초록 ▼

Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communication with first and second electrodes, at least one of which is s

Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communication with first and second electrodes, at least one of which is spaced apart from the workpiece. A polishing liquid is disposed between the polishing surface and the workpiece and at least one of the workpiece and the polishing surface is moved relative to the other. Material is removed from the microfeature workpiece and at least a portion of the polishing liquid is passed through at least one recess in the polishing surface so that a gap in the polishing liquid is located between the microfeature workpiece and the surface of the recess facing toward the microfeature workpiece.

대표청구항 ▼

I claim: 1. An apparatus for removing material from a microfeature workpiece, comprising: a support member configured to releasably carry a microfeature workpiece at a polishing position; first and second electrodes positioned to conduct electrical current to a microfeature workpiece when the micro

I claim: 1. An apparatus for removing material from a microfeature workpiece, comprising: a support member configured to releasably carry a microfeature workpiece at a polishing position; first and second electrodes positioned to conduct electrical current to a microfeature workpiece when the microfeature workpiece is carried by the support member, at least one of the first and second electrodes being spaced apart from the microfeature workpiece when the microfeature workpiece is carried by the support member; a polishing medium disposed between the at least one electrode and the support member, at least one of the polishing medium and the support member being movable relative to the other, the polishing medium having a polishing surface, the polishing surface having a recess positioned to receive a polishing liquid, the recess having a recess surface facing the support member and spaced apart from the polishing surface to allow the polishing liquid in the recess to form a gap in the polishing liquid between the microfeature workpiece and the recess surface; and a processor having a machine-executable medium containing instructions that cause the processor to perform a method comprising controlling formation of the gap in the polishing liquid to achieve a target electropolishing rate for removing material from the microfeature workpiece. 2. The apparatus of claim 1, further comprising the microfeature workpiece. 3. The apparatus of claim 1, further comprising the polishing liquid. 4. The apparatus of claim 1 wherein the recess includes a plurality of intersecting recesses. 5. The apparatus of claim 1 wherein the recess includes a plurality of intersecting recesses with first recesses oriented transverse to second recesses. 6. The apparatus of claim 1 wherein the first and second electrodes are spaced apart from the microfeature workpiece when the microfeature workpiece is carried by the support member. 7. The apparatus of claim 1 wherein the recess has a dimension generally normal to the polishing surface of from about 0.5 mm to about ten mm. 8. The apparatus of claim 1 wherein the recess has a dimension generally normal to the polishing surface of from about two mm to about four mm. 9. The apparatus of claim 1 wherein the recess surface includes a surface of the at least one electrode. 10. The apparatus of claim 1 wherein the polishing surface faces upwardly. 11. The apparatus of claim 1, further comprising a source of electrical potential coupled to the first and second electrodes. 12. An apparatus for removing material from a microfeature workpiece, comprising: a support member configured to releasably carry and rotate a microfeature workpiece at a polishing position; first and second electrodes positioned proximate to the support member to conduct electrical current to the microfeature workpiece when the microfeature workpiece is carried by the support member, the first and second electrodes being spaced apart from the microfeature workpiece when the microfeature workpiece is carried by the support member; and a polishing pad material disposed between the first and second electrodes and the support member, the polishing pad material having a polishing surface with a plurality of first recesses and a plurality of second recesses intersecting the first recesses, the first and second recesses extending through the polishing pad material to expose surfaces of the first and second electrodes that face toward the support member, the first and second recesses being positioned to receive a polishing liquid with the polishing liquid forming a gap in the polishing liquid between the polishing position and the surfaces of the first and second electrodes; and a processor having a machine-executable medium containing instructions that cause the processor to perform a method comprising controlling formation of the gap in the polishing liquid to achieve a target electropolishing rate for removing material from the microfeature workpiece. 13. The apparatus of claim 12 wherein the first and second recesses are generally transverse to each other. 14. The apparatus of claim 12 wherein the recesses have a depth of from at least two mm to about four mm. 15. An apparatus for removing material from a microfeature workpiece, comprising: a support member configured to releasably carry a microfeature workpiece; a polishing pad having a polishing surface and a recess in the polishing surface, the polishing pad including a plurality of polishing pad portions, a first electrode, and a second electrode spaced apart from the first electrode by one of the polishing pad portions, the first and second electrodes being offset from the polishing surface, wherein a surface of at least one of the first and second electrodes and two adjacent polishing pad portions at least partially define the recess; and a processor having a machine-executable medium containing instructions that cause the processor to perform a method comprising: disposing a polishing liquid between the polishing surface and the microfeature workpiece; forming a gap in the polishing liquid at least partially in the recess and between the microfeature workpiece and the surface of at least one of the first and second electrodes; moving at least one of the microfeature workpiece and the polishing surface relative to the other; passing an electrical current through the first and second electrodes and the microfeature workpiece via the polishing liquid to remove material from the microfeature workpiece while the microfeature workpiece is in contact with the polishing surface; and controlling formation of the gap in the polishing liquid to achieve a target electropolishing rate for removing material from the microfeature workpiece. 16. The apparatus of claim 15 wherein the machine-executable medium contains further instructions that cause the processor to perform a method comprising controlling a rate of relative movement between the microfeature workpiece and the polishing surface to promote the formation of the gap. 17. The apparatus of claim 15 wherein the machine-executable medium contains further instructions that cause the processor to perform a method comprising controlling a rate of disposing the polishing liquid between the polishing surface and the microfeature workpiece to control the formation of the gap. 18. The apparatus of claim 15 wherein the machine-executable medium contains further instructions that cause the processor to perform a method comprising maintaining a rate of disposing the polishing liquid between the polishing surface and the microfeature workpiece below a threshold value to reduce a likelihood of completely filling the recess with the polishing liquid. 19. The apparatus of claim 15 wherein the machine-executable medium contains further instructions that cause the processor to perform a method comprising (a) removing at least a first portion of the material by electrochemical-mechanical polishing and (b) removing no material by direct electropolishing or removing a second portion less than the first portion by direct electropolishing. 20. The apparatus of claim 15, further comprising a source of electrical potential coupled to the first and second electrodes.