초록 ▼

Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exch

Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.

대표청구항 ▼

What is claimed is: 1. A method of facilitating cooling of n electronics racks of a data center employing m air-cooling units within the data center, wherein n≧1 and m≧1, the method comprising: determining airflow rate through and heat load rate of the n electronics racks; setting airfl

What is claimed is: 1. A method of facilitating cooling of n electronics racks of a data center employing m air-cooling units within the data center, wherein n≧1 and m≧1, the method comprising: determining airflow rate through and heat load rate of the n electronics racks; setting airflow rate through the m air-cooling units based on the determined airflow rate through the n electronics racks; determining heat removal rate of the m air-cooling units; and dynamically determining whether a difference between the heat removal rate of the m air-cooling units and the heat load rate of the n electronics racks is within a defined tolerance, and if not, automatically adjusting heat removal rate of the m air-cooling units to bring the difference within the defined tolerance, thereby facilitating cooling of the n electronics racks of the data center. 2. The method of claim 1, wherein the automatically adjusting further comprises automatically determining a required liquid flow rate through at least one air-to-liquid heat exchanger of the m air-cooling units required to bring the difference within the defined tolerance, and adjusting liquid flow rate through the at least one air-to-liquid heat exchanger based on the determined, required liquid flow rate through the at least one air-to-liquid heat exchanger. 3. The method of claim 2, further comprising automatically outputting an insufficient cooling capability warning when liquid flow rate through the at least one air-to-liquid heat exchanger of the m air-cooling units is at a maximum and heat removal rate of the m air-cooling units is insufficient to establish the normalized difference between the heat removal rate of the m air-cooling units and heat load of the n electronics racks within the defined tolerance. 4. The method of claim 1, wherein n is a different number than m, and wherein the method further comprises automatically sensing inlet air temperature to at least one air-to-liquid heat exchanger of the m air-cooling units and employing the air inlet temperature to the at least one air-to-liquid heat exchanger in determining heat load rate of at least one electronics rack of the n electronics racks, and employing the heat load rate of the at least one electronics rack in automatically adjusting heat removal rate of at least one air-cooling unit of the m air-cooling units. 5. The method of claim 1, wherein n equals m, and wherein the method is implemented by each air-cooling unit, the method comprising for each air-cooling unit: determining airflow rate through and heat load rate of a respective electronics rack of the n electronics racks; setting airflow rate through the air-cooling unit based on the determined airflow rate through the respective electronics rack; determining heat removal rate of the air-cooling unit; and dynamically determining whether a difference between the heat removal rate of the air-cooling unit and the heat load rate of the respective electronics rack is within a defined tolerance, and if not, automatically adjusting heat removal rate of the air-cooling unit to bring the difference within the defined tolerance, thereby facilitating cooling of the n electronics racks of the data center. 6. The method of claim 5, further comprising setting the airflow rate through each air-cooling unit equal to the determined airflow rate through the respective electronics rack, and wherein the automatically adjusting further comprises automatically adjusting liquid coolant flow rate through an air-to-liquid heat exchanger of the air-cooling unit, and wherein the automatically adjusting further comprises automatically determining a required liquid flow rate through the air-to-liquid heat exchanger to bring the difference within the defined tolerance, and adjusting liquid flow rate through the air-to-liquid heat exchanger based on the determined, required liquid flow rate. 7. The method of claim 6, wherein the automatically determining the required liquid flow rate initially includes determining whether heat capacity rate of air passing across the air-to-liquid heat exchanger is lower than heat capacity rate of liquid passing through the air-to-liquid heat exchanger. 8. The method of claim 1, further comprising automatically periodically outputting the determined airflow rate through and heat load rate of the n electronics racks, and the airflow rate through and heat removal rate of the m air-cooling units. 9. An air-cooling unit for a data center, the air-cooling unit comprising: a housing having an air inlet side and an air outlet side; an air-moving device for moving air through the housing from the air inlet side to the air outlet side thereof; an air-to-liquid heat exchanger associated with the housing for cooling air passing through the housing from the air inlet side to the air outlet side thereof; and a control unit adapted to dynamically control the air-moving device and flow of liquid coolant through the air-to-liquid heat exchanger to automatically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and a current heat removal rate target therefore, the current airflow rate target and current heat removal rate target being based on airflow through and heat load generated by at least one associated electronics racks of the data center. 