초록 ▼

An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of sai

An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of said second transistor is electrically connected to said one or more common source-drain leads, and a first clip attached to the drain of said first transistor and electrically connected to said one or more common source-drain leads. In another embodiment a partially encapsulated power quad flat no-lead package having an exposed top thermal drain clip which is substantially perpendicular to said with a folded stud exposed top thermal drain clip, and an exposed thermal source pad.

대표청구항 ▼

The invention claimed is: 1. A partially encapsulated semiconductor package having a top clip with an exposed top surface and a plurality of folded bent portions which are substantially perpendicular to said exposed top surface of said thermal clip, and a leadframe structure having separate segment

The invention claimed is: 1. A partially encapsulated semiconductor package having a top clip with an exposed top surface and a plurality of folded bent portions which are substantially perpendicular to said exposed top surface of said thermal clip, and a leadframe structure having separate segments wherein all of said plurality of folded bent portions are in contact with only one of said segments. 2. The package of claim 1 wherein said top clip has one or more cutouts on one or more top side edges which are filed in with encapsulating material. 3. The package of claim 1 further including a semiconductor device attached to said clip and to said leadframe structure. 4. A method of making a partially encapsulated semiconductor package comprising the steps of: providing a coplanar leadframe structure having a control segment, a first high current segment and a second high current segment to form three separate segments; attaching a semiconductor device to said control segment and said first current segment; attaching a clip to a side of said semiconductor device opposite said leadframe structure, said clip having a plurality of bent portions attached to said second high current segment; and partially encapsulating said leadframe structure, said semiconductor device, and said clip with molding material to form said package. 5. The method set forth in claim 4 wherein each of said three segments are formed with a thicker portion and a thinner portion. 6. The method set forth in claim 4 wherein each of said bent portions of said clip have bifurcated ends. 7. The method set forth in claim 6 wherein each of said bifurcated ends terminate in a rounded portion. 8. The method set forth in claim 4 wherein said clip is half etched. 9. The method set forth in claim 4 wherein said clip is formed with cutout portions. 10. The method set forth in claim 9 wherein said encapsulation material fills said cutout portions. 11. The method set forth in claim 4 said encapsulation material does not cover a top surface of said clip. 12. The method set forth in claim 5 wherein said encapsulation material does not cover a bottom surface of said thicker portions of said three segments. 13. A partially encapsulated semiconductor package comprising: a coplanar leadframe structure having a control segment, a first high current segment and a second high current segment; a semiconductor device attached to said control segment and said first current segment; a half etched clip attached to a side of said semiconductor device opposite said leadframe structure, said clip having a plurality of bent portions attached to said second high current segment; and encapsulating material that partially encapsulates said leadframe structure, said semiconductor device, and said clip with molding material to form said package. 14. The partially encapsulated semiconductor package set forth in claim 13 wherein said control segment, said first high current segment, and said second high current segment are formed with a thicker portion and a thinner portion. 15. The partially encapsulated semiconductor package set forth in claim 13 wherein each of said bent portions of said half etched clip have bifurcated ends. 16. The partially encapsulated semiconductor package set forth in claim 15 wherein each of said bifurcated ends terminate in a rounded portion. 17. The partially encapsulated semiconductor package set forth in claim 13 wherein said half etched clip is formed with cutout portions. 18. The partially encapsulated semiconductor package set forth in claim 17 wherein said encapsulation material fills said cutout portions. 19. The partially encapsulated semiconductor package set forth in claim 13 said encapsulation material does not cover a top surface of said half etched clip. 20. The partially encapsulated semiconductor package set forth in claim 14 wherein said encapsulation material does not cover a bottom surface of said thicker portions of said three segments.