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Vapor augmented heatsink with multi-wick structure 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/04
  • H05K-007/20
출원번호 UP-0135297 (2008-06-09)
등록번호 US-7650931 (2010-02-24)
발명자 / 주소
  • Siu, Wing Ming
출원인 / 주소
  • Covergence Technologies Limited
대리인 / 주소
    Edell, Shapiro & Finnan, LLC
인용정보 피인용 횟수 : 5  인용 특허 : 58

초록

A heat transfer device includes a base chamber, a fin chamber, and at least one fin. The chambers can be thermally coupled. The heat transfer device also includes a wick structure. The wick structure can include a multi-wick structure. The multi-wick structure can include a three-dimensional wick st

대표청구항

What is claimed is: 1. A heat transfer device, comprising: at least one chamber containing a condensable fluid, the chamber including: an evaporation region configured to be coupled to a heat source for vaporizing the condensable fluid, and a condensation region comprising condensation surfaces con

이 특허에 인용된 특허 (58)

  1. Davis Dwight Maclaren ; Gossett Keith Alan, Composite heat sink.
  2. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  3. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
  4. Kobayashi Kazuo,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus boiling and condensing refrigerant.
  5. Tanaka Hiroshi,JPX ; Kobayashi Kazuo,JPX ; Terao Tadayoshi,JPX ; Kawaguchi Kiyoshi,JPX ; Matsumoto Tatsuhito,JPX, Cooling apparatus by boiling and cooling refrigerant.
  6. Sugito, Hajime; Tanaka, Hiroshi; Ohara, Takahide, Cooling device boiling and condensing refrigerant.
  7. Tajima Makoto,JPX, Cooling device for electronic component.
  8. Yamamoto Masaaki,JPX ; Niekawa Jun,JPX ; Ueki Tatuhiko,JPX ; Ikeda Masami,JPX ; Sasaki Ken,JPX, Cooling device with heat pipe.
  9. DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
  10. Waldon Paul L. (Hickory NC) Bennett Ronald E. (Hickory NC), Electrical apparatus with heat pipe cooling.
  11. Meyer ; IV George A. (Conestoga PA) Garner Scott D. (Lititz PA), Electrically insulated envelope heat pipe.
  12. Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
  13. Tajima Makoto (Tokyo JPX), Electronic component cooling unit.
  14. Rostoker Michael D. ; Schneider Mark R. ; Pasch Nicholas F., Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices.
  15. Masaaki Yamamoto JP; Jun Niekawa JP; Yuichi Kimura JP; Kenichi Namba JP, Flat type heat pipe.
  16. Marcus Bruce D. (Los Angeles CA) Edwards Donald K. (Los Angeles CA), Graded pore size heat pipe wick.
  17. Itoh Satomi (14-2-306 Asahigaoka-machi ; Ashiya-shi ; Hyogo JPX), Heat pipe.
  18. Meijer Roelf J. (Ann Arbor MI) Ziph Benjamin (Ann Arbor MI), Heat pipe.
  19. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
  20. Itoh Akira (Osaka JPX), Heat pipe and radiating device.
  21. Fitzpatrick Peter R. (Glastonbury CT) Meyerand ; Jr. Russell G. (Glastonbury CT) Shotwell Kenneth E. (Stafford Springs CT), Heat pipe bag system.
  22. Xie Hong, Heat pipe lid for electronic packages.
  23. Nelson ; Lloyd A. ; Sekhon ; Kalwant S., Heat pipe thermal mounting plate for cooling electronic circuit cards.
  24. Adkins Douglas Ray ; Shen David S. ; Tuck Melanie R. ; Palmer David W. ; Grafe V. Gerald, Heat pipe with embedded wick structure.
  25. Benson David A. ; Robino Charles V. ; Palmer David W. ; Kravitz Stanley H., Heat pipe with improved wick structures.
  26. Meijer Roelf L. (Ann Arbor MI) Verhey Robert P. (Ann Arbor MI) Ziph Benjamin (Ann Arbor MI), Heat pipe working liquid distribution system.
  27. Gunter ; Charles E., Heat pipes for fin coolers.
  28. Goodman Lloyd Jack ; Chiu Chai-Pin ; Watwe Abhay W. ; Viswanath Ram, Heat sink with a heat pipe for spreading of heat.
