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Noise canceling technique for frequency synthesizer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H03L-007/00
출원번호 UP-0803602 (2007-05-15)
등록번호 US-7656236 (2010-03-31)
발명자 / 주소
  • Williams, Anthony David
출원인 / 주소
  • Teledyne Wireless, LLC
대리인 / 주소
    K & L Gates LLP
인용정보 피인용 횟수 : 7  인용 특허 : 272

초록

A frequency synthesizer is disclosed. According to one embodiment, the frequency synthesizer includes an input terminal and an output terminal, a loop filter, a digital phase detector, and an analog phase detector. The digital phase detector includes a first input coupled to the input terminal, a se

대표청구항

The invention claimed is: 1. A frequency synthesizer, comprising: an input terminal and an output terminal; a loop filter having a differential input; a digital phase detector comprising a first input coupled to the input terminal, a second input coupled to the output terminal, and an output couple

이 특허에 인용된 특허 (272)

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  189. Radermacher Wilhelm (Sindelfingen-Maichingen DEX) Czech Johannes (Allmersbach im Tal DEX), Operating point-stabilized linearized traveling wave tube amplifier.
  190. Kegasa,Koyo; Manabe,Chitaka, Oscillator including phase frequency detectors for detecting a phase difference between two input signals and outputting a control command signal.
  191. Schonberg Peter R. (Scotts Valley CA), Oxidizing enhancement electron beam process and apparatus for contaminant treatment.
  192. Sano, Hiromi; Suzuki, Masatoshi, Oxygen concentration sensor.
  193. Ruka Roswell J. (Pittsburgh PA) Basel Richard A. (Pittsburgh PA), Oxygen sensor for monitoring gas mixtures containing hydrocarbons.
  194. Toshifumi Nakatani JP; Hisashi Adachi JP; Hiroaki Kosugi JP; Yuji Saito JP; Shunsuke Hirano JP; Hiroshi Haruki JP, PLL frequency synthesizer.
  195. Shiga Nobuo,JPX, Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board.
  196. Silagi Edward G. (Cedar Rapids IA) Heidt Marvin W. (Cedar Rapids IA), Phase adjusted feedforward error correction.
  197. Silagi Edward G. (Cedar Rapids IA), Phase adjusted feedforward system utilizing a single amplitude/phase equalizer.
  198. Hagino Hideyuki (Fukaya JPX) Kusano Takahiro (Kumagaya JPX), Phase equalizing active filter.
  199. Kim, Sang-Young; Jun, Pil-Jae, Phase locked loop circuit for a fractional-N frequency synthesizer.
  200. Welland, David R.; Wang, Caiyi, Phase locked loop circuitry for synthesizing high-frequency signals and associated method.
  201. Silagi Edward G. (Cedar Rapids IA), Phase shift network with minimum amplitude ripple.
  202. Ishigaki Yukinobu (Machide JPX), Phase-locked loop circuit.
  203. Kazunori Ando JP; Shoichi Takahashi JP; Hiroshi Naka JP, Photo-electronic device and method of producing the same.
  204. Cuomo Jerome J. (Lincolndale NY) Guarnieri Charles R. (Somers NY), Photoelectric enhanced plasma glow discharge system and method including radiation means.
  205. Glenn Thomas P., Plastic package for an optical integrated circuit device and method of making.
  206. Wakefield Gene F. (Plano TX), Plastic packaging of microelectronic circuit devices.
  207. Eisenberg John A. ; Baskin Brian L. ; Robertson ; III Charles Stuart ; Statezni Dieter Werner ; Mucenieks Lance Todd ; Brubaker David Lee, Polar envelope correction mechanism for enhancing linearity of RF/microwave power amplifier.
  208. Brodsky William L. (Binghamton NY) Herard James D. (Vestal NY), Portable external flexible cable and package using same.
  209. Brainard ; II Edward C. (Marion MA), Portable memory module.
  210. Greenberg Lawrence Arnold, Power and ground and signal layout for higher density integrated circuit connections with flip-chip bonding.
  211. Whartenby, James C.; Kumar, Mahesh, Predistortion circuit with feedback.
