[특허]High density in-package microelectronic amplifier

KLA Tencor Corporation

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High density in-package microelectronic amplifier

국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/02
미국특허분류(USC)	361/761; 361/728; 361/763; 174/260
출원번호	UP-0204927 (2008-09-05)
등록번호	US-7626827 (2009-12-16)
발명자 / 주소	Nielsen, Henrik K. Georgesco, Dan G.
출원인 / 주소	KLA Tencor Corporation
대리인 / 주소	Luedeka, Neely & Graham, P.C.
인용정보	피인용 횟수 : 1 인용 특허 : 10

초록

A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.

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What is claimed is: 1. A sensor module comprising: a package substrate formed of layers of material and having a first surface with an open cavity, a sensor disposed within the cavity, the sensor for providing signals, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, electrical connections disposed on the surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the buffer and the amplifier. 2. The sensor module of claim 1, further comprising a buffer capacitor disposed within the cavity for buffering the sensor. 3. The sensor module of claim 1, wherein the electrical connections comprise at least one of pins, pads, and solder balls. 4. The sensor module of claim 1, wherein the package substrate is formed of ceramic. 5. The sensor module of claim 1, wherein the sensor is electrically connected to the first electrical traces through wire bonds. 6. The sensor module of claim 1, wherein the sensor is electrically connected to the first electrical traces through bump bonds. 7. The sensor module of claim 1, wherein the amplifier is electrically connected to the first electrical traces and the second electrical traces through wire bonds. 8. The sensor module of claim 1, wherein the amplifier is electrically connected to the first electrical traces and the second electrical traces through bump bonds. 9. The sensor module of claim 1, wherein the amplifier comprises an amplifier assembly having multiple amplifiers disposed on a substrate. 10. The sensor module of claim 1, wherein the amplifier has a fixed gain of about two. 11. The sensor module of claim 1, wherein the amplifier, the buffer, and the sensor are disposed within separate cavities in the first surface of the substrate. 12. The sensor module of claim 1, wherein the sensor is disposed in a portion of the cavity that is also open through an opposing second side of the substrate. 13. A sensor module comprising: a package substrate formed of layers of material and having a first surface with an open cavity, a sensor disposed within the cavity, the sensor for providing signals, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier assembly disposed within the cavity for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, the amplifier assembly comprising a substrate for receiving the signals from the first electrical traces, providing the signals to amplifiers mounted on the substrate, and for receiving the amplified signals from the amplifiers, electrical connections disposed on the surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the buffer and the amplifier assembly. 14. The sensor module of claim 13, further comprising a buffer capacitor disposed within the cavity for buffering the sensor. 15. The sensor module of claim 13, wherein the sensor is electrically connected to the first electrical traces through wire bonds. 16. The sensor module of claim 13, wherein the amplifier assembly is electrically connected to the first electrical traces and the second electrical traces through wire bonds. 17. The sensor module of claim 13, wherein the amplifier assembly, the buffer, and the sensor are disposed within separate cavities in the first surface of the substrate. 18. The sensor module of claim 13, wherein the sensor is disposed in a portion of the cavity that is also open through an opposing second side of the substrate. 19. A sensor module comprising: a package substrate formed of layers of material and having a first surface, a sensor disposed within a first cavity in the first surface, the sensor for providing signals, a buffer capacitor disposed within a second cavity in the first surface for buffering the sensor, first electrical traces disposed between the layers of the package substrate, the first electrical traces for receiving the signals from the sensor, an amplifier assembly disposed within a third cavity in the first surface for receiving the signals from the first electrical traces and providing amplified signals to second electrical traces disposed between the layers of the package substrate, the amplifier assembly comprising a substrate for receiving the signals from the first electrical traces, providing the signals to amplifiers mounted on the substrate, and for receiving the amplified signals from the amplifiers, electrical connections disposed on the first surface of the package substrate for receiving the buffered signals from the second electrical traces, and a lid disposed on the first surface of the package substrate for covering at least the second cavity and the third cavity. 20. The sensor module of claim 19, wherein the first cavity is also open through an opposing second side of the substrate.

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Campbell, Ladd D.; Mokler, Scott M.; Landeros, Jr., Juan; Hill, Michael J.; Zhao, Jin. Development of the advanced component in cavity technology. USP20181210159152.

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High density in-package microelectronic amplifier

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High density in-package microelectronic amplifier

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