초록 ▼

The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodim

The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

대표청구항 ▼

What is claimed is: 1. A network switch, comprising: a plurality of spaced modules, each module including at least one chip; a switch chassis enclosing and supporting the modules; a plurality of plenums within the switch chassis configured to carry cooling air to transfer heat away from the modules

What is claimed is: 1. A network switch, comprising: a plurality of spaced modules, each module including at least one chip; a switch chassis enclosing and supporting the modules; a plurality of plenums within the switch chassis configured to carry cooling air to transfer heat away from the modules; and an air duct that is external to the switch chassis, an interior space of the external air duct being in fluid communication with at least one of the plenums through at least one perforation in the switch chassis, the external air duct being resiliently deformable in a direction perpendicular to its longitudinal axis. 2. The network switch of claim 1, wherein the at least one external air duct is secured to the switch chassis. 3. The network switch of claim 1, further comprising a mounting rack configured to enclose the switch. 4. A method of cooling a network switch, the switch including a plurality of spaced modules enclosed by a switch chassis, the method comprising the steps of: forcing cooling air through the switch; distributing the cooling air throughout the switch via a plurality of plenums within the switch chassis; and distributing the cooling air throughout the switch via an air duct that is external to the switch chassis, an interior space of the external air duct being in fluid communication with at least one of the plenums through at least one perforation in the switch chassis, the external air duct being resiliently deformable in a direction perpendicular to its longitudinal axis. 5. The method of claim 4, further comprising the step of securing the at least one external air duct to the switch chassis. 6. The method of claim 4, further comprising the step of placing the switch within a mounting rack. 7. The method of claim 6, wherein the external air duct deforms and then rebounds as the switch is placed within the mounting rack. 8. The method of claim 4, further comprising the step of placing the switch within a mounting rack. 9. A network switch, comprising: a plurality of spaced modules, each module including at least one chip; a switch chassis enclosing and supporting the modules; a plurality of plenums within the switch chassis configured to carry cooling air to transfer heat away from the modules; and an air duct that is external to the switch chassis, an interior space of the external air duct being in fluid communication with at least one of the plenums through at least one perforation in the switch chassis, the external air duct having opposing sidewalls of differential heights. 10. The network switch of claim 9, further comprising a plurality of gaskets configured to seal junctions of edges of the air duct and the switch chassis. 11. The network switch of claim 10, wherein the gaskets have differential heights to mate with the air duct sidewalls. 12. The network switch of claim 10, wherein the gaskets are secured to the switch chassis. 13. The network switch of claim 9, wherein the external air duct is secured to a mounting rack in which the switch chassis is positionable.