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High force MEMS device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01H-051/22
출원번호 UP-0433044 (2006-05-12)
등록번호 US-7692521 (2010-05-20)
발명자 / 주소
  • Cohn, Michael B.
출원인 / 주소
  • Microassembly Technologies, Inc.
대리인 / 주소
    Fenwick & West LLP
인용정보 피인용 횟수 : 10  인용 특허 : 53

초록

Problems with the short lifetime of MEMS devices, low actuation forces, contaminant build-up on contacts, etc. are minimized by a MEMS device with an improved cantilever design that enables high force while maintaining large gaps. The improved cantilever design both allows for high force and fast sw

대표청구항

We claim: 1. A MEMS device with a cantilever design, the device comprising: a substrate with a stationary contact affixed thereto; an anchor affixed to the substrate; a torsion arm affixed to the anchor by a first torsion hinge with a first axis; and a cantilever plate with a moveable contact affix

이 특허에 인용된 특허 (53)

  1. Sawin Raymond L., Acoustic device packaged at wafer level.
  2. Sood, Dinesh Kumar; Zmood, Ronald Barry; Qin, Lijiang, Bi-stable microswitch including magnetic latch.
  3. Miu Denny K. ; Tang Weilong ; Temesvary Viktoria A., Bulk fabricated electromagnetic micro-relays/micro-switches and method of making same.
  4. Kaiser William J. (Los Angeles CA) Pister Kristofer S. J. (Pacific Palisades CA) Stafsudd Oscar M. (Los Angeles CA) Nelson Phyllis R. (Mar Vista CA) Burstein Amit (N. Hollywood CA), CMOS integrated microsensor with a precision measurement circuit.
  5. Covell ; II James H. ; Bolde Lannie R. ; Edwards David L. ; Goldmann Lewis S. ; Gruber Peter A. ; Toy Hilton T., Cast metal seal for semiconductor substrates and process thereof.
  6. Janusz Bryzek ; David W. Burns ; Sean S. Cahill ; Steven S. Nasiri, Chip-scale packaged pressure sensor.
  7. David R. Hembree ; Salman Akram, Circuit and method for heating an adhesive to package or rework a semiconductor die.
  8. Hembree David R. ; Akram Salman, Circuit and method for heating an adhesive to package or rework a semiconductor die.
  9. Hoffman Paul R. (Modesto CA) Mahulikar Deepak (Madison CT) Brathwaite George A. (Hayward CA) Solomon Dawit (Manteca CA) Parthasarathi Arvind (North Branford CT), Components for housing an integrated circuit device.
  10. Matsumoto Kunio (Yokohama JPX) Oshima Muneo (Yokohama JPX) Sakaguchi Suguru (Chigasaki JPX), Connecting structure for electronic part and method of manufacturing the same.
  11. Bauer, Frederick T.; Stam, Joseph S., Devices incorporating electrochromic elements and optical sensors.
  12. Miller Scott A. ; Turner Kimberly L. ; MacDonald Noel C., Drive electrodes for microfabricated torsional cantilevers.
  13. Ho Chih-Ming (Rancho Palos Verdes CA) Miu Denny K. (Valencia CA) Leu Jeremy Tzong-Shyng (Plainsboro NJ) Miller Raanan (Pasadena CA) Desai Amish (Pasadena CA) Liu Chang (Pasadena CA) Tsao Tom (Pasaden, Electromagnetically actuated micromachined flap.
  14. Ruan, Meichun; Shen, Jun; Wheeler, Charles, Electronically latching micro-magnetic switches and method of operating same.
  15. Meichun Ruan ; Jun Shen, Electronically switching latching micro-magnetic relay and method of operating same.
  16. Kellam Mark D. ; Berry Michele J., Encapsulated micro-relay modules and methods of fabricating same.
  17. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
  18. Smith John W. ; Haba Belgacem, Flexible lead structures and methods of making same.
  19. Ikegami Gorou,JPX, Flip-chip type semiconductor device having recessed-protruded electrodes in press-fit contact.
  20. McHerron Dale C. ; Toy Hilton T., Hermetic thin film metallized sealband for SCM and MCM-D modules.
  21. Beyne, Eric; Lerner, Steve, Image sensor ball grid array package and the fabrication thereof.
  22. Rice, Janet L., Integrated MEMS device and package.
  23. Van Pham Cuong ; DiPiazza Frank Burke ; Baker Jay DeAvis ; Straub Marc Alan ; Jairazbhoy Vivek Amir, Interposer for mounting semiconductor dice on substrates.
  24. Buck Daniel C. (Hanover MD), Low inductance cantilever switch.
  25. DeReus, Dana Richard, MEMS device having contact and standoff bumps and related methods.
  26. Cohn, Michael B.; Xu, Ji-Hai, MEMS device with integral packaging.
  27. Hays, Kenneth Maxwell; Bisignano, Alan Glenn; Fitzgibbons, Eugene Timothy, Method for fabricating a sealed-cavity microstructure.
  28. Tilmans Hendrikus A. C.,NLX ; Beyne Eric,BEX ; Van de Peer Myriam,BEX, Method of fabrication of a microstructure having an internal cavity.
  29. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
  30. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.
  31. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  32. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.
  33. Saia Richard J. (Schenectady NY) Durocher Kevin M. (Waterford NY) Gorczyca Thomas B. (Schenectady NY) Ghezzo Mario (Ballston Lake NY), Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated component.
  34. Yao Jun J. (Thousand Oaks CA), Micro electromechanical RF switch.
  35. Jenn-Hwa Huang ; Samuel L. Coffman ; Xi-Qing Sun ; Ji-Hai Xu ; John Michael Parsey, Jr., Micro-electromechanical system device.
  36. Aksyuk Vladimir A. ; Barber Bradley P. ; Bishop David J. ; Gammel Peter L. ; Giles C. Randy, Micro-opto-electromechanical devices and method therefor.
  37. Richard C. Ruby ; Tracy E. Bell ; Frank S. Geefay ; Yogesh M. Desai, Microcap wafer-level package.
  38. Ruby Richard C. ; Bell Tracy E. ; Geefay Frank S. ; Desai Yogesh M., Microcap wafer-level package.
  39. Sridhar, Uppili; Zou, Quanbo, Microrelays and microrelay fabrication and operating methods.
  40. Pace, Benedict G, Module with bumps for connection and support.
  41. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  42. Schoenfeld Aaron, Multilevel leadframe for a packaged integrated circuit.
  43. Buck Daniel C. (Hanover MD), Non-contact two position microeletronic cantilever switch.
  44. Bishop David John ; Jin Sungho ; Kim Jungsang ; Ramirez Ainissa G., Non-volatile MEMS micro-relays using magnetic actuators.
  45. Nguyen Clark Tu-Cuong ; Howe Roger T., Q-controlled microresonators and tunable electric filters using such resonators.
  46. Isobe,Atsushi; Terano,Akihisa; Asai,Kengo; Uchiyama,Hiroyuki; Matsumoto,Hisanori, RF-MEMS switch and its fabrication method.
  47. Bornand Etienne (Boudry CHX) Simon Jean-Luc (Neuchatel CHX), Reed contactor and process of fabricating suspended tridimensional metallic microstructure.
  48. Shinogi Masataka,JPX ; Saitoh Yutaka,JPX ; Kato Kenji,JPX, Semiconductor acceleration sensor.
  49. Kira Hidehiko,JPX ; Fukui Kiyoshi,JPX ; Tsunoi Kazuhisa,JPX ; Baba Shunji,JPX, Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip.
  50. Chun Heung Sup,KRX, Semiconductor bonding package.
  51. Sooriakumar K. (Scottsdale AZ) Monk David J. (Mesa AZ) Chan Wendy K. (Scottsdale AZ) Goldman Kenneth G. (Chandler AZ), Vertically integrated sensor structure and method.
  52. Cohn Michael B. ; Howe Roger T., Wafer-to-wafer transfer of microstructures using break-away tethers.
  53. Edmans Daniel M. ; Gutierrez Adolfo ; Cormeau Christopher ; Maby Edward, Wideband vibration sensor.

