초록 ▼

A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled

A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.

대표청구항 ▼

What is claimed is: 1. A system, comprising: a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory; and an airflow subsystem coupled to the circuit board for circulating external air about the chipset; wherein the airflo

What is claimed is: 1. A system, comprising: a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory; and an airflow subsystem coupled to the circuit board for circulating external air about the chipset; wherein the airflow subsystem is coupled to a central portion of a carrier in contact with the chipset. 2. The system of claim 1, wherein the airflow subsystem is pivotally coupled to the circuit board. 3. The system of claim 1, wherein the chipset includes a northbridge circuit and a southbridge circuit. 4. The system of claim 1, wherein the airflow subsystem includes a fan. 5. The system of claim 4, wherein the fan is coupled to a heat sink that is positioned on the chipset. 6. The system of claim 4, wherein the airflow subsystem includes a conduit for channeling the external air to the fan. 7. The system of claim 6, wherein the conduit includes a flexible hose. 8. The system of claim 6, wherein the conduit includes a rigid pipe. 9. The system of claim 4, wherein the fan is selectively activated. 10. The system of claim 4, wherein a sensor is used to automatically activate the fan. 11. The system of claim 1, and further comprising an additional airflow subsystem coupled to the airflow subsystem. 12. The system of claim 11, wherein the additional airflow subsystem is capable of circulating external air about additional components including at least one of a power sub-system, the central processing unit, the memory, and a graphics processor. 13. The system of claim 12, wherein the additional airflow subsystem includes a fan. 14. The system of claim 12, wherein the airflow subsystem directs air in a direction in which the additional airflow subsystem directs air. 15. The system of claim 1, wherein the airflow subsystem is controlled by an operating system. 16. The system of claim 15, wherein the airflow subsystem is controlled by a BIOS of the operating system. 17. The system of claim 1, wherein the airflow subsystem receives power from the circuit board. 18. A method, comprising: providing a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory; and coupling an airflow subsystem to the circuit board for circulating external air about the chipset; wherein the airflow subsystem is coupled to a central portion of a carrier in contact with the chipset. 19. An apparatus, comprising: an airflow subsystem capable of coupling to a circuit board for circulating external air about a chipset that communicates with a central processing unit and controls interaction with memory; wherein the airflow subsystem is coupled to a central portion of a carrier in contact with the chipset. 20. The apparatus of claim 19, wherein the airflow subsystem includes a conduit coupled to an additional airflow subsystem. 21. The system of claim 1, wherein a plurality of heat exchangers each including a plurality of outwardly extending fins are coupled to the carrier. 22. The system of claim 6, wherein the conduit includes a valve to control the circulating of the external air about the chipset.