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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
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Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | UP-0322347 (2002-12-17) |
등록번호 | US-7671295 (2010-04-21) |
발명자 / 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 | 피인용 횟수 : 7 인용 특허 : 174 |
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set
A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.
The invention claimed is: 1. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive cont
The invention claimed is: 1. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; and imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width and so that the sets have specified durations of less than 500 ns and sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 2. The method of claim 1 in which each set of laser output pulses has a duration of shorter than 200 nanoseconds. 3. The method of claim 2 in which each of the laser output pulses has a pulse width shorter than 25 picoseconds. 4. The method of claim 2 in which each of the laser output pulses has a pulse width of shorter than 10 picoseconds. 5. The method of claim 1 in which each of the laser output pulses has a pulse width shorter than 25 picoseconds. 6. The method of claim 1 in which each of the laser output pulses has a pulse width of shorter than 10 picoseconds. 7. The method of claim 6 in which each of the laser output pulses has a pulse width of shorter than 1 picosecond. 8. The method of claim 1 in which a time offset between initiation of at least two laser output pulses in the set is within about 5 to 1,000 ns. 9. The method of claim 1, in which a delay interval between respective sets is shorter than 0.1 millisecond. 10. The method of claim 1, in which at least two sets of laser output pulses are generated to sever respective links at a programmable repetition rate higher than 10 KHz. 11. The method of claim 1 in which a delay interval between respective sets is programmable. 12. The method of claim 1 in which the electrically conductive link is not covered by an overlying passivation layer. 13. The method of claim 1 in which the electrically conductive links are covered by an overlying passivation layer. 14. The method of claim 13 in which the overlying passivation layer is removed by a substantially nonthermal interaction between at least one of the laser output pulses and the overlying passivation layer. 15. The method of claim 13, wherein the electrically conductive link and the overlying passivation layer have a thickness and at least one of the first and second laser output pulses removes a depth material that is less than thickness of the electrically conductive link and the overlying passivation layer. 16. The method of claim 1 in which the link is removed by a substantially nonthermal interaction between at least one of the laser output pulses and the link. 17. The method of claim 1 in which at least one of the electrically conductive links comprises aluminum, chromide, copper, polysilicon, disilicide, gold, nickel, nickel chromide, platinum, polycide, tantalum nitride, titanium, titanium nitride, tungsten, or tungsten silicide. 18. The method of claim 1, further comprising generating harmonically-converted laser output pulses to a wavelength shorter than 850 nm. 19. The method of claim 1 in which the laser output pulses comprise at least one of the following wavelengths: about 262, 266, 349, 375-425, 355, 524, 532, or 750-850 nm. 20. The method of claim 1 in which each of the laser output pulses has a laser energy of about 0.01 microjoule-10 millijoules. 21. The method of claim 1 in which the spot sizes of the laser spots are the same. 22. The method of claim 1 in which at least each of the laser output pulses of the set has approximately the same energy and approximately the same peak power. 23. The method of claim 1 in which at least two of the laser output pulses of the set have different energies and different peak powers, and in which there is no temporal overlap of two consecutive ones of the laser output pulses in each set. 24. The method of claim 1 further comprising generating the laser output pulses from a CW-pumped, mode-locked, solid-state laser at an energy level of 0.005 microjoule to 1 microjoule per laser output pulse. 25. The method of claim 24 in which an optical gate device is employed to gate the set of laser output pulses from a mode-locked laser pulse train. 26. The method of claim 25 in which an amplifier device is employed to amplify the laser output pulses. 27. The method of claim 24 in which each set of laser output pulses has 2 to 50 pulses and in which each of the laser output pulses has a pulse width shorter than 25 picoseconds. 28. The method of claim 27 in which each of the laser output pulses has a pulse width of shorter than 10 picoseconds. 29. The method of claim 1 in which at least first and second sets of laser output pulses are generated to sever respective links and the first and second sets have similar peak power profiles and similar energy density profiles. 30. The method of claim 1 in which at least first and second sets of laser output pulses are generated to sever respective links and the first and second sets have different peak power profiles and different energy density profiles. 31. The method of claim 1 in which the laser output pulses have energy levels of 0.005 microjoule to 1 microjoule per pulse. 32. The method of claim 1, wherein the step of coordinating laser output generation and relative movement includes providing a focusing lens that is in relative movement with respect to the selected conductive link while the laser output pulses are directed to the selected conductive link. 33. The method of claim 32, wherein the set includes a number of laser output pulses that is fewer than or equal to 50 pulses. 34. The method of claim 32, wherein the second laser output pulse starts after the end of the first laser output pulse. 35. The method of claim 1, wherein the step of generating the laser output pulses comprises using harmonic conversion. 36. The method of claim 1, wherein each of the first and second laser output pulses has a single peak pulse shape. 37. The method of claim 1, wherein the electrically conductive link has a thickness and at least one of the first and second laser output pulses removes a depth of link material that is less than the link thickness. 38. The method of claim 1 in which each link has a link height and each laser output pulse of the set is characterized by energy characteristics that provide a severing depth that is insufficient to sever the link height. 39. The method of claim 38 in which the sets are propagated at a repetition rate of greater than 1 kHz. 40. The method of claim 38 in which the sets are propagated at a repetition rate of greater than 20 kHz. 41. The method of claim 38 in which each of the laser output pulses has a pulse width shorter than 25 picoseconds. 42. The method of claim 38, further comprising generating the laser output pulses at a wavelength shorter than or equal to 850 nm. 43. The method of claim 38 in which each of the laser output pulses has a laser energy of about 0.01 microjoule-10 millijoules. 44. The method of claim 38 in which the spot sizes of the laser spots are the same. 45. The method of claim 38 in which the set of laser output pulses is generated by a solid-state, Q-switched laser having a misaligned Q-switch. 46. The method of claim 38 in which at least a first laser output pulse for each set is generated by a first laser and at least a second laser output pulse for each set is generated by a second laser. 47. The method of claim 46 in which the laser output pulses from the first and second lasers propagate along optical paths that share a substantially collinear common portion. 48. The method of claim 46 in which the spot sizes of the laser spots from the laser output pulses of the first and second lasers are the same. 49. The method of claim 38 in which the set comprises a first laser pulse that is split into first and second laser output pulses such that the first laser output pulse propagates along the first optical path and such that the second laser output pulse propagates along a second optical path, the second optical path having a characteristic that causes the second laser output pulse to reach the selected link structure after the first laser output pulse reaches the link structure. 50. The method of claim 49 in which the first and second laser output pulses propagate along optical paths that share a substantially collinear common portion. 51. The method of claim 49 in which the spot sizes of the laser spots from the first and second laser output pulses are the same. 52. A method of severing selected multiple electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set having a pulsewidth shorter than 10 ps and being characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate, and in which the electrically conductive links are covered by an overlying passivation layer; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width, so that the sets have specified durations of less than 500 ns, so that at least one of the laser output pulses in each set removes a 0.01-0.2 micron depth of the overlying passivation layer by direct laser ablation, and so that the sets sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 53. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width, so that the sets have specified durations of less than 500 ns, so that at least one of the laser output pulses in each set removes a 0.01-0.03 micron depth of the link, and so that the sets sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 54. A method of selectively severing electrically conductive redundant memory or integrated circuit links having associated link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer being positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer as associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing one or more locations of the selected electrically conductive links, the beam positioner in response to the beam positioning data imparting relative movement of a laser spot position to the substrate; generating, with an A-O, Q-switched, solid-state laser, for each selected link structure a set of two or more time-displaced laser output pulses, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; and coordinating laser output pulse generation and the relative movement imparted by the beam positioner such that the relative movement is substantially continuous while the laser output pulses in the set sequentially strike the selected link structure so that the laser spot of each laser output pulse in the set encompasses the link width and the set severs the electrically conductive link between its associated pair of electrically conductive contacts with reduced risk of causing operational damage to any underlying passivation layer and the substrate, the A-O, Q-switched, solid-state laser having an A-O Q-switch that is step controlled such that an RF signal to the Q-switch is reduced from a high power level to an intermediate level to generate a first laser output pulse of the set, and the RF signal to the Q-switch is reduced from the intermediate RF level to a smaller RF level to generate a second laser output pulse of the set. 55. The method of claim 54 in which each laser output pulse has a pulse width of between about 1 to 30 nanoseconds. 56. The method of claim 54 in which each of the laser output pulses of the set has approximately the same energy and approximately the same peak power. 57. The method of claim 54 in which first and second laser output pulses of the set have different energies and different peak powers. 58. A method of severing electrically conductive redundant memory or integrated circuit links positioned between respective pairs of electrically conductive contacts in a circuit fabricated on a substrate, each link having a link width, comprising: providing to a beam positioner beam positioning data representing one or more locations of electrically conductive links in the circuit, the beam positioner coordinating relative movement between a laser spot position and the substrate; reducing an RF signal to a Q-switch from a high RF level to an intermediate RF level to generate from a laser at least one first laser output pulse having a pulse width of between about 25 picoseconds and 30 nanoseconds during a first time interval that is shorter than 1,000 nanoseconds, the first laser output pulse also having a first laser spot with a spot size that is greater than the link width; directing, in accordance with the beam positioning data, the first laser output pulse so that the first laser spot impinges a first location of a first electrically conductive link between first contacts; reducing the RF signal to the Q-switch from the intermediate RF level to a smaller RF level to generate at least one second laser output pulse having a pulse width of between about 25 picoseconds and 30 nanoseconds during the first time interval, the second laser output pulse also having a second laser spot with a spot size that is greater than the link width; directing the second laser output pulse so that the second laser spot impinges the first location of the first electrically conductive link such that the first and second laser spots substantially overlap and the first and second laser output pulses contribute to the removal of the first electrically conductive link; increasing the RF signal to the Q-switch from the smaller RF level to the high RF level; reducing the RF signal to the Q-switch from the high RF level to the intermediate RF level to generate from the laser at least one third laser output pulse having a pulse width duration of between about 25 picoseconds and 30 nanoseconds during a second time interval having a set width duration of shorter than 1,000 nanoseconds, the third laser output pulse also having a third laser spot with a spot size that is greater than the link width; directing, in accordance with the beam positioning data, the third laser output pulse so that the third laser spot impinges a second location of a second electrically conductive link between second contacts; reducing the RF signal to the Q-switch from the intermediate RF level to the smaller RF level to generate at least one fourth laser output pulse having a pulse width duration of between about 25 picoseconds and 30 nanoseconds during the second time interval, the fourth laser output pulse also having a fourth laser spot with a spot size that is greater than the link width; and directing the fourth laser output pulse so that the fourth laser spot impinges the second location of the second electrically conductive link such that the third and fourth laser spots substantially overlap and the third and fourth laser output pulses contribute to the removal of the second electrically conductive link. 59. