IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0987978
(2007-12-06)
|
등록번호 |
US-7632173
(2009-12-24)
|
우선권정보 |
JP-2001-372771(2001-12-06); JP-2001-379337(2001-12-12) |
발명자
/ 주소 |
- Togawa, Tetsuji
- Nabeya, Osamu
- Fukushima, Makoto
- Sakurai, Kunihiko
- Yoshida, Hiroshi
- Ichimura, Teruhiko
|
출원인 / 주소 |
|
대리인 / 주소 |
Wenderoth, Lind & Ponack, L.L.P.
|
인용정보 |
피인용 횟수 :
6 인용 특허 :
6 |
초록
▼
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and a vertically movable member which is vertically movable within the receiving space in the top ring body. An abutment member having an elastic membrane is attached to a lower surface of the vertically movable member. The elastic membrane of the abutment member comprises an abutment portion, having a flange projecting outwardly, brought into direct or indirect contact with the substrate, and a connecting portion extending upwardly from a base portion of the flange of the abutment portion and being connected to the vertically movable member. The connecting portion is made of a material having a flexibility higher than that of material of the abutment portion.
대표청구항
▼
The invention claimed is: 1. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of
The invention claimed is: 1. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, and (ii) a connecting portion extending upwardly from a base portion of said flange and being connected to said chucking plate, with said connecting portion being made of a material having a flexibility greater than a flexibility of said abutment portion. 2. The substrate holding apparatus according to claim 1, wherein said connecting portion includes a radially inward connecting portion member and a radially outward connecting portion member, with a thickness of said radially inward connecting portion member being different than a thickness of said radially outward connecting portion member. 3. The substrate holding apparatus according to claim 2, wherein said thickness of said radially inward connecting portion member is less than said thickness of said radially outward connecting portion member. 4. The substrate holding apparatus according to claim 1, wherein said flange projects radially outwardly, and said abutment portion also has a flange projecting radially inwardly, with a length of said flange projecting radially outwardly being different than a length of said flange projecting radially inwardly. 5. The substrate holding apparatus according to claim 4, wherein said length of said flange projecting radially outwardly is greater than said length of said flange projecting radially inwardly. 6. A polishing apparatus comprising: a substrate holding apparatus according to claim 1; and a polishing table having a polishing surface. 7. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, and (ii) a connecting portion extending upwardly from a base portion of said flange and being connected to said chucking plate, with said connecting portion including a thin portion having a thickness less than a thickness of said abutment portion. 8. The substrate holding apparatus according to claim 7, wherein said thin portion is constricted inwardly in a cross-section. 9. The substrate holding apparatus according to claim 7, wherein said connecting portion includes a radially inward connecting portion member and a radially outward connecting portion member, with a thickness of said radially inward connecting portion member being different than a thickness of said radially outward connecting portion member. 10. The substrate holding apparatus according to claim 9, wherein said thickness of said radially inward connecting portion member is less than said thickness of said radially outward connecting portion member. 11. The substrate holding apparatus according to claim 7, wherein said flange projects radially outwardly, and said abutment portion also has a flange projecting radially inwardly, with a length of said flange projecting radially outwardly being different than a length of said flange projecting radially inwardly. 12. The substrate holding apparatus according to claim 11, wherein said length of said flange projecting radially outwardly is greater than said length of said flange projecting radially inwardly. 13. A polishing apparatus comprising: a substrate holding apparatus according to claim 7; and a polishing table having a polishing surface. 14. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, and (ii) a connecting portion extending upwardly from a base portion of said flange and being connected to said chucking plate, with an adhesiveness of a lower surface of said base portion of said flange being weakened. 15. The substrate holding apparatus according to claim 14, wherein said adhesiveness of said lower surface of said base portion of said flange is weakened via an intermediate member, having a low adhesiveness relative to the substrate to be polished, being disposed on said lower surface of said base portion of said flange. 16. The substrate holding apparatus according to claim 14, wherein said connecting portion includes a radially inward connecting portion member and a radially outward connecting portion member, with a thickness of said radially inward connecting portion member being different than a thickness of said radially outward connecting portion member. 