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Techniques utilizing thermal, EMI and FIPS friendly electronic modules 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 UP-0178060 (2008-07-23)
등록번호 US-7643290 (2010-02-11)
발명자 / 주소
  • Narasimhan, Susheela N.
  • Tran, Hang
  • Tasic, Branimir
  • Borg, John
  • Cheong, Wingo
  • Nguyen, Nguyen
출원인 / 주소
  • Cisco Technology, Inc.
대리인 / 주소
    BainwoodHuang
인용정보 피인용 횟수 : 43  인용 특허 : 10

초록

An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shap

대표청구항

What is claimed is: 1. An electronic system, comprising: a chassis which defines a substantially plane-shaped cavity, the chassis being arranged to contain an air stream which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped c

이 특허에 인용된 특허 (10)

  1. Nguyen, Hiep X.; Guy, Maurice M.; Garcia, Osvaldo, Airflow system.
  2. Shabany,Younes, Airflow system for electronics chassis.
  3. Hikawa, Koji, Cooling structure for electronic circuit unit.
  4. Boone,Earl Wayne; Johnson,William C.; Devenport,Earl J., Efficient airflow management.
  5. Laura M. Bendikas ; Daniel J. Lecinski ; Hong Li ; Dane L. Greives ; Kenneth S. Laughlin, Fan tray apparatus and method.
  6. Paggen Wolfgang (Starnberg DEX) Neblich Josef (Wartenberg DEX), Frame for circuit boards with electronic components.
  7. Jacques,Joseph; Nguyen,Hiep; Garcia,Osvalso, High efficiency counter-flow shelf cooling system.
  8. Chen, Richard S., Modular air flow distribution system.
  9. Carullo,Thomas J.; Willers,Arthur G.; Goodenough,Ryan K., Modular chassis divided along a midplane and cooling system therefor.
  10. Anderson, Paul H., Thin server with side vent holes and spacer rail.

이 특허를 인용한 특허 (43)

  1. Fisher, Michael J.; Long, David C.; Merte, Donald; Weiss, Robert; Weiss, Thomas, Applying pressure to adhesive using CTE mismatch between components.
  2. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  3. Brodsky, William L.; Dragone, Silvio; Krabbenhoft, Roger S.; Long, David C.; Oggioni, Stefano S.; Peets, Michael T.; Santiago-Fernandez, William, Circuit boards and electronic packages with embedded tamper-respondent sensor.
  4. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  5. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Isaacs, Phillip Duane, Circuit layouts of tamper-respondent sensors.
  6. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Electronic package with heat transfer element(s).
  7. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  8. Brodsky, William L.; Dangler, John R.; Dreiss, Zachary T.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s).
  9. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  10. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  11. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Thomas, Enclosure with inner tamper-respondent sensor(s) and physical security element(s).
  12. Isaacs, Phillip D.; Peets, Michael T.; Wei, Xiaojin, Manufacturing electronic package with heat transfer element(s).
  13. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Method of fabricating tamper-respondent sensor.
  14. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  15. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  16. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  17. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  18. Busby, James A.; Isaacs, Phillip Duane; Santiago-Fernandez, William, Multi-layer stack with embedded tamper-detect protection.
  19. Brodsky, William L.; Dangler, John R.; Isaacs, Phillip Duane; Long, David C.; Peets, Michael T., Overlapping, discrete tamper-respondent sensors.
  20. Tucker, Paul A; Salazar, John Joseph, Security apparatus to house a device.
  21. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  22. Busby, James A.; Dragone, Silvio; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Rodbell, Kenneth P.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-proof electronic packages formed with stressed glass.
  23. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  24. Busby, James A.; Dragone, Silvio; Gaynes, Michael A.; Rodbell, Kenneth P.; Santiago-Fernandez, William, Tamper-proof electronic packages with stressed glass component substrate(s).
  25. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  26. Campbell, Levi A.; David, Milnes P.; Demetriou, Dustin W.; Ellsworth, Jr., Michael J., Tamper-proof electronic packages with two-phase dielectric fluid.
  27. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  28. Brodsky, William L.; Busby, James A.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent assemblies.
  29. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  30. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  31. Brodsky, William L.; Busby, James A.; Dreiss, Zachary T.; Fisher, Michael J.; Long, David C.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with bond protection.
  32. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  33. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  34. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  35. Brodsky, William L.; Busby, James A.; Cohen, Edward N.; Dragone, Silvio; Fisher, Michael J.; Long, David C.; Peets, Michael T.; Santiago-Fernandez, William; Weiss, Thomas, Tamper-respondent assemblies with enclosure-to-board protection.
  36. Dangler, John R.; Long, David C.; Peets, Michael T., Tamper-respondent assemblies with region(s) of increased susceptibility to damage.
  37. Busby, James A.; Fisher, Michael J.; Gaynes, Michael A.; Long, David C.; Weiss, Thomas, Tamper-respondent assemblies with trace regions of increased susceptibility to breaking.
  38. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  39. Busby, James A.; Isaacs, Phillip Duane, Tamper-respondent assembly with nonlinearity monitoring.
  40. Isaacs, Phillip Duane, Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s).
  41. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  42. Fisher, Michael J.; Long, David C.; Peets, Michael T.; Weiss, Robert; Weiss, Thomas; Tersigni, James E., Tamper-respondent assembly with vent structure.
  43. Dangler, John R.; Isaacs, Phillip Duane; Long, David C., Tamper-respondent sensors with formed flexible layer(s).
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