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A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive p

A hybrid electromagnetic bandgap (EBG) structure for broadband suppression of noise on printed wiring boards includes an array of coplanar patches interconnected into a grid by series inductances, and a corresponding array of shunt LC networks connecting the coplanar patches to a second conductive plane. This combination of series inductances and shunt resonant vias lowers the cutoff frequency for the fundamental stopband. The series inductances and shunt capacitances may be implemented using surface mount component technology, or printed traces. Patches may also be interconnected by coplanar coupled transmission lines. The even and odd mode impedances of the coupled lines may be increased by forming slots in the second conductive plane disposed opposite to the transmission line, lowering the cutoff frequency and increasing the bandwidth of the fundamental stopband. Coplanar EBG structures may be integrated into power distribution networks of printed wiring boards for broadband suppression of electromagnetic noise.

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What is claimed is: 1. An apparatus, comprising: a first conductive layer; a second conductive layer having conductive patches, the conductive patches connected by an inductance; a conductive element disposed between the first layer and the at least one of the conductive patches; and a capacitance

What is claimed is: 1. An apparatus, comprising: a first conductive layer; a second conductive layer having conductive patches, the conductive patches connected by an inductance; a conductive element disposed between the first layer and the at least one of the conductive patches; and a capacitance coupling the conductive element to the conductive patches or the first layer. 2. The apparatus of claim 1, wherein the first layer and the second layer are disposed in substantially parallel planes and spaced apart by a dielectric layer. 3. The apparatus of claim 1, wherein the inductance comprises at least one of a discrete inductance or a distributed inductance. 4. The apparatus of claim 3, wherein the discrete inductance comprises a surface mount technology (SMT) inductor. 5. The apparatus of claim 3, wherein the distributed inductance comprises an L-shaped line, an S-shaped line, or a meander line. 6. The apparatus of claim 5, wherein at least a portion of the distributed inductance is not coincident with the second layer. 7. The apparatus of claim 3, wherein the first surface has an opening defining a slot, the slot disposed facing the distributed inductance. 8. The apparatus of claim 1, wherein opposing portions of the first layer and the second layer have a first radius of curvature and a second radius of curvature, respectively, and the first and second radius of curvature are a substantially same value. 9. The apparatus of claim 1, wherein the capacitance is at least one of a discrete capacitance or a distributed capacitance. 10. An apparatus for supplying power to a circuit, the apparatus comprising: a first conductive layer; a second conductive layer having a plurality of conductive patches connected by inductances; and resonant vias connecting the patches with the first conductive layer. 11. The apparatus of claim 10, wherein at least one of the resonant vias comprises a conductive element disposed between the first conductive layer and one of the plurality of conductive patches. 12. The apparatus of claim 11, wherein the conductive element is a via. 13. The apparatus of claim 10, wherein the conductive element is connected to one of the first conductive layer or the conductive patch by a first capacitance. 14. The apparatus of claim 13, wherein the conductive element is connected to the other of the first conductive layer or the conductive patch by a second capacitance. 15. The apparatus of claim 13, wherein the first capacitance comprises a distributed capacitance. 16. The apparatus of claim 13, wherein the first capacitance comprises a discrete capacitor. 17. The apparatus of claim 16, wherein the first capacitance comprises a surface mount technology (SMT) capacitor. 18. The apparatus of claim 17, wherein the capacitor is mounted to the first conductive layer or to the conductive patch. 19. The apparatus of claim 13, wherein the conductive element is connected to the other of the first conductive layer or the conductive patch. 20. The apparatus of claim 10, wherein the inductances comprise discrete inductances. 21. The apparatus of claim 20, wherein the discrete inductances comprise surface mount technology (SMT) inductors. 22. The apparatus of claim 10, wherein the inductances comprise distributed inductances. 23. The apparatus of claim 22, wherein the distributed inductances comprise conductive traces. 24. The apparatus of claim 22, wherein at least a portion of the distributed inductance is not coincident with the second layer. 