Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and s
Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.
대표청구항▼
The invention claimed is: 1. A resin composition comprising (A) a polyamide, (B) a polyphenylene ether, (C) poly(ethylene terephthalate) and/or poly(trimethylene terephthalate) and/or poly(butylene terephthalate), which contain no ionic functional group, and (D) a conductive carbon filler, wherein
The invention claimed is: 1. A resin composition comprising (A) a polyamide, (B) a polyphenylene ether, (C) poly(ethylene terephthalate) and/or poly(trimethylene terephthalate) and/or poly(butylene terephthalate), which contain no ionic functