IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0252243
(2005-10-18)
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등록번호 |
US-7671304
(2010-04-21)
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발명자
/ 주소 |
|
출원인 / 주소 |
- Mold-Masters (2007) Limited
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
1 인용 특허 :
6 |
초록
▼
A multiple zone temperature controller for a hot runner injection molding system. The temperature controller includes inputs for signals from two or more thermocouples corresponding to two or more heating zones. The thermocouple inputs are time-division multiplexed and the output is amplified and in
A multiple zone temperature controller for a hot runner injection molding system. The temperature controller includes inputs for signals from two or more thermocouples corresponding to two or more heating zones. The thermocouple inputs are time-division multiplexed and the output is amplified and input to a microcontroller. The microcontroller manages and controls operation of power switching stages for controlling the power supplied to heating elements corresponding to each of the heating zones. The multiplexer is a low impedance switch.
대표청구항
▼
What is claimed is: 1. A multiple zone temperature controller for use in an injection molding system, the injection molding system having at least two zones, each zone having a heating element and having a thermocouple for measuring temperature in the zone, the temperature controller comprising: a
What is claimed is: 1. A multiple zone temperature controller for use in an injection molding system, the injection molding system having at least two zones, each zone having a heating element and having a thermocouple for measuring temperature in the zone, the temperature controller comprising: a PCB having at least two input ports each for receiving temperature signals from one of the thermocouples and having at least two output ports each for driving one of the heating elements; a multiplexer mounted on said PCB coupled to said input ports for selecting one of said temperature signals; a processor mounted on said PCB and having an input pin for receiving said selected temperature signal from said multiplexer and outputting a heater control signal in response to said selected temperature signal and a preset value, wherein said processor outputs a switch signal and said multiplexer includes a control port for receiving said switch signal and switching between said input ports in response to said switch signal; at least two power switching stages mounted on said PCB, each power switching stage being coupled to one of said heating elements and supplying said one of said heating elements with a driving current, each said driving current being controlled by one of said heater control signals; and a user interface for displaying data from said processor and for receiving input data from a user so as to establish said preset value. 2. The multiple zone temperature controller claimed in claim 1, wherein said multiplexer comprises a low impedance multiplexer. 3. The multiple zone temperature controller claimed in claim 2, wherein said low impedance multiplexer includes a switching impedance of less than one Ohm. 4. The multiple zone temperature controller claimed in claim 1, wherein said PCB includes at least two ground input ports each connected to a ground contact on a respective one of the thermocouples, wherein said multiplexer is further connected to said ground input ports, and wherein said multiplexer switches between said ground input ports in response to said switch signal. 5. The multiple zone temperature controller claimed in claim 4, wherein said multiplexer comprises a signal-switching multiplexer for selectively coupling one of said input ports to a signal output port in response to said switch signal, and a ground-switching multiplexer for selectively coupling one of said ground input ports to a ground connection in response to said switch signal, said signal output port outputting said selected temperature signal to said processor. 6. The multiple zone temperature controller claimed in claim 5, further including an amplification and signal conditioning stage mounted on said PCB and connected to said signal output port for receiving said selected temperature signal, amplifying and conditioning said selected temperature signal, and outputting a conditioned temperature signal to said processor. 7. The multiple zone temperature controller claimed in claim 1, wherein said switch signal implements time-division multiplexing of said temperature signals. 8. The multiple zone temperature controller claimed in claim 1, wherein said PCB comprises high temperature fiberglass. 9. A multiple zone temperature controller for use in an injection molding system, the injection molding system having at least two zones, each zone having a heating element and having a thermocouple for measuring temperature in the zone, the temperature controller comprising: a card means for receiving temperature signals from each of the thermocouples and outputting at least two driving signals to each of the heating elements; a multiplexing means mounted to said card means for receiving each of the temperature signals and for selecting one of said temperature signals; a processing means mounted on said card means for receiving said selected temperature signal and for outputting a heater control signal in response to said selected temperature signal and a preset value, said processing means for outputting a switch signal, and wherein said multiplexing means includes means for switching between said temperature signals in response to said switch signal; at least two power switching means mounted on said card means, each power switching means supplying said one of said driving signals, each said driving signal being controlled by said power switching means in response to said heater control signal; and a user interface means for displaying data from said processor and for receiving input data from a user so as to establish said preset value. 10. The multiple zone temperature controller claimed in claim 9, wherein said multiplexing means comprises means for low impedance switching between said temperature signals. 11. The multiple zone temperature controller claimed in claim 10, wherein said means for low impedance switching includes a switching means having an impedance of less than one Ohm. 12. The multiple zone temperature controller claimed in claim 9, wherein said card means includes means for connecting to a ground contact on each of the thermocouples, and wherein said multiplexing means includes means for switching between said ground contacts in response to said switch signal. 13. The multiple zone temperature controller claimed in claim 12, wherein said multiplexing means comprises a signal-switching multiplexer means for selectively coupling one of said temperature signals to a signal output port in response to said switch signal, and a ground-switching multiplexer means for selectively coupling one of said ground contacts to a ground connection in response to said switch signal, said signal output port outputting said selected temperature signal to said processing means. 14. The multiple zone temperature controller claimed in claim 13, further including an amplification and signal conditioning means mounted on said card means and connected to said signal output port for receiving said selected temperature signal, amplifying and conditioning said selected temperature signal, and outputting a conditioned temperature signal to said processing means. 15. The multiple zone temperature controller claimed in claim 9, wherein said switch signal implements time-division multiplexing of said temperature signals. 16. The multiple zone temperature controller claimed in claim 9, wherein said card means comprises high temperature fiberglass.
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