|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||438/455; 438/106; 257/E23.001|
|발명자 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 3 인용 특허 : 0|
Methods of wafer-to-wafer bonding are disclosed. These methods use a force-transposing substrate providing redistribution of the applied force to the local bonding areas across the wafer. Certain versions of the Present Invention also provide a compliant force-distributing member along with applying bonding material to bonding areas in select locations. A predetermined sequence of external force loading and temperature steps ensure creating bonds between the wafers in the bonding areas. The disclosed methods improve wafer bonding, by increasing its unifo...
We claim: 1. A method of wafer to wafer bonding comprising the steps of: providing at least two wafers to be bonded; providing at least one force-transposing substrate comprising a connecting substrate and transposers having contacting areas and having the thickness larger than the thickness of the connecting substrate; applying bonding material to at least one of the wafers and creating predetermined bonding areas in selected locations; aligning at least two wafers for bonding and at least one force-transposing substrate; providing a predetermined sequ...