IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0861136
(2007-09-25)
|
등록번호 |
US-7670539
(2010-04-21)
|
우선권정보 |
KR-10-2005-0080158(2005-08-30) |
발명자
/ 주소 |
|
대리인 / 주소 |
Knobbe Martens Olson & Bear LLP
|
인용정보 |
피인용 횟수 :
2 인용 특허 :
5 |
초록
▼
The injection molding apparatus includes a cavity mold formed with a cavity surface for defining a cavity in which a molten injection material is injected, a core mold formed with a core surface for defining the cavity upon engagement with the cavity mold and installed to be movable forward and back
The injection molding apparatus includes a cavity mold formed with a cavity surface for defining a cavity in which a molten injection material is injected, a core mold formed with a core surface for defining the cavity upon engagement with the cavity mold and installed to be movable forward and backward to open or close the cavity by guidance of a guide pin, an injection unit for injecting a material into the cavity during an injection process, and an injection controller for controlling a hydraulic cylinder to move the core mold forward or backward and the injection unit to inject the material into the cavity.
대표청구항
▼
What is claimed is: 1. An apparatus for injection molding, the apparatus comprising: a first mold comprising a first cavity surface; and a second mold comprising: a heating plate comprising a second cavity surface opposing the first cavity surface, wherein the first and second cavity surfaces in co
What is claimed is: 1. An apparatus for injection molding, the apparatus comprising: a first mold comprising a first cavity surface; and a second mold comprising: a heating plate comprising a second cavity surface opposing the first cavity surface, wherein the first and second cavity surfaces in combination are configured to define a molding cavity with or without an additional surface, a cooling plate movable relative to the heating plate between a first position and a second position, and a heat-transfer enhancing layer integrated with either of the heating plate and the cooling plate so as to be interposed between the heating plate and the cooling plate, wherein the heat-transfer enhancing layer is formed of a material other than that of a portion of the cooling plate or the heating plate with which the heat-transfer enhancing layer is integrated, wherein the heat-transfer enhancing layer contacts both the heating plate and the cooling plate when the cooling plate is in the first position. 2. The apparatus of claim 1, wherein the heat-transfer enhancing layer is integrated with the cooling plate, wherein the heat-transfer enhancing layer comprises a surface facing the heating plate, wherein the surface contacts the heating plate when the cooling plate is in the first position, while not contacting the heating plate when the cooling plate is in the second position. 3. The apparatus of claim 1, wherein the heat-transfer enhancing layer is integrated with the heating plate, wherein the heat-transfer enhancing layer comprises a surface facing the cooling plate, wherein the surface contacts the cooling plate when the cooling plate is in the first position, while not contacting the cooling plate when the cooling plate is in the second position. 4. The apparatus of claim 1, wherein the material of the heat-transfer enhancing layer is softer than that of the material of the portion of the heating plate or the cooling plate. 5. The apparatus of claim 1, wherein the heat-transfer enhancing layer comprises at least one metal selected from the group consisting of gold, silver, copper, tin, lead and aluminum. 6. The apparatus of claim 1, wherein the heat-transfer enhancing layer comprises a grease layer coated on a surface of the cooling plate. 7. The apparatus of claim 1, wherein the heat-transfer enhancing layer comprises a grease layer coated on a surface of the heating plate. 8. The apparatus of claim 1, wherein the heating plate further comprises an electric heater embedded therein. 9. The apparatus of claim 1, wherein the first mold is movable relative to the cooling plate and further movable relative to the heating plate. 10. The apparatus of claim 1, wherein the first mold comprises a passage configured to flow a moldable material toward the cavity. 11. The apparatus of claim 1, wherein the first mold comprises: a second heating plate comprising the first cavity surface, a second cooling plate movable relative to the first heating plate between a third position and a fourth position, and a second heat-transfer enhancing layer integrated with either of the second heating plate and the second cooling plate so as to be interposed between the second heating plate and the second cooling plate, wherein the second heat-transfer enhancing layer is formed of a material other than that of a portion of the second cooling plate or the second heating plate with which the second heat-transfer enhancing layer is integrated, wherein the second heat-transfer enhancing layer contacts both the second heating plate and the second cooling plate when the second cooling plate is in the third position. 12. A method of injection molding, the method comprising: providing the injection molding apparatus of claim 1; moving the heating plate relative to the first mold so as to form the molding cavity between the first and second cavity surfaces with or without an additional surface; generating heat in the heating plate; injecting a moldable material into the molding cavity; moving the cooling plate relative to the heating plate such that the heat-transfer enhancing layer contacts the other of the heating plate and the cooling plate, thereby improving a heat-transfer contact between the heating plate and the cooling plate; and cooling the cooling plate so as to enhance heat-transfer from the heating plate to the cooling plate. 13. The method of claim 12, wherein the heat-transfer enhancing layer is integrated with the cooling plate. 14. The method of claim 12, wherein the heat-transfer enhancing layer is integrated with the heating plate. 15. The method of claim 12, wherein the material of the heat-transfer enhancing layer is softer than that of the material of the portion of the heating plate or the cooling plate. 16. The method of claim 12, wherein the heat-transfer enhancing layer comprises at least one metal selected from the group consisting of gold, silver, copper, tin, lead and aluminum. 17. The method of claim 12, wherein the heat-transfer enhancing layer comprises a grease layer coated on a surface of the cooling plate. 18. The method of claim 12, wherein the heat-transfer enhancing layer comprises a grease layer coated on a surface of the heating plate. 19. The method of claim 12, further comprising moving the cooling plate away from the heating plate after injecting the moldable material. 20. The method of claim 12, wherein the heating plate comprises an electrical heater embedded therein. 21. The apparatus of claim 1, wherein the cooling plate comprises a surface facing the heating plate, and wherein the heat-transfer enhancing layer covers throughout the surface of the cooling plate when the heat-transfer enhancing layer contacts the cooling plate.
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