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structures a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width, at least two of the laser output pulses of the set having different energies and different peak powers, and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width and so that the sets have specified durations of less than 500 ns and sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 60. The method of claim 59 in which each of the laser output pulses has a pulse width shorter than 25 picoseconds. 61. The method of claim 59, further comprising generating harmonically-converted laser output pulses to a wavelength shorter than 850 nm. 62. The method of claim 59 in which each set of the laser output pulses has a laser energy of about 0.01 microjoule-10 millijoules. 63. The method of claim 59 in which the spot sizes of the laser spots are the same. 64. The method of claim 59 in which the set of laser output pulses is generated by a solid-state, Q-switched laser having a misaligned Q-switch. 65. The method of claim 59, in which the laser output pulses have an ultraviolet wavelength. 66. The method of claim 59 in which at least a first laser output pulse for each set is generated by a first laser and at least a second laser output pulse for each set is generated by a second laser. 67. The method of claim 66 in which the laser output pulses from the first and second lasers propagate along optical paths that share a substantially collinear common portion. 68. The method of claim 66 in which the spot sized of the laser spots from the laser output pulses of the first and second lasers are the same. 69. The method of claim 66 in which the first and second lasers are diode-pumped, solid-state, Q-switched lasers. 70. The method of claim 59 in which the set comprises a first laser pulse that is split into first and second laser output pulses such that the first laser output pulse propagates along the first optical path and such that the second laser output pulse propagates along a second optical path, the second optical path having a characteristic that causes the second laser output pulse to reach the selected link structure after the first laser output pulse reaches the link structure. 71. The method of claim 70 in which the first and second laser output pulses propagate along optical paths that share a substantially collinear common portion. 72. The method of claim 70 in which the spot sizes of the laser spots from the first and second laser output pulses are the same. 73. The method of claim 59 in which each link has a link height and each laser output pulse of the set is characterized by energy characteristics that provide a severing depth that is insufficient to sever the link height. 74. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two to fifty time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width and so that the sets have specified durations of less than 500 ns sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 75. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, in each set there is no temporal overlap of two consecutive ones of the laser output pulses, and each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width and so that the sets have specified durations of less than 500 ns sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 76. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation through a focusing lens to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width, at least two of the laser output pulses of the set having different energies and different peak powers, and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width and so that the sets have specified durations of less than 500 ns and sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate, wherein the rapid relative movement includes relative movement of the focusing lens with respect to the multiple selected links as they are severed by the laser output pulses within the specified duration. 77. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two to fifty time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set being characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate, and in which the electrically conductive links are covered by an overlying passivation layer; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width, so that the sets have specified durations of less than 500 ns, so that at least one of the laser output pulses removes a 0.01-0.2 micron depth of the overlying passivation layer by direct laser ablation, and so that the sets sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate. 78. A method of severing multiple selected electrically conductive redundant memory or integrated circuit links having associated multiple selected link structures, each link having a link width and being positioned between an associated pair of electrically conductive contacts in a circuit fabricated on either a substrate or an optional underlying passivation layer positioned between the electrically conductive link and the substrate, the substrate and any optional underlying passivation layer associated with the link structures being characterized by respective laser damage thresholds, comprising: providing to a beam positioner beam positioning data representing locations of the multiple selected link structures; generating, for each selected link structure, a set of two or more time-displaced laser output pulses for emission and propagation to a laser spot position, each of the laser output pulses in the set characterized by a laser spot having a spot size and energy characteristics at the laser spot position, the spot size being larger than the link width and the energy characteristics being below the respective laser damage thresholds of any underlying passivation layer and the substrate; imparting, from the beam positioner, rapid relative movement of the laser spot position and the substrate; the beam positioner, in response to the beam positioning data, moving the laser spot position between multiple selected link structures and directing the laser spot position to the multiple selected link structures so that respective sets of laser pulses impinge on respective multiple selected link structures at a repetition rate of greater than about 1 kHz; and coordinating control of laser output pulse generation and control of the rapid relative movement imparted by the beam positioner such that the laser spot position moves with respect to the selected link structures while the laser output pulses in the sets sequentially strike the selected link structures so that laser spots of the laser output pulses in the set overlap each other and encompass the link width, so that at least one of the laser output pulses in each set removes a 0.02-0.2 micron depth of material, and so that the sets have specified durations of less than 500 ns and sever the selected electrically conductive links between their associated pairs of electrically conductive contacts without causing operational damage to the substrate.
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