  212. McGalliard James D. (11171 Fenwick Pl. Santa Ana CA 92705), Printed circuit fuse assembly.
  213. Johnson Jodie V. (Alachua County FL) Pedder Randall E. (Allegheny County PA) Yost Richard A. (Alachua County FL) Story Michael S. (Santa Clara County CA), Quadrupole ion trap mass spectrometer having two pulsed axial excitation input frequencies and method of parent and neut.
  214. Wells Gregory J. (Fairfield CA), Quadrupole trap improved technique for collisional induced disassociation for MS/MS processes.
  215. Wells Gregory J. (Fairfield CA), Quadrupole trap improved technique for ion isolation.
  216. Wagner Gene A. (Torrance CA) Newberg Irwin L. (Northridge CA), RF amplifier with frequency spectrum control.
  217. Riggs Denton D. (Rancho Palos Verdes CA) Wagner Gene A. (Torrance CA), Radar system having amplitude and phase modulation and demodulation circuits.
  218. Cornelissen Hugo J.,NLX ; Savert Cornelis J.,NLX ; Leijten Johannes T.H.,NLX, Rapidly scanning cathode-ray tube laser.
  219. Cornelissen Hugo J.,NLX ; Van Rosmalen Gerard E.,NLX ; Savert Cornelis J.,NLX ; Vrijssen Gerardus A. H. M.,NLX, Rapidly scanning cathode-ray tube laser.
  220. Szmurlo Thomas E. ; Radich Mitchell F. ; Guthrie Warren E., Reduction of second order harmonic distortion in high power TWT amplifiers.
  221. Reinhold Albert (Wunstorf DEX), Roentgen lithography method and apparatus.
  222. Wittry David B. (Pasadena CA), Rotating anode x-ray source and cooling technique therefor.
  223. Terashima Kazuhiko,JPX, Semiconductor device for preventing exfoliation from occurring between a semiconductor chip and a resin substrate.
  224. Nagayoshi Shinsuke (Itami JPX), Semiconductor device package.
  225. Ikeda Hironobu,JPX, Semiconductor device package having a connection substrate with turned back leads and method thereof.
  226. Kobayashi Kenzi (Tokyo JPX) Mori Hajime (Tokyo JPX) Yamaguti Yukio (Tokyo JPX), Semiconductor device package having locating mechanism for properly positioning semiconductor device within package.
  227. Tazima Akira (Beppu JPX), Semiconductor device package with circuit board and resin.
  228. Umehara Norito (Oita JPX), Semiconductor device package with small die pad and method of making same.
  229. Ohuchi Shinji,JPX, Semiconductor device packaged in plastic and mold employable for production thereof.
  230. Tamaki Kazuo,JPX ; Saza Yasuyuki,JPX ; Dotta Yoshihisa,JPX, Semiconductor device using a chip scale package.
  231. Sakamoto Akira,JPX, Semiconductor device with improved leads.
  232. Oga Toshiyuki,JPX, Semiconductor microwave amplifier.
  233. Tanaka Akira (Katsuta JPX) Yamada Kazuji (Hitachi JPX) Inoue Hirokazu (Ibaraki JPX) Arakawa Hideo (Hitachi JPX) Okamoto Masahide (Hitachi JPX), Semiconductor package and computer using it.
  234. Chien-Ping Huang TW, Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention.
  235. Kirkman Scott, Semiconductor package with traces routed underneath a die.
  236. Akagawa Masatoshi (Nagano JPX), Semiconductor-device package and semiconductor device.
  237. Weyl Helmut,DEX ; Fries Romuald,DEX ; Pelz Frank,DEX, Sensor.
  238. Kirchnavy Steve ; Thompson Robert, Sensor cell holder for gas analyzer.
  239. Paulus Nancy Jean ; Duce Richard William ; Touse-Shunkwiler Sara Ann ; Fournier Robert Gregory, Sensor with glass seal.
  240. Riggs Denton D. (Rancho Palos Verdes CA) Wagner Gene A. (Torrance CA), Simultaneous transmit and receive radar subsystem.
  241. Apel, Thomas R., Singly terminated distributed amplifier.
  242. Apel Thomas R. (Cedar Rapids IA), Singly terminated push-pull distributed amplifier.
  243. Asija Ajay (Brighton NY), Small, low-pass filter for high power applications.
  244. Farnworth Warren M. ; Wood Alan G. ; Brooks Mike, Stacked semiconductor package and method of fabrication.
