초록 ▼

The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower

The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower wall provided with a second slot, a contact comprising a first contact portion on which a lead of the IC is loaded, a second contact portion coming into contact with a circuit lead of the circuit board, a contact main body communicating the first contact portion with the second contact portion, and a compressing portion protruding from the rear of the contact main body, the resilient member receiving area receiving the resilient member of integral structure, set in the resilient member receiving area, in which a plurality of contacts are implanted, wherein the compressing portion compresses the resilient member in order that a contact pressure can be obtained for the contact to the IC lead and the circuit lead by means of a restoring force of the resilient member.

대표청구항 ▼

What is claimed is: 1. An IC socket to be mounted on a circuit board, comprising a base board having an upper wall and a lower wall face to face with each other to surround together a resilient member receiving area and having a curved surface formed integral with the base board and protruding to t

What is claimed is: 1. An IC socket to be mounted on a circuit board, comprising a base board having an upper wall and a lower wall face to face with each other to surround together a resilient member receiving area and having a curved surface formed integral with the base board and protruding to the resilient member receiving area, the base board being mounted on a circuit board, the upper wall located at the side of an IC with leads loaded attachably, the lower wall located at the side of the circuit board, and at least the upper wall of the upper wall and the lower wall farming a plurality of slots aligned corresponding to each lead of the IC, a plurality of contacts comprising a contact main body, a first contact portion formed on one end thereof and the lead of the IC coming in contact with the end, a second contact portion formed on another end thereof and extending in one direction and coming in contact with a circuit lead of the circuit board, and a compressing portion provided protrusively on an opposite side to the extending direction of the second contact portion of the contact main body, and a resilient member comprising one resilient body in the shape of a string or a column located in the resilient member receiving area and holding elastically and aligning the contact, the first contact portion of the contact being inserted in the slot of the upper wall and exposed from a surface of the upper wall, and wherein the curved surface is sidably fit to the contact main body, and the compressing portion of each contact compresses the one resilient body in contact elastically with the resilient member keeping the contact a standby posture and compresses the resilient member when the first contact portion comes in contact with and is compressed by the lead of the IC, and obtaining a contact pressure between the first contact portion and the lead of the IC and a contact pressure between the second contact portion and the circuit lead of the circuit board. 2. The IC socket as set forth in claim 1, wherein the base board contains an upper base board to load an IC thereon and a lower base board located on the circuit board and forming a resilient member receiving area upon being superposed with the upper base board, the upper base board having an upper wall partitioning the resilient member receiving area, the upper wall forming a first slot, the lower base board having a lower wall partitioning the resilient member receiving area, the lower wall forming a second slot, the resilient member holding elastically and aligning the contact, the first contact portion of the contact being inserted in the first slot and exposed from a surface of the upper wall, the second contact portion of the contact coming in contact with the circuit lead of the circuit board through the second slot. 3. The IC socket as set forth in claim 1, wherein the contact is a plate body in a shape of a horseshoe. 4. An IC socket to be mounted on a circuit board, comprising a base board having an upper wall and a lower wall face to face with each other to surround together a resilient member receiving area, the base board being mounted on a circuit board, the upper wall located at the side of an IC with leads loaded attachably, the lower wall located at the side of the circuit board, and at least the upper wall of the upper wall and the lower wall forming a plurality of slots aligned corresponding to each lead of the IC, a plurality of contacts comprising a contact main body, a first contact portion formed on one end thereof and the lead of the IC coming in contact with the end, a second contact portion formed on another end thereof and extending in one direction and coming in contact with a circuit lead of the circuit board, and a compressing portion provided protrusively on an opposite side to the extending direction of the second contact portion of the contact main body, and a resilient member located in the resilient member receiving area and holding elastically and aligning the contact, the first contact portion of the contact being inserted in the slot of the upper wall and exposed from a surface of the upper wall, and the compressing portion of contact coming in contact elastically with the resilient member keeping the contact a standby posture, and compressing the resilient member when the first contact portion comes in contact with and is compressed by the lead of the IC, and obtaining a contact pressure between the first contact portion and the lead of the IC and a contact pressure between the second contact portion and the circuit lead of the circuit board, wherein the resilient member is an integral structure with rubber elasticity and a plurality of through-holes passing through the resilient member vertically in plural arrangements and at least the connecting portion of the contact is inserted into the through-hole, and the first contact portion and the second contact portion being connected with an upper portion and a lower portion of the resilient member respectively, and wherein a notch portion is formed on the upper portion of the through-hole for the resilient member to be pushed up to the notch portion when the resilient member is compressed by the compressing portion. 5. The IC socket as set forth in claim 4, wherein the base board contains an upper base board to load an IC thereon and a lower base board located on the circuit board and forming a resilient member receiving area upon being superposed with the upper base board, the upper base board having an upper wall partitioning the resilient member receiving area, the upper wall forming a first slot, the lower base board having a lower wall partitioning the resilient member receiving area, the lower wall forming a second slot, the resilient member holding elastically and aligning the contact, the first contact portion of the contact being inserted in the first slot and exposed from a surface of the upper wall, the second contact portion of the contact coming in contact with the circuit lead of the circuit board through the second slot. 6. The IC socket as set forth in claim 4, wherein a counterbored portion fitting the second contact portion is formed on the bottom surface of the resilient member. 7. The IC socket as set forth in claim 4, wherein the contact is a plate body in a shape of a horseshoe. 8. The IC socket as set forth in claim 4, wherein the through-hole corresponds to the slot.