IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0772419
(2004-02-06)
|
등록번호 |
US-7625493
(2009-12-16)
|
우선권정보 |
JP-2003-029956(2003-02-06) |
발명자
/ 주소 |
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
7 인용 특허 :
33 |
초록
▼
In order to achieve low cost of manufacture of a display device by reducing the use of primary material used in a manufacturing process of a display device and saving labor taken for a vacuum process, according to the invention, liquid droplets containing conductive particles are ejected on a film b
In order to achieve low cost of manufacture of a display device by reducing the use of primary material used in a manufacturing process of a display device and saving labor taken for a vacuum process, according to the invention, liquid droplets containing conductive particles are ejected on a film being processed by using a first liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices, thereby a conductive film is formed. After that, a resist pattern is locally formed on the conductive film by using a second liquid droplet ejecting apparatus having a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting orifices. The conductive film is etched with the resist pattern as a mask to form a wiring.
대표청구항
▼
The invention claimed is: 1. A manufacturing method of a display device comprising: forming a conductive film over a substrate by ejecting liquid droplets containing conductive particles by using a first liquid droplet ejecting apparatus comprising a liquid droplet ejecting head provided with a plu
The invention claimed is: 1. A manufacturing method of a display device comprising: forming a conductive film over a substrate by ejecting liquid droplets containing conductive particles by using a first liquid droplet ejecting apparatus comprising a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting nozzles arranged linearly; forming a resist pattern locally on the conductive film by using a second liquid droplet ejecting apparatus comprising a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting nozzles arranged linearly; forming a wiring by etching the conductive film with the resist pattern as a mask at an atmospheric pressure or a pressure close to the atmospheric pressure by using a first plasma generating device comprising a plurality of pairs of electrodes; etching the resist pattern at an atmospheric pressure or a pressure close to the atmospheric pressure by using the first plasma generating device; forming an insulating film over the wiring; and forming a contact hole by etching the insulating film at an atmospheric pressure or a pressure close to the atmospheric pressure by using a second plasma generating device provided with a pair of electrodes. 2. The manufacturing method of a display device according to claim 1, wherein the wiring includes at least one conductive material selected from the group consisting of Ag, Au, Cu, Ni, Pt, Pd, Ir, Rh, W, and Al, metal sulfide of Cd and Zn, oxide of Fe, Ti, Si, Ge, Si, Zr, Ba, and the like, and fine particles or dispersible nanoparticles of silver halide. 3. The manufacturing method of a display device according to claim 1, wherein the pair of electrodes are cylindrical electrodes. 4. The manufacturing method of a display device according to claim 1, wherein the plurality of pairs of electrodes are arranged linearly. 5. The manufacturing method of a display device according to claim 1, wherein the insulating film comprising at least one selected from the group consisting of a silicon nitride, a silicon oxide and an organic resin. 6. A manufacturing method of a display device comprising: forming a conductive film over a substrate by ejecting liquid droplets containing conductive particles by using a liquid droplet ejecting apparatus comprising a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting nozzles arranged linearly; after forming the conductive film, forming a wiring by etching an unnecessary portion of the conductive film locally at an atmospheric pressure or a pressure close to the atmospheric pressure by using a first plasma generating device comprising a plurality of pairs of electrodes; forming an insulating film over the wiring; and forming contact holes by etching the insulating film at an atmospheric pressure or a pressure close to the atmospheric pressure by using a second plasma generating device provided with only a pair of electrodes, the second plasma generating device moving in a direction perpendicular to a direction in which the substrate is moved. 7. The manufacturing method of a display device according to claim 6, wherein the wiring includes at least one conductive material selected from the group consisting of Ag, Au, Cu, Ni, Pt, Pd, Ir, Rh, W, and Al, metal sulfide of Cd and Zn, oxide of Fe, Ti, Si, Ge, Si, Zr, Ba, and the like, and fine particles or dispersible nanoparticles of silver halide. 8. The manufacturing method of a display device according to claim 6, wherein the pair of electrodes are cylindrical electrodes. 9. The manufacturing method of a display device according to claim 6, wherein the plurality of pairs of electrodes are arranged linearly. 10. The manufacturing method of a display device according to claim 6, wherein the insulating film comprising at least one selected from the group consisting of a silicon nitride, a silicon oxide and an organic resin. 11. The manufacturing method of a display device according to claim 6, wherein the plurality of liquid droplet ejecting nozzles of the liquid droplet ejecting head in the liquid droplet ejecting apparatus are arranged two lines without an offset in pitch. 12. A manufacturing method of a display device comprising: forming a conductive film over a substrate by using a liquid droplet ejecting apparatus comprising a liquid droplet ejecting head provided with a plurality of liquid droplet ejecting nozzles arranged linearly; forming a resist pattern on the conductive film; after forming the resist pattern, forming a wiring by etching an unnecessary portion of the conductive film locally at an atmospheric pressure or a pressure close to the atmospheric pressure by using a first plasma generating device comprising a plurality of pairs of electrodes; etching the resist pattern at an atmospheric pressure or a pressure close to the atmospheric pressure by using the first plasma generating device; forming an insulating film over the wiring; and forming a contact hole by etching the insulating film at an atmospheric pressure or a pressure close to the atmospheric pressure by using a second plasma generating device provided with a pair of electrodes. 13. The manufacturing method of a display device according to claim 12, wherein the wiring includes at least one conductive material selected from the group consisting of Ag, Au, Cu, Ni, Pt, Pd, Ir, Rh, W, and Al, metal sulfide of Cd and Zn, oxide of Fe, Ti, Si, Ge, Si, Zr, Ba, and the like, and fine particles or dispersible nanoparticles of silver halide. 14. The manufacturing method of a display device according to claim 12, wherein the pair of electrodes are cylindrical electrodes. 15. The manufacturing method of a display device according to claim 12, wherein the plurality of pairs of electrodes are arranged linearly. 16. The manufacturing method of a display device according to claim 12, wherein the insulating film comprising at least one selected from the group consisting of a silicon nitride, a silicon oxide and an organic resin.
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