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"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

High density in-package microelectronic amplifier

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/02   
미국특허분류(USC) 361/761; 361/728; 361/763; 174/260
출원번호 UP-0204927 (2008-09-05)
등록번호 US-7626827 (2009-12-16)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Luedeka, Neely & Graham, P.C.
인용정보 피인용 횟수 : 1  인용 특허 : 10
초록

A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.

대표
청구항

What is claimed is: 1. A sensor module comprising: a package substrate formed of layers of material and having a first surface with an open cavity, a sensor disposed within the cavity, the sensor for providing signals, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of t...

이 특허에 인용된 특허 (10)

  1. Harju Thomas,SEX. Arrangement for mounting chips in multilayer printed circuit boards. USP2001126333856.
  2. Drafts William A. ; Grama George V.. Electric current sensor utilizing a compensating trace configuration. USP1999025874848.
  3. Anderson, Richard S.; Connelly, James H.; Hanson, David S.; Soucy, Joseph W.; Marinis, Thomas F.. Integrated sensor and electronics package. USP2005056891239.
  4. David J. Monk ; Song Woon Kim KR; Kyujin Jung KR; Bishnu Gogoi ; Gordon Bitko ; Bill McDonald ; Theresa A. Maudie ; Dave Mahadevan. Micro electro-mechanical system sensor with selective encapsulation and method therefor. USP2002066401545.
  5. Wieloch Christopher J. (Brookfield WI) Babinski Thomas E. (Kenosha WI) Mather John C. (Cedar Rapids IA). Multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area. USP1997095670749.
  6. Baker Robert Grover ; Bertin Claude Louis ; Howell Wayne John ; Mosley Joseph Michael. Packaged electronic module and integral sensor array. USP1999025869896.
  7. Wieloch Christopher J. (Brookfield WI) Babinski Thomas E. (Kenosha WI) Mather John C. (Cedar Rapids IA). Power substrate with improved thermal characteristics. USP1997065641944.
  8. Webb,Craig; Guite,Jean Pierre. Sensor apparatus and method for detecting earthquake generated P-waves and generating a responsive control signal. USP2006027005993.
  9. Julian Francis S. ; Hui Raymond P. ; Hoffman James H. ; Cartsonas Christos D.. Sensor assembly with sensor boss mounted on substrate. USP1999085945605.
  10. Thomas G. Lykken. Vehicle track undercarriage adjustment system. USP2002066401847.