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An aqueous substrate surface treatment composition includes cysteine and an acidic solution having a pH of about 7 or less. The composition enables a selective deposition of a metal ion sensitizer and a subsequent selective plating of a metallic cap layer. Various CoWP plating bath compositions are

An aqueous substrate surface treatment composition includes cysteine and an acidic solution having a pH of about 7 or less. The composition enables a selective deposition of a metal ion sensitizer and a subsequent selective plating of a metallic cap layer. Various CoWP plating bath compositions are also provided which may be used to form the cap layer.

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What is claimed is: 1. An aqueous CoWP plating bath composition, comprising: a cobalt salt; a reducing agent; a metal chelator; a buffer; and a tungstate salt; wherein a ratio of molar concentrations of the cobalt salt to the reducing agent is from about 1:3 to about 1:5, and a ratio of molar conce

What is claimed is: 1. An aqueous CoWP plating bath composition, comprising: a cobalt salt; a reducing agent; a metal chelator; a buffer; and a tungstate salt; wherein a ratio of molar concentrations of the cobalt salt to the reducing agent is from about 1:3 to about 1:5, and a ratio of molar concentrations of the cobalt salt to the metal chelator is from about 1:2.5 to about 1:3.5, wherein at least one of the (i) reducing agent and (ii) metal chelator comprises an alkali metal. 2. The composition of claim 1, wherein the reducing agent comprises a hypophosphite salt. 3. The composition of claim 2, wherein the hypophosphite salt is selected from a group consisting of H3PO2, NaH2PO2, KH2PO2, or NH4H2PO2. 4. The composition of claim 1, wherein the metal chelator comprises a citrate salt. 5. The composition of claim 4, wherein the citrate salt is selected from a group consisting of H3C6H5O7, Na3C6H5O7, K3C6H5O7 or (NH4)3C6H5O7. 6. The composition of claim 1, wherein the buffer is selected from a group consisting of H3BO3, ethanolamine, TAPS, bicine, or CHES. 7. The composition of claim 1, wherein: the cobalt salt is selected from a group consisting of CoSO4, CoCl2 or Co(OH)2; the reducing agent comprises a hypophosphite salt selected from a group consisting of H3PO2, NaH2PO2, KH2PO2, or NH4H2PO2; the metal chelator comprises a citrate salt selected from a group consisting of H3C6H5O7, Na3C6H5O7, K3C6H5O7 or (NH4)3C6H5O7; the buffer is selected from a group consisting of H3BO3, ethanolamine, TAPS, bicine, or CHES; and the tungstate salt is selected from a group consisting of Na2WO4, K2WO4, or (NH4)2 WO4. 8. An aqueous CoWP plating bath composition, comprising a cobalt salt selected from a group consisting of CoSO4 or Co(OH)2; a reducing agent comprising a hypophosphite salt selected from a group consisting of H3PO2 or NH4H2PO2; a metal chelator comprising (NH4)3C6H5O7; a buffer selected from a group consisting of H3BO3, ethanolamine, TAPS, bicine, or CHES; and a tungstate salt comprising (NH4)2WO4; wherein a ratio of molar concentrations of the cobalt salt to the reducing agent is from about 1:3 to about 1:5, and a ratio of molar concentrations of the cobalt salt to the metal chelator is from about 1:2.5 to about 1:3.5; wherein the composition comprises cysteine; and wherein the composition comprises an alkali-free bath solution. 9. An aqueous CoWP plating bath composition, comprising: from about 0.03 to about 0.15 M Co(OH)2; from about 0.05 to about 0.3 M H3PO2; from about 0.1 to about 0.5 M Na3C6H5O7; from about 0.3 to about 0.6 M H3BO3; and from about 0.01 to about 0.08 M Na2WO4; wherein the composition has a pH of about 8.0 to about 10.0 at a temperature from about 65 to about 85° C. 10. An aqueous CoWP plating bath composition, comprising: from about 0.03 to about 0.15 M Co(OH)2 from about 0.05 to about 0.3 M H3PO2; from about 0.1 to about 0.5 M (NH4)3C6H5O7; from about 0.3 to about 0.6 M H3BO3; and from about 0.01 to about 0.08 M H2WO4 wherein the composition has a pH of about 8.0 to about 10.0 at a temperature from about 70 to about 85° C.; and wherein the composition comprises cysteine. 11. The composition of claim 1, further comprising cysteine. 12. The composition of claim 9, further comprising cysteine.