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Electronic apparatus and methods of forming the electronic apparatus include a conductive layer having a layer of ruthenium in contact with a lanthanide oxide dielectric layer for use in a variety of electronic systems. The lanthanide oxide dielectric layer and the layer of ruthenium may be structur

Electronic apparatus and methods of forming the electronic apparatus include a conductive layer having a layer of ruthenium in contact with a lanthanide oxide dielectric layer for use in a variety of electronic systems. The lanthanide oxide dielectric layer and the layer of ruthenium may be structured as one or more monolayers. The lanthanide oxide dielectric layer and the layer of ruthenium may be formed by atomic layer deposition.

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What is claimed is: 1. A method of forming an electronic device, the method comprising: forming a lanthanide oxide layer by atomic layer deposition; forming a ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallizatio

What is claimed is: 1. A method of forming an electronic device, the method comprising: forming a lanthanide oxide layer by atomic layer deposition; forming a ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient, wherein forming the lanthanide oxide layer by atomic layer deposition includes using a Ln(thd)3 (thd =2,2,6,6-tetramethyl-3,5-heptanedione) precursor in the atomic layer deposition. 2. A method of forming an electronic device, the method comprising: forming a lanthanide oxide layer by atomic layer deposition; forming a ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient wherein forming a ruthenium-based conductive layer using atomic layer deposition includes using a Ru(od)3 (od =octane-2,4-dionate)/m-butyl-acetate solution in the atomic layer deposition. 3. A method of forming an electronic device, the method comprising: forming a lanthanide oxide layer by atomic layer deposition; forming a ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient, wherein forming a ruthenium-based conductive layer using atomic layer deposition includes using a bis(ethylcyclopentadienyl)ruthenium precursor in the atomic layer deposition. 4. The method of claim, A method of forming a memory device, the method comprising: forming a memory array in a substrate including: forming a lanthanide oxide layer by atomic layer deposition in an integrated circuit in the substrate; forming a ruthenium-based conductive layer such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed in the integrated circuit; and annealing the metallization, the lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient; and forming circuitry to access the memory array, wherein forming a lanthanide oxide layer by atomic layer deposition includes using a Ln(thd)3 (thd =2,2,6,6-tetramethyl-3,5-heptanedione) precursor in the atomic layer deposition. 5. A method of forming a memory device, the method comprising: forming a memory array in a substrate including: forming a lanthanide oxide layer by atomic layer deposition in an integrated circuit in the substrate; forming a ruthenium-based conductive layer such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed in the integrated circuit; and annealing the metallization, the lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient; and forming circuitry to access the memory array, wherein forming a ruthenium-based conductive layer includes using a Ru(od)3 (od =octane-2,4-dionate)/m-butyl-acetate solution in atomic layer deposition. 6. A method of forming an electronic system, the method comprising: providing a controller; coupling an integrated circuit to the controller, wherein one or more of the controller or the integrated circuit includes a lanthanide oxide contacting a ruthenium-based conductive layer, wherein forming the lanthanide oxide contacting the ruthenium-based conductive layer includes: forming the lanthanide oxide layer by atomic layer deposition; forming the ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient wherein forming the lanthanide oxide layer by atomic layer deposition includes using a Ln(thd)3 (thd =2,2,6,6-tetramethyl-3,5-heptanedione) precursor in the atomic layer deposition. 7. A method of forming an electronic system, the method comprising: providing a controller; coupling an integrated circuit to the controller, wherein one or more of the controller or the integrated circuit includes a lanthanide oxide contacting a ruthenium-based conductive layer, wherein forming the lanthanide oxide contacting the ruthenium-based conductive layer includes: forming the lanthanide oxide layer by atomic layer deposition; forming the ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient wherein forming the ruthenium-based conductive layer using atomic layer deposition includes using a Ru(od)3 (od =octane-2,4-dionate)/m-butyl-acetate solution in the atomic layer deposition. 8. A method of forming an electronic system, the method comprising: providing a controller; coupling an integrated circuit to the controller, wherein one or more of the controller or the integrated circuit includes a lanthanide oxide contacting a ruthenium-based conductive layer, wherein forming the lanthanide oxide contacting the ruthenium-based conductive layer includes: forming the lanthanide oxide layer by atomic layer deposition; forming the ruthenium-based conductive layer using atomic layer deposition such that ruthenium contacts the lanthanide oxide layer; forming metallization to a device in which the lanthanide oxide layer and the ruthenium-based conductive layer are disposed; and annealing the metallization, lanthanide oxide layer, and the ruthenium-based conductive layer in a H2 ambient wherein forming the ruthenium-based conductive layer using atomic layer deposition includes using a bis(ethylcyclopentadienyl)ruthenium precursor in the atomic layer deposition.