  27. Ashiya, Hiroyuki; Tanaka, Yoshiyuki; Maki, Yayoi, Substrate-stacking structure.
  28. Dietrich, Brenda Lynn; Mok, Lawrence Shungwei; Pickover, Clifford Alan, Temperature-controlled user interface.
  29. Burns Carmen D. (Austin TX) Roane Jerry (Austin TX) Cady James W. (Austin TX), Ultra high density integrated circuit packages.

이 특허를 인용한 특허 (16)

  1. Sporer, Bernd; Weinmann, Klaus; Schneider, Oleg, Adapter cooling apparatus and method for modular computing devices.
  2. Ligtenberg, Chris, Apparatus for reducing electromagnetic interference and spreading heat.
  3. Horng, Alex; Kuo, Chi-Hung; Chung, Chih-Hao; Cheng, Chung-Ken; Wang, Jui-Feng, Cooling module assembly method.
  4. Arora, Manish; Jayasena, Nuwan; Loh, Gabriel H.; Schulte, Michael J.; Manne, Srilatha, Distributed computing with phase change material thermal management.
  5. Yamane, Shigeki, Electric connection box and manufacturing method of electric connection box.
  6. Cao, Weijie; Xi, Shenghua; Fang, Li, Electronic device.
  7. Li, Min-Li; Zhou, Xiao-Hui; Zhao, Ting-Ting; Li, Hong, Electronic device.
  8. Sano, Tatsuya; Okuchi, Tetsuya, Electronic device and method of radiating heat from electronic device.
  9. Elkaslassy, Daniel; Kalmanoviz, Daniel, Heat dissipating high power systems.
  10. Elkaslassy, Daniel; Kalmanoviz, Daniel, Heat dissipating high power systems.
  11. Lee, Gordon K. Y., IC thermal management system.
  12. Guyenot, Michael; Geissler, Alexander, Method and device for fastening a planar substrate, having an electric circuit or the like, in a mounting position.
  13. Yen, Heng-Yu; Huang, Pai-Ching, Motherboard.
  14. Refai-Ahmed, Gamal, Portable computing device with thermal management.
  15. Albrecht, III, L. Ray; Lee, Gordon K. Y.; He, Jin, Thermal management system and method.
  16. Penttinen, Juha Erkki Antero, Thermal material within a device.
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