25. The apparatus of claim 22, wherein the distributed inductance is an L-shaped line, an S-shaped line, or a meander line. 26. The apparatus of claim 23, wherein a first conductive layer has an opening defining a slot. 27. The apparatus of claim 10, configured as a stripline. 28. The apparatus of claim 10, configured as a microstripline. 29. The apparatus of claim 10, wherein the plurality of patches is disposed between a noise generating component and a noise susceptible component. 30. The apparatus of claim 10, wherein the plurality of patches comprises two or more patches in at least one dimension. 31. The apparatus of claim 10, wherein the plurality of patches has a regular spacing in at least one dimension. 32. The apparatus of claim 10, wherein a dimension of each patch in the plurality of patches is constant in at least one dimension. 33. The apparatus of claim 10, wherein the characteristics of at least one of the patches, inductances or resonant vias are selected to determine a lower band-edge frequency of an electromagnetic stop band. 34. The apparatus of claim 10, wherein the first conductive layer and the patches are separated by a dielectric layer. 35. An apparatus comprising: a first conductive layer; a second conductive layer; and a third conductive layer disposed between the first conductive layer and the second conductive layer, and spaced apart from the first conductive layer and the second conductive layer, wherein the third conductive layer comprises: a plurality of coplanar conductive patches, and adjacent patches are connected by a coupled transmission line. 36. The apparatus of claim 35, wherein the third conductive layer comprises a substantially periodic array of conductive patches and coupled transmission lines. 37. The apparatus of claim 36, wherein one or more of a distance between patches, a size of the patches, or a length, a width, or a spacing of the coupled transmission line are selected to control a characteristic frequency of an electromagnetic stop band. 38. The apparatus of claim 35, wherein the patches are substantially rectangular in shape. 39. The apparatus of claim 38, wherein the coupled transmission lines connect to an edge of the patches near the midpoint of a side of the patches. 40. The apparatus of claim 38, wherein the coupled transmission lines are connected to the patches near corners of the patches. 41. The apparatus of claim 35, wherein the patches are non-uniform in size. 42. The apparatus of claim 41, wherein the patches have two sizes. 43. The apparatus of claim 35, wherein at least one of the first and second conductive layers has an opening defining a slot, and the slots are disposed so as to be aligned with a portion of the coupled transmission lines. 44. The apparatus of claim 35, wherein the conductive layers are metallic. 45. The apparatus of claim 44, wherein the conductive layers are part of a printed circuit board. 46. The apparatus of claim 44 wherein the conductive layers are part of a multi-chip module. 47. The apparatus of claim 44, wherein the conductive layers are part of a semiconductor chip. 48. The apparatus of claim 35, further comprising a power distribution network. 49. An apparatus comprising: a first conductive layer; and a second conductive layer comprising a plurality of conductive patches disposed parallel to the first conductive layer and separated therefrom, wherein adjacent conductive patches of the plurality of conductive patches are connected by a coupled transmission line. 50. The apparatus of claim 49, wherein the second layer comprises a substantially periodic array of conductive patches and coupled transmission lines. 51. The apparatus of claim 50, wherein at least one of the a distance between adjacent patches, a size of the patches, or a length, width, or spacing of the coupled transmission line are selected to result in an electromagnetic stop band for electromagnetic signals propagating within a waveguide formed by the first conductive layer and the second layer. 52. The apparatus of claim 49, wherein the patches are substantially rectangular in shape. 53. The apparatus of claim 52, wherein the coupled lines connect to an edge of patches near the midpoint of a side of the patches. 54. The apparatus of claim 52, wherein the coupled transmission lines are connected to the patches near corners of the patches. 55. The apparatus of claim 49, wherein the patches are non-uniform in size. 56. The apparatus of claim 49, wherein the patches have two sizes. 57. The apparatus of claim 49, wherein the first conductive layer has openings defining slots disposed so as to oppose a portion of the coupled transmission lines. 58. The apparatus of claim 50, wherein at least one of a distance between adjacent patches, or a length or a characteristic impedance of the transmission lines are selected to produce an electromagnetic stop band. 59. The apparatus of claim 49, wherein the conductive layers comprise metallic layers incorporated in a multilayer printed circuit board. 