17. The substrate holding apparatus according to claim 16, wherein said thickness of said radially inward connecting portion member is less than said thickness of said radially outward connecting portion member. 18. The substrate holding apparatus according to claim 14, wherein said flange projects radially outwardly, and said abutment portion also has a flange projecting radially inwardly, with a length of said flange projecting radially outwardly being different than a length of said flange projecting radially inwardly. 19. The substrate holding apparatus according to claim 18, wherein said length of said flange projecting radially outwardly is greater than said length of said flange projecting radially inwardly. 20. A polishing apparatus comprising: a substrate holding apparatus according to claim 14; and a polishing table having a polishing surface. 21. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, and (ii) a connecting portion extending upwardly from a base portion of said flange and being connected to said chucking plate; and a hard member, made of a material harder than material of said elastic membrane, embedded in said base portion of said flange. 22. The substrate holding apparatus according to claim 21, wherein said hard member has an annular shape. 23. The substrate holding apparatus according to claim 21, wherein said connecting portion includes a radially inward connecting portion member and a radially outward connecting portion member, with a thickness of said radially inward connecting portion member being different than a thickness of said radially outward connecting portion member. 24. The substrate holding apparatus according to claim 23, wherein said thickness of said radially inward connecting portion member is less than said thickness of said radially outward connecting portion member. 25. The substrate holding apparatus according to claim 21, wherein said flange projects radially outwardly, and said abutment portion also has a flange projecting radially inwardly, with a length of said flange projecting radially outwardly being different than a length of said flange projecting radially inwardly. 26. The substrate holding apparatus according to claim 25, wherein said length of said flange projecting radially outwardly is greater than said length of said flange projecting radially inwardly. 27. A polishing apparatus comprising: a substrate holding apparatus according to claim 21; and a polishing table having a polishing surface. 28. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; and an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, (ii) an extending portion extending outwardly from a base portion of said flange to a position inward of a tip of said flange so as to form a groove between said extending portion and said flange, and (iii) a connecting portion extending upwardly from an outward end of said extending portion and being connected to said chucking plate. 29. The substrate holding apparatus according to claim 28, wherein said connecting portion includes a radially inward connecting portion member and a radially outward connecting portion member, with a thickness of said radially inward connecting portion member being different than a thickness of said radially outward connecting portion member. 30. The substrate holding apparatus according to claim 29, wherein said thickness of said radially inward connecting portion member is less than said thickness of said radially outward connecting portion member. 31. The substrate holding apparatus according to claim 28, wherein said flange projects radially outwardly, and said abutment portion also has a flange projecting radially inwardly, with a length of said flange projecting radially outwardly being different than a length of said flange projecting radially inwardly. 32. The substrate holding apparatus according to claim 31, wherein said length of said flange projecting radially outwardly is greater than said length of said flange projecting radially inwardly. 33. A polishing apparatus comprising: a substrate holding apparatus according to claim 28; and a polishing table having a polishing surface. 34. A substrate holding apparatus for holding and pressing a substrate to be polished against a polishing surface, comprising: a chucking plate; an elastic membrane mounted on said chucking plate for holding the substrate, said elastic membrane providing a plurality of spaces between said chucking plate and the substrate by dividing each of said spaces with an abutment member, wherein said abutment member comprises: (i) an abutment portion, having a flange projecting outwardly, to be brought into direct or indirect contact with the substrate, and (ii) a connecting portion extending upwardly from a base portion of said flange and being connected to said chucking plate; and an intermediate member, made of a material other than material of said elastic membrane, attached to a surface of said base portion of said flange. 35. The substrate holding apparatus according to claim 34, wherein said support portion has a radial length greater than a radial length of said flange. 36. The substrate holding apparatus according to claim 34, wherein said intermediate member has a low adhesiveness to the substrate. 37. A polishing apparatus comprising: a substrate holding apparatus according to claim 34; and a polishing table having a polishing surface.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.