  245. Gorowitz Bernard (Clifton Park NY) Becker Charles A. (Schenectady NY) Guida Renato (Wynantskill NY) Gorczyca Thomas B. (Schenectady NY) Rose James W. (Guilderland NY), Structure for protecting air bridges on semiconductor chips from damage.
  246. Wu, Chi-Chuan; Her, Tzong-Dar, Super low profile package with stacked dies.
  247. Chen Tong ; Goren Yehuda G., System and method for linearizing vacuum electronic amplification.
  248. Chen, Tong; Goren, Yehuda G., System and method for linearizing vacuum electronic amplification.
  249. Yehuda G. Goren ; Charles E. Jensen ; Donald R. Gagne ; Philip M. Lally ; David Zavadil, System and method for noise and spurious suppression in power amplifier systems.
  250. David Danielsons, System and method for predistorting signals to be amplified.
  251. Pankow Richard J. (Norwalk CT), TWT grid circuit utilizing feedback.
  252. Marshall Alan G. (Columbus OH) Ricca Tom L. (Columbus OH) Wang Tao-Chin L. (Rockville MD), Tailored excitation for trapped ion mass spectrometry.
  253. Dordi Yezdi N., Tape ball grid array package with perforated metal stiffener.
  254. Makimoto Mitsuo (Kawasaki JPX) Yamashita Sadahiko (Kawasaki JPX), Temperature compensated coaxial resonator having inner, outer and intermediate conductors.
  255. Kanatani Fumiyoshi (Kobe JPX) Matsui Shigetomo (Higashiosaka JPX) Atsuta Toshio (Kobe JPX) Yamada Takeshi (Kobe JPX) Mori Eisuke (Tokyo JPX) Araki Toshiaki (Kobe JPX), Thermoplastic method of reducing the diameter of a metal tube.
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  258. Matthews Stephen M. (Alamed County CA) Schonberg Russell G. (Santa Clara County CA) Fadness David R. (Santa Clara County CA), Toxic remediation.
  259. Iwatsuki Masanori,JPX ; Sato Shouichi,JPX ; Hayasaka Kouichi,JPX ; Shibuya Yasuhiro,JPX, Transmitter apparatus with linearizing circuit to compensate for distortion in power amplifier.
  260. Wiehler Wolf (Neubiberg DEX), Traveling wave tube and method of making same.
  261. Katz Allen (Robbinsville NJ) Wolkstein Herbert J. (Livingston NJ) Meighan ; III James J. (Hamilton Square NJ), Travelling-wave tube protection arrangement.
  262. Pritchard Eric K., Tube amplifier fat emulation structure.
  263. Starai Terrence M. (Bensenville IL) Champlin ; Jr. John H. (Hoffman Estates IL) Johnson Randall J. (Bloomingdale IL), UHF Filter assembly.
  264. Takasaki Yoshitaka (Tokorozawa JA) Maeda Narimichi (Kodaira JA) Nakagawa Jun\ichi (Saitama JA) Ishizuka Kohei (Hachioji JA) Kita Yasuhiro (Hachioji JA), Variable equalizer.
  265. Smith Hal D. (Rancho Palos Verdes CA) McClanahan Robert F. (Valencia CA) Shapiro Andrew A. (Orange CA) Pelzman George (Segundo CA), Via capacitors within multi-layer, 3 dimensional structures/substrates.
  266. Heckaman Douglas (Indialantic FL) Vought Ronald (Melbourne FL) Caraway Edward (Indialantic FL), Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies.
  267. Huang Marshall Y. (Rancho Palos Verdes CA), Wideband, phase compensated amplifier with negative feedback of distortion components in the output signal.
  268. McKay Thomas G., Wire-bond free input/output interface for GaAs ICs with means of determining known good die.
  269. LaFiandra Carlo (New Canaan CT) Hughes Gregory P. (Norwalk CT), X-ray anode assembly.
  270. Skillicorn Brian (Saratoga CA) Fellingham George H. (San Jose CA) Loeffler Peter E. (Los Gatos CA), X-ray source.
  271. Wang Chia-Gee (Millwood NY), X-ray tube and microelectronics alignment process.
  272. Anderson Weston A. (763 LaPara Ave. Palo Alto CA 94306) Arnold James T. (778 Blanchard Way Sunnyvale CA 94087) Lavering Gordon R. (4111 Skymont Dr. Belmont CA 94002) Duffield Jack J. (878 Helena Dr. , X-ray tube having rotary anode cooled with high thermal conductivity fluid.

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