Embodiments of this invention relate generally to systems used to cool computer hardware and more particularly to an adaptor for a graphics module. In one embodiment a graphics card assembly is provided. The graphics card assembly includes a printed circuit board (PCB); a graphics processing unit (
Embodiments of this invention relate generally to systems used to cool computer hardware and more particularly to an adaptor for a graphics module. In one embodiment a graphics card assembly is provided. The graphics card assembly includes a printed circuit board (PCB); a graphics processing unit (GPU) attached to the PCB; and an adaptor having first and second surfaces and made from a thermally conductive material. The adaptor is disposed on the PCB so that the first surface is in thermal communication with the GPU and the second surface providing a standard interface for thermal communication with a cooling system.
대표청구항▼
I claim: 1. A graphics card assembly, comprising: a printed circuit board (PCB); a graphics processing unit (GPU) attached to the PCB; an adaptor having first and second surfaces and made from a thermally conductive material, the adaptor disposed on the PCB so that the first surface is in thermal c
I claim: 1. A graphics card assembly, comprising: a printed circuit board (PCB); a graphics processing unit (GPU) attached to the PCB; an adaptor having first and second surfaces and made from a thermally conductive material, the adaptor disposed on the PCB so that the first surface is in thermal communication with the GPU and the second surface is adapted to thermally connect to two or more different base plates, each base plate forming part of a different cooling system for the GPU. 2. The assembly of claim 1, wherein the second surface is substantially flat. 3. The assembly of claim 1, further comprising one or more memory units attached to the PCB, wherein the first surface of the adaptor is in thermal communication with the one or more memory units. 4. The assembly of claim 3, wherein the first surface is profiled to account for height variations between the GPU and the memory units. 5. The assembly of claim 3, further comprising a power supply, wherein the first surface of the adaptor is in thermal communication with the power supply. 6. The assembly of claim 1, further comprising a first cooling system, the first cooling system comprising a base plate in thermal communication with the second surface of the adaptor. 7. The assembly of claim 6, wherein the first cooling system further comprises a heat pipe in thermal communication with the base plate. 8. The assembly of claim 7, wherein the first cooling system further comprises a fin array in thermal communication with the heat pipe. 9. The assembly of claim 6, wherein the first cooling system further comprises a fin array disposed on the base plate and in thermal communication with the base plate, and a fan disposed on the base plate so that the fan may rotate relative to the base plate, the fan in fluid communication with the fin array. 10. The assembly of claim 1, wherein the adaptor has a first ear formed at a first side and a second ear formed at a second side, the second side opposite the first side. 11. The assembly of claim 10, wherein each of the ears has a chamfered end. 12. The assembly of claim 1, wherein the graphics card assembly is configured for a small form factor computer. 13. An adaptor made from a thermally conductive material and configured to be coupled to a printed circuit board (PCB), the adaptor comprising: a first surface that includes: a recess configured to be thermally coupled to a graphics processing unit (GPU) disposed on the PCB, and one or more pads configured to be thermally coupled to one or more memory units disposed on the PCB, wherein the recess and the one or more pads compensate for height differences between the GPU and the one or more memory units; and a second surface that includes: a thermal transfer area configured to thermally connect the second surface to two or more different base plates, each base plate forming part of a different cooling system for the GPU, wherein the second surface is configured to be coupled to the two or more different base plates via a plurality of fasteners that each includes a biasing member, wherein the biasing member causes the two or more different base plates to float on the second surface of the adaptor. 14. The adaptor of claim 13, wherein plurality of fasteners comprises a plurality of screws, and the biasing member comprises a spring. 15. The adaptor of claim 13, wherein the first surface of the adaptor further includes a first pad configured to be thermally coupled to a power supply included in the PCB. 16. The adaptor of claim 13, wherein the first surface of the adaptor is configured to be coupled to the PCB via one or more fasteners that each includes a different biasing member, wherein the different biasing members cause the adaptor to float over the PCB and to allow the first surface of the adaptor to be thermally coupled to the GPU and to the memory units. 17. The adaptor of claim 16, wherein the one or more fasteners each comprises a screw, and the different biasing members each comprises a spring. 18. The adaptor of claim 16, further comprising one or more cutout portions. 19. The adaptor of claim 18, wherein the one or more cutout portions allow access to the one or more fasteners. 20. The adaptor of claim 19, wherein the one or more cutout portions accommodate a vertically oriented component coupled to the PCB.
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이 특허에 인용된 특허 (12)
Stefanoski,Zoran, Cooling system for computer hardware.
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