A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed metal material. Even when a power s
A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed metal material. Even when a power semiconductor is mounted on the built-up circuit pattern, the heat that is generated by losses therein can be diffused by the built-up circuit pattern. The wiring board has excellent heat dissipation, can be manufactured by a small number of process steps, and is of low cost.
대표청구항▼
What is claimed is: 1. A wiring board comprising: an insulating plate; a metal circuit pattern disposed on the insulating plate; a built-up circuit pattern having a predetermined shape and comprising a cold sprayed metal material, said built-up circuit pattern being directly deposited on the metal
What is claimed is: 1. A wiring board comprising: an insulating plate; a metal circuit pattern disposed on the insulating plate; a built-up circuit pattern having a predetermined shape and comprising a cold sprayed metal material, said built-up circuit pattern being directly deposited on the metal circuit pattern to have the predetermined shape without further processing, said built-up circuit pattern being thicker than the metal circuit pattern, and a heat-generating semiconductor component mounted on the built-up circuit pattern, wherein the built-up circuit pattern is provided at least on the metal circuit pattern in a region where the semiconductor component is to be mounted, wherein the built-up circuit pattern and the metal circuit pattern have a total thickness equal to a distance from an edge of the mounted semiconductor component to an edge of the built-up circuit pattern. 2. The wiring board according to claim 1, wherein the insulating plate is a metal base wiring board comprising a metal plate, and an inorganic filler-containing resin bonded to the metal plate. 3. The wiring board according to claim 1, wherein the insulating plate is a ceramic wiring board comprising a ceramic insulating plate with metal foil on two sides thereof, and the ceramic insulating plate consists of one material selected from the group consisting of Al2O3, AlN, and Si3N4. 4. The wiring board according to claim 1, wherein the metal material is one selected from the group consisting of copper, aluminum, iron, titanium, molybdenum, and nickel. 5. The wiring board according to claim 1, wherein said built-up circuit pattern comprises a layer directly formed on the metal circuit pattern by collision of metal particles in a solid state on the metal circuit pattern, said layer forming the cold sprayed metal material. 6. The wiring board according to claim 5, wherein said layer directly formed on the metal circuit pattern is only partly disposed on the metal circuit pattern without forming an entire surface of the metal circuit pattern. 7. The wiring board according to claim 1, wherein the thickness of the metal circuit pattern is about 35 μm to about 140 μm and the thickness of the built-up circuit pattern is about 0.5 mm to about 5 mm. 8. The wiring board according to claim 1, wherein the metal circuit pattern is copper or aluminum. 9. The wiring board according to claim 1, wherein a metal foil of the circuit pattern has a thickness selected to facilitate etching thereof during fabrication there. 10. The wiring board according to claim 5, wherein said layer directly formed on the metal circuit pattern is disposed on an entire surface of the metal circuit pattern. 11. A wiring board comprising: an insulating plate; a metal circuit pattern disposed on the insulating plate; a built-up circuit pattern having a predetermined shape and comprising a cold sprayed metal material, said built-up circuit pattern being directly deposited on the metal circuit pattern to have the predetermined shape without further processing, said built-up circuit pattern being thicker than the metal circuit pattern, and a heat-generating semiconductor component mounted on the built-up circuit pattern, wherein the built-up circuit pattern is provided at least on the metal circuit pattern in a region where the semiconductor component is to be mounted, wherein the built-up circuit pattern and the metal circuit pattern have a total thickness having a ratio of its thickness to a distance from an edge of the mounted semiconductor component to the edge of the built-up circuit pattern in a range of from 0.8 to 1.2. 12. The wiring board according to claim 11, wherein the insulating plate is a metal base wiring board comprising a metal plate, and an inorganic filler-containing resin bonded to the metal plate.
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이 특허에 인용된 특허 (14)
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Alvarez Juan M. (Medfield MA) Breit Henry F. (Attleboro MA) Levy Steven E. (Plainville MA) Hingorany Premkumar R. (Foxboro MA), Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member.
Hirano, Koichi; Nakatani, Seiichi; Matsuo, Mitsuhiro; Handa, Hiroyuki; Yamashita, Yoshihisa, Thermal conductive substrate and the method for manufacturing the same.
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