10. The air-cooling unit of claim 9, further comprising at least one air inlet temperature sensor for sensing inlet temperature of air passing across the air-to-liquid heat exchanger (Tin,a), at least one air outlet temperature sensor for sensing outlet temperature of air passing across the air-to-liquid heat exchanger (Tout,a), a coolant inlet temperature sensor for sensing coolant inlet temperature to the air-to-liquid heat exchanger (Tin,c), and a coolant outlet temperature sensor for sensing coolant outlet temperature from the air-to-liquid heat exchanger (Tout,c) and wherein the control unit automatically determines heat removal rate of the air-cooling unit employing airflow rate through the air-cooling unit, and the sensed temperatures Tin,a, Tout,a, Tin,c, and Tout,c. 11. The air-cooling unit of claim 9, further comprising an adjustable coolant pump for pumping coolant through the air-to-liquid heat exchanger, and wherein the control unit is electronically coupled to the air-moving device and to the adjustable coolant pump for automatically adjusting airflow rate through and heat removal rate of the air-cooling unit, and wherein the control unit automatically determines the current airflow rate target and the current heat removal rate target based on a current airflow rate through and a current heat load generated by the at least one associated electronics rack of the data center. 12. The air-cooling unit of claim 9, wherein the air-to-liquid heat exchanger is a first air-to-liquid heat exchanger, and wherein the air-cooling unit further comprises a second air-to-liquid heat exchanger, the first air-to-liquid heat exchanger being disposed at the air inlet side of the air-cooling unit and the second air-to-liquid heat exchanger being disposed at the air outlet side of the air-cooling unit, and wherein the control unit automatically controls flow of coolant through both the first air-to-liquid heat exchanger and the second air-to-liquid heat exchanger. 13. The air-cooling unit of claim 12, further comprising a plurality of air-moving devices, the plurality of air-moving devices being centrally disposed within the housing for moving air through the housing from the air inlet side to the air outlet side thereof. 14. The air-cooling unit of claim 13, wherein the first air-to-liquid heat exchanger is disposed within an inlet door hingedly coupled to the housing, and wherein the second air-to-liquid heat exchanger is disposed with an outlet door hingedly coupled to the housing. 15. The air-cooling unit of claim 9, further comprising a plurality of air-moving devices for moving air through the housing from the air inlet side to the air outlet side thereof, the plurality of air-moving devices being disposed adjacent to at least one of the air inlet side or the air outlet side of the housing. 16. The air-cooling unit of claim 9, wherein the air-cooling unit is separate from the at least one associated electronics rack and is configured for disposition at the air outlet side of the at least one associated electronics rack of the data center. 17. A data center comprising: n electronics racks, wherein n≧1, each electronics rack comprising an air inlet side and an air outlet side, the air inlet and air outlet sides respectively enabling ingress and egress of air through the electronics rack; m air-cooling units, wherein m≧1, and each air-cooling unit comprises: a housing having an air inlet side and an air outlet side; an air-moving device for moving air through the housing from the air inlet side to the air outlet side thereof; an air-to-liquid heat exchanger associated with the housing for cooling air passing through the housing from the air inlet side to the air outlet side thereof; and at least one control unit adapted to dynamically control the air-moving device and flow of liquid coolant through the air-to-liquid heat exchanger of each air-cooling unit of the m air-cooling units to automatically adjust airflow rate through and heat removal rate of the m air-cooling units to achieve a current airflow rate target and a current heat removal rate target therefore, the current airflow rate target and current heat removal rate target being based on a current airflow rate through and a current heat load generated by the n electronics racks of the data center. 18. The data center of claim 17, wherein the n electronics racks are aligned in at least one row and the m air-cooling units are aligned in at least one row disposed on the air outlet sides of the n electronics racks. 19. The data center of claim 17, wherein each air-cooling unit further comprises an adjustable coolant pump for pumping coolant through the air-to-liquid heat exchanger thereof, and wherein the at least one control unit is electronically coupled to the air-moving device and to the adjustable coolant pump of each air-cooling unit for automatically adjusting airflow rate through and heat removal rate of the air-cooling unit, and wherein the at least one control unit automatically, dynamically determines the current airflow rate target and the current heat removal rate target based on a current airflow rate through and a current heat load generated by the n electronics racks of the data center. 20. The data center of claim 17, wherein the at least one control unit automatically, dynamically determines the current airflow rate target and the current heat removal rate target for each air-cooling unit employing, in part, a current airflow rate through and a current heat load rate of the n electronics racks of the data center, and wherein airflow through the m air-cooling units is adjusted to be substantially equal to airflow rate through the n electronics racks.