IPC분류정보
| 국가/구분 |
United States(US) Patent
등록
|
| 국제특허분류(IPC7판) |
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| 출원번호 |
UP-0243677
(2005-10-05)
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| 등록번호 |
US-7644853
(2010-02-22)
|
|
발명자
/ 주소 |
- Cobbley, Chad A.
- Ball, Michael B.
- Waddel, Marjorie L.
|
| 출원인 / 주소 |
|
| 대리인 / 주소 |
|
| 인용정보 |
피인용 횟수 :
0 인용 특허 :
87 |
초록
▼
A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up solder balls with a vacuum suction from a fluidized ball re
A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up solder balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.
대표청구항
▼
What is claimed is: 1. A solder ball placement apparatus comprising: a tool body movable in multiple axes and rotatable about at least one axis; a plurality of ball seats each having an aperture therein in the tool body, each ball seat of the plurality having a recess having a shape of a solder bal
What is claimed is: 1. A solder ball placement apparatus comprising: a tool body movable in multiple axes and rotatable about at least one axis; a plurality of ball seats each having an aperture therein in the tool body, each ball seat of the plurality having a recess having a shape of a solder ball therein to receive the solder ball therein; passageways leading from each aperture to a vacuum source and to a pressurized gas source; a first movable valve apparatus directly connected to the tool body moving therewith for controlling a vacuum applied to the plurality of ball seats for retaining solder balls on the plurality of ball seats for determining if each aperture contains a solder ball; a second movable valve apparatus directly connected to on the tool body moving therewith for controlling a gas under pressure to the plurality of ball seats for releasing the solder balls; and a controllable ball dispenser supplying the solder balls to the solder ball placement apparatus comprising: a ramp for feeding the solder balls to the plurality of ball seats, the ramp having an upper end and a lower end; a controllable valve at the lower end of the ramp for releasing a single solder ball of the solder balls on demand to the plurality of ball seats using the vacuum applied to the plurality of ball seats; and a reservoir providing a supply of the solder balls to the ramp. 2. The apparatus of claim 1, wherein gas from the pressurized gas source ejects the solder balls from the plurality of ball seats onto the substrate. 3. The apparatus of claim 1, wherein the vacuum source holds the solder balls in the plurality of ball seats and gas from the pressurized gas source ejects the solder balls from the plurality of ball seats to a plurality of bond pads on a substrate. 4. A ball placement apparatus comprising: a tool body movable in multiple axes and rotatable about at least one axis; a plurality of ball seats each having an aperture therein in the tool body, each ball seat of the plurality having a recess having a shape of a ball therein for the ball; passageways leading from each aperture to a vacuum source and to a pressurized gas source; a first movable valve apparatus directly connected to and located on the tool body moving therewith in multiple axes and rotatable about at least one axis with the tool body for controlling a vacuum applied to the plurality of ball seats for retaining balls on the plurality of ball seats for determining if each aperture contains a ball; a second movable valve apparatus directly connected to and located on the tool body moving therewith in multiple axes and rotatable about at least one axis with the tool body for controlling a gas under pressure to the plurality of ball seats for ejecting the balls; a controllable ball dispenser having a constant elevation supplying the balls to the ball placement apparatus, comprising: a ramp for feeding the balls to the plurality of ball seats, the ramp having an upper end and a lower end; a controllable valve at the lower end of the ramp for releasing a single ball of the balls on demand to the plurality of ball seats using the vacuum applied to the plurality of ball seats; and a reservoir providing a supply of the balls to the ramp. 5. The apparatus of claim 4, further comprising: a gas inlet in the reservoir, the gas inlet connected to the pressurized gas source for providing gas flow through the balls to provide a non-interrupted flow of the balls through the ramp. 6. The apparatus of claim 4, wherein the ramp holds a series of balls having a diameter in a range of about 0.01 mm to about 0.15 mm. 7. Apparatus for placing a plurality of solder balls on ball-grid-array bond pads of a substrate, the apparatus comprising: a pickup tool body having a chamber therein, tool body movable in multiple axes and rotatable about at least one axis; a heater as a source of heat for heating the pickup tool body located on the pickup tool body at ends thereof; a lower plate having a plurality of seats therein for retaining a solder ball in each seat, the plurality of seats corresponding to a configuration of an array of bond pads on a substrate; a plurality of passageways leading from each seat of the plurality to the chamber, each passageway of the plurality having a recess having a shape of a solder ball therein for the solder ball; a passageway leading from the chamber to a vacuum source; a passageway leading from the chamber to a pressurized gas; a first movable controllable valve apparatus for controlling opening and closing the vacuum source passageway attached to the pickup tool body and movable therewith in multiple axes and rotatable about at least one axis with the tool body; and a second movable controllable valve apparatus for controlling opening and closing the pressurized gas passageway attached to the pickup tool body and movable therewith in multiple axes and rotatable about at least one axis with the tool body for ejecting the solder balls from the tool body. 8. The apparatus of claim 7, wherein the source of heat comprises a heater to heat the pickup tool body to a temperature to bond the plurality of solder balls to the ball-grid-array bond pads of the substrate. 