이 특허를 인용한 특허 (10)

  1. Martin, John R.; Frey, Timothy J.; Tsau, Christine H.; Judy, Michael W., Apparatus and method of wafer bonding using compatible alloy.
  2. Chang, Jen-Tsorng, Autostereoscopic display.
  3. Huffman, James D., MEMS composite transducer including compliant membrane.
  4. Martin, John R.; Tsau, Christine H.; Frey, Timothy J., Method of substrate bonding with bonding material having rare Earth metal.
  5. Yang, Xiao “Charles”, Methods and apparatus for operating hysteresis on a hand held device.
  6. Bozler, Carl O.; Keast, Craig L.; Muldavin, Jeremy, Micro-electro mechanical tunneling switch.
  7. Lee, Yongjae; Aimi, Marco Francesco; Claydon, Glenn Scott; Keimel, Christopher Fred, Multichannel relay assembly with in line MEMS switches.
  8. Martin, John R.; Tsau, Christine H.; Frey, Timothy J., Substrate bonding with bonding material having rare earth metal.
  9. Martin, John R.; Tsau, Christine H.; Frey, Timothy J., Substrate bonding with bonding material having rare earth metal.
  10. Min, Tang; Le Neel, Olivier; Shankar, Ravi, Switch with increased magnetic sensitivity.
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