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A bond pad for an electronic device such as an integrated circuit makes electrical connection to an underlying device via an interconnect layer. The bond pad has a first layer of a material that is aluminum and copper and a second layer, over the first layer, of a second material that is aluminum an

A bond pad for an electronic device such as an integrated circuit makes electrical connection to an underlying device via an interconnect layer. The bond pad has a first layer of a material that is aluminum and copper and a second layer, over the first layer, of a second material that is aluminum and is essentially free of copper. The second layer functions as a cap to the first layer for preventing copper in the first layer from being corroded by residual chemical elements. A wire such as a gold wire may be bonded to the second layer of the bond pad.

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What is claimed is: 1. An electronic device comprising: a bond pad, the bond pad comprising: a metal portion for making electrical contact from above; a first conductive layer overlying the metal portion and in contact with the metal portion, the first conductive layer being a barrier by protecting

What is claimed is: 1. An electronic device comprising: a bond pad, the bond pad comprising: a metal portion for making electrical contact from above; a first conductive layer overlying the metal portion and in contact with the metal portion, the first conductive layer being a barrier by protecting the underlying metal portion from diffusing into overlying materials; a second conductive layer of a first material overlying and in contact with the first conductive layer, the first material comprising aluminum and copper; and a third conductive layer of a second material over and in contact with the second conductive layer, the second material comprising aluminum and being essentially free of copper, and comprising at least palladium, wherein the palladium is less than 1% by weight; and a wire or conductive ball in direct contact with the third conductive layer. 2. The electronic device of claim 1 wherein the first material comprises at least 95% aluminum by weight and less than 1% copper by weight. 3. The electronic device of claim 1 wherein the second material comprises at least 98% aluminum by weight. 4. The electronic device of claim 1 wherein the second material is at least 99.9% aluminum by weight. 5. The electronic device of claim 1 further comprising: a substrate; a transistor formed within and above the substrate, all of the transistor underlying the metal portion in a lateral direction; and one or more interconnect layers overlying the substrate for making electrical contact from the transistor to the metal portion. 6. The electronic device of claim 1 further comprising: a substrate; a transistor formed within and above the substrate; and one or more interconnect layers overlying the substrate for making electrical contact to the transistor, wherein at least one of the one or more interconnect layers comprises the metal portion. 7. The electronic device of claim 6 wherein the wire comprises at least 99% gold by weight. 8. The electronic device of claim 1 further comprising: a plurality of interconnect layers underlying the metal portion and comprising a plurality of vias; and a transistor comprising a gate connected to one of the plurality of vias. 9. A method of forming an electronic device, the method comprising: forming a metal portion for making electrical contact from above; forming a first conductive layer overlying the metal portion and in contact with the metal portion, the first conductive layer being a barrier by protecting the underlying metal portion from diffusing into overlying materials; forming a second conductive layer of a bond pad, the first layer being of a first material and overlying and being in contact with the first conductive layer, the first material comprising aluminum and copper; and forming a third conductive layer of the bond pad over and in contact with the second conductive layer, the third conductive layer being of a second material, the second material comprising aluminum, the second material being essentially free of copper and comprising at least palladium, wherein the palladium is less than 1% by weight. 10. The method of claim 9 wherein the first material comprises at least 95% aluminum by weight and less than 1% copper by weight. 11. The method of claim 10 wherein the second material comprises at least 98% aluminum by weight. 12. The method of claim 10 wherein the second material is at least 99.9% aluminum by weight. 13. The method of claim 10 further comprising: providing a substrate; forming a transistor within and above the substrate; forming one or more interconnect layers overlying the substrate for making electrical contact to the transistor, wherein at least one of the one or more interconnect layers comprises the metal portion; and bonding a wire to the conductive layer of the bond pad. 14. The method of claim 13 wherein the wire is at least 99% gold by weight. 15. The method of claim 9 further comprising: providing a substrate; forming a transistor within and above the substrate, all of the transistor underlying the metal portion in a lateral direction; and forming one or more interconnect layers overlying the substrate for electrically contacting the transistor to the metal portion. 16. The method of claim 9 further comprising: forming a transistor comprising a semiconductor material; and forming an interconnect layer over the transistor, the interconnect layer comprising an electrically conductive interconnect having a plurality of vias; wherein the bond pad is electrically coupled to the electrically conductive interconnect. 17. The method of claim 9 wherein: the forming the first conductive layer of the bond pad comprises forming the first conductive layer over a wafer; the forming the second conductive layer of the bond pad comprises forming a second conductive layer of the first material over the wafer; the forming the third conductive layer of the bond pad comprises forming a third conductive layer of the second material over the second conductive layer of the first material over the wafer; the forming the first conductive layer of the bond pad comprises patterning the first conductive layer over the wafer after the forming the second and the third conductive layers over the wafer; the forming the second conductive layer of the bond pad comprises patterning the second conductive layer of the first material over the wafer after the forming the third conductive layer of the second material over the second conductive layer of the first material over the wafer; and the forming the third conductive layer of the bond pad comprises patterning the third conductive layer of the second material over the second conductive layer of the first material over the wafer. 18. A method of forming an electronic device comprising: forming a bond pad, the bond pad comprising a metal portion for making electrical contact from above, a conductive barrier layer overlying the metal portion for preventing the metal portion from diffusing into overlying materials, a first layer of a first material, the first material comprising at least 95% aluminum by weight, the first material comprising copper, the bond pad comprising a second layer of a second material over the first layer, the second material is of a different composition than the first material, the second material having a composition of: 1) at least 95% aluminum by weight and comprising at least palladium in less than 1% by weight; bonding a wire to the second layer of the bond pad; and forming a transistor underlying the bond pad, all of the transistor underlying the metal portion in a lateral direction.