9. A pickup tool for placing preformed solder balls on a substrate, comprising: a tool body controllably movable in multiple axes and rotatable about an axis; a source of heat for the tool body directly attached to portions of the tool body; a plurality of ball seats formed in the tool body for a plurality of solder balls, each ball seat of the plurality of ball seats having an aperture having a shape of a solder ball therein; passageways leading from each aperture to a vacuum source and to a pressurized gas; a controllable movable valve apparatus including at least two valve apparatus attached to the tool body located thereon movable in multiple axes and rotatable about an axis with the tool body, one valve apparatus controlling a vacuum and a second valve apparatus controlling the pressurized gas to the plurality of ball seats to eject the solder balls from the ball seats, the vacuum retaining each of the plurality of solder balls in each of the plurality of ball seats and the pressurized gas releasing the plurality of solder balls from the plurality of ball seats; a solder ball dispenser having a constant elevation supplying the plurality of solder balls to the pickup tool, comprising: a tubular ramp for feeding the plurality of solder balls to the plurality of ball seats, the ramp having an upper end and a lower end; a controllable valve at the lower end of the ramp for releasing a single solder ball of the plurality of solder balls to a ball seat of the plurality of ball seats while a vacuum is applied to the plurality of ball seats; and a reservoir for providing a supply of solder balls to move downwardly through the ramp. 10. The pickup tool of claim 9, further comprising: a gas inlet in the reservoir, the gas inlet connected to the pressurized gas to provide gas flow through the plurality of solder balls to provide a non-interrupted flow of the plurality of solder balls through the ramp. 11. The pickup tool of claim 9, wherein the ramp holds solder balls having a diameter of about 0.01 mm to about 0.15 mm. 12. An article handling apparatus for preformed solder balls comprising: a tool body movable in multiple axes and rotating about at least one axis; a plurality of ball seats formed in the tool body for the preformed solder balls, the plurality of ball seats each having an aperture therein and a recess having a shape of a preformed solder ball therein for the preformed solder ball; at least one passageway for connecting the aperture to a vacuum source and a pressurized gas source; a first movable valve apparatus located on and attached directly on the tool body movable in multiple axes and rotatable about at least one axis with the tool body for independently controlling a vacuum to the plurality of ball seats, the vacuum for retaining the preformed solder balls on the plurality of ball seats for determining if the aperture contains a preformed solder ball; a second movable valve apparatus located on and attached directly on the tool body movable in multiple axes and rotatable about at least one axis with the tool body for independently controlling a gas under pressure to the plurality of ball seats, the gas under pressure for releasing the preformed solder balls from the plurality of ball seats; and a controllable ball dispenser located at a constant elevation supplying the preformed solder balls to the article handling apparatus, comprising: a ramp for feeding the preformed solder balls to the plurality of ball seats, the ramp having an upper end and a lower end; a controllable valve at the lower end of the ramp for releasing a single preformed solder ball of the preformed solder balls on demand to the plurality of ball seats using a vacuum applied to the plurality of ball seats; and a reservoir providing a supply of the preformed solder balls to the ramp. 13. The apparatus of claim 12, wherein the gas under pressure ejects the preformed solder balls from the plurality of ball seats. 14. The apparatus of claim 12, wherein the vacuum holds the preformed solder balls in the plurality of ball seats and the gas under pressure ejects the preformed solder balls from the plurality of ball seats to a plurality of bond pads on a substrate. 15. An article handling apparatus for preformed balls comprising: a tool body movable in multiple axes and rotating about at least one axis; a plurality of ball seats formed in the tool body for the preformed balls, the plurality of ball seats each having an aperture therein and a recess having a shape of a preformed ball therein; at least one passageway for connecting the aperture to a vacuum source and a pressurized gas source; a first movable valve apparatus attached directly to the tool body movable therewith in multiple axes and rotatable about at least one axis with the tool body for independently controlling a vacuum to the plurality of ball seats, the vacuum for retaining the preformed balls on the plurality of ball seats for determining if the aperture contains a preformed ball; a second movable valve apparatus directly attached to the tool body movable therewith in multiple axes and rotatable about at least one axis with the tool body for independently controlling a gas under pressure to the plurality of ball seats, the gas under pressure for releasing the preformed balls from the plurality of ball seats; and a fixed controllable ball dispenser located away from the tool body supplying the preformed balls to the article handling apparatus, comprising: a ramp for feeding the preformed balls to the plurality of ball seats, the ramp having an upper end and a lower end; a controllable valve at the lower end of the ramp for releasing a single preformed ball of the preformed balls on demand to the plurality of ball seats using a vacuum applied to the plurality of ball seats; and a reservoir providing a supply of the preformed balls to the ramp. 16. The apparatus of claim 15, further comprising: a gas inlet in the reservoir, the gas inlet connected to a source of pressurized gas for providing gas flow through the preformed balls to provide a non-interrupted flow of the preformed balls through the ramp. 17. The apparatus of claim 15, wherein the ramp holds a series of preformed balls having a diameter in a range of about 0.01 mm to about 0.15 mm.
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