60. The apparatus of claim 58, comprising a printed circuit board. 61. The apparatus of claim 58, comprising a multi-chip module. 62. The apparatus of claim 58, comprising a semiconductor chip. 63. The apparatus of claim 49, comprising a power distribution network. 64. The apparatus of claim 49, wherein the second conductive layer further comprises openings defining a two-dimensional array of dumbbell-shaped slots. 65. The apparatus of claim 64, wherein the slots are essentially uniform in dimension and form an essentially periodic array. 66. The apparatus of claim 64, wherein at least one of a size or a shape of the slot, or a distance between slots, affect an electromagnetic bandstop frequency. 67. The apparatus of claim 64, wherein the slots are arranged into two sets such that a center line of a first set is orthogonal to a center line of a second set. 68. The apparatus of claim 66, wherein the slots are nested so that ends of a slot of a first set of slots are located proximal to a central section of a slot of a second set of slots. 69. An apparatus, comprising: a first conductive layer; and a second conductive layer opposing the first conductive layer and separated therefrom, comprising: a plurality of conductive patches, wherein the patches are connected by transmission lines, and wherein the first conductive layer has openings defining slots, the slots disposed under a portion of the transmission lines. 70. The apparatus of claim 69, wherein the patches, transmission lines, and slots form a substantially periodic structure. 71. The apparatus of claim 70, wherein one or more of a distance between patches, a patch size, a transmission line length or width, or a slot length or width, are selected to affect an electromagnetic bandstop frequency. 72. The apparatus of claim 69, wherein the first layer and the second layer comprise a power distribution network. 73. An apparatus, comprising: a first conductive layer; and a second conductive layer disposed parallel to the first conductive layer, comprising: a periodic arrangement of alternating low-impedance transmission lines and high-impedance transmission lines, wherein the first conductive layer has openings defining slots disposed opposite least a portion of the high-impedance transmission lines. 74. The apparatus of claim 73, wherein one or more of a length, or a characteristic impedance of the transmission lines are selected to affect an electromagnetic bandstop frequency. 75. The apparatus of claim 73, wherein the periodic arrangement comprises a one-dimensional array. 76. The apparatus of claim 75, wherein the second conductive layer comprises a power trace in a power distribution network. 77. The apparatus of claim 73, wherein the periodic arrangement comprises a two-dimensional array. 78. The apparatus of claim 73, comprising a power distribution network. 79. An apparatus comprising: a first conductive layer, a second conductive layer, and a third conductive layer, disposed between the first conductive layer and the second conducting layer and separated therefrom, the third conducting layer comprising: a periodic arrangement of alternating low-impedance transmission lines and high-impedance transmission lines, wherein at least one of the first or second conductive layers has opening defining slots, the slots disposed opposing at least a portion of the high-impedance transmission lines. 80. The apparatus of claim 79, wherein one or more of a length, or a characteristic impedance of the transmission lines are selected to affect an electromagnetic stop band characteristic frequency. 81. The apparatus of claim 79, wherein the periodic arrangement comprises a one-dimensional array. 82. The apparatus of claim 79, wherein the third layer comprises a power trace in a power distribution network. 83. The apparatus of claim 79, wherein the periodic arrangement comprises a two-dimensional array. 84. An apparatus comprising: a first conductive layer; an array of conductive patches, spaced apart from the first conductive layer; means for inductively coupling adjacent patches; and means for forming a resonant circuit connected between the patches and the first conductive layer. 85. An apparatus, comprising: a first conductive layer, and a second layer having conductive patches connected by inductances, wherein at least one of the inductances comprises a discrete inductor. 86. The apparatus of claim 85, wherein the discrete inductor is a surface mount technology (SMT) inductor. 87. An apparatus, comprising: a first conductive layer; and a second conductive layer having conductive patches, the conductive patches being connected by inductances, wherein at least one of the inductances includes a conductive trace located such that a portion of the conductive trace is not coincident with the second layer. 88. The apparatus of claim 87, wherein at least one of the inductive traces forms a meandering line or a spiral shape. 89. The apparatus of claim 87, comprising a power distribution network.