  29. Maninder S. Sehmbey ; James P. Chen, Heat transfer device with a self adjusting wick and method of manufacturing same.
  30. Michael Philip Brownell ; James G. Maveety, Heatpipesink having integrated heat pipe and heat sink.
  31. Shun-lung Chao, Heatsink with embedded heat pipe for thermal management of CPU.
  32. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  33. Crowe Lawrence E. (Lindenwood IL), Hermetically sealed modular electronic cold plate utilizing reflux cooling.
  34. Fitch John S. (Newark CA), High performance substrate, electronic package and integrated circuit cooling process.
  35. Rosenfeld John H. (Lancaster PA) Keller Robert F. (Lancaster PA), High permeability heat pipe wick structure.
  36. Fitch John S. ; Hamburgen William R., Independently mounted cooling fins for a low-stress semiconductor package.
  37. Paterson Robert W. (Seneca SC), Integrated circuit cooling device having internal cooling conduit.
  38. Dussinger Peter M. ; Myers Thomas L., Integrated circuit heat pipe heat spreader with through mounting holes.
  39. Patel Janak G., Integrated heatsink and heatpipe.
  40. Calhoun Leslie D. (Creve Coeur MO) Peeples Marion E. (Florissant MO), Inverted meniscus heat pipe.
  41. Lomolino ; Sr. Paul A. (Danville CA) Lomolino ; Jr. Paul A. (Tracy CA) Lean Grace A. (Livermore CA) Burns Patricia L. (San Jose CA), Method and apparatus for a self contained heat exchanger.
  42. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Method for an integrated circuit thermal grease mesh structure.
  43. McCullough Kevin A., Method of forming a phase change heat sink.
  44. Masami Ikeda JP; Masaaki Yamamoto JP; Tatsuhiko Ueki JP; Ken Sasaki JP, Method of manufacturing plate type heat pipe.
  45. Phillips, Fred A. L., Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator.
  46. Davidson Howard L. (San Carlos CA) Ettehadieh Ehsan (Albany CA) Schulte John (Mountain View CA), Optimized integral heat pipe and electronic circuit module arrangement.
  47. Ueki Tatsuhiko,JPX ; Yamamoto Masaaki,JPX ; Ikeda Masami,JPX, Plate type heat pipe and a cooling system using same.
  48. Ikeda Masami,JPX ; Yamamoto Masaaki,JPX ; Sho Hitoshi,JPX ; Ueki Tatsuhiko,JPX, Plate type heat pipe and cooling structure using it.
  49. Ferro Armand P. (Schenectady NY) Harnden ; Jr. John D. (Schenectady NY) McLaughlin Michael H. (Scotia NY), Power module with isolated substrates cooled by integral heat-energy-removal means.
  50. Mohammad A. Tantoush, Scalable and modular heat sink-heat pipe cooling system.
  51. Voboril Bohuslav (Prague CS) Reichel Pavel (Prague CS) Kafunek Pavel (Prague CS), Semi conductor cooling system.
  52. Hamburgen William R. (Palo Alto CA) Fitch John S. (Newark CA) Jouppi Norman P. (Palo Alto CA), Thermosiphon for cooling a high power die.
  53. Thomas Daniel Lee, Thin planar heat spreader.
  54. Thomas Daniel Lee, Thin, planar heat spreader.
  55. Larson Ralph I. ; Phillips Richard L., Two phase component cooler.
  56. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.
  57. Joseph T. Dibene, II ; Farhad Raiszadeh, Vapor chamber with integrated pin array.
  58. Grote Michael G. (Maryland Heights MO), Wick-fin heat pipe.

이 특허를 인용한 특허 (5)

  1. Yang, Hongwu, Heat radiation device for a lighting device.
  2. Martinez, Paul A.; Tsai, Ming Y.; Centola, Federico P.; Schauer, Martin; Lam, Cheung-Wei; Sauers, Jason C., Magnetic field containment inductors.
  3. Yang, Hongwu, Passive heat radiator and streetlight heat radiating device.
  4. Chin, Chi-Te, Quick temperature-equlizing heat-dissipating device.
  5. Ghioni, Lincoln Matthew; Luo, Shi, Thermal management devices, systems and methods.
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