초록 ▼

An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region

An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

대표청구항 ▼

What is claimed is: 1. An apparatus comprising: a housing adapted to contain electrical components; at least one structure disposed within the housing for confining the electrical components to designated locations within the housing; and at least one cover for sealing the housing against the weath

What is claimed is: 1. An apparatus comprising: a housing adapted to contain electrical components; at least one structure disposed within the housing for confining the electrical components to designated locations within the housing; and at least one cover for sealing the housing against the weather, the cover having a plurality of exterior fins; wherein when the housing is sealed by the at least one cover, an interior surface of the at least one cover is thermally coupled to conductively remove heat from at least one of the electrical components; and wherein the at least one cover is L-shaped. 2. The apparatus of claim 1, the housing further comprising a heat sink thermally coupled to conductively remove heat from at least one of the electrical components. 3. The apparatus of claim 2, the heat sink including a phase change material adapted to absorb heat from the at least one structure, the phase change material thermally coupled to the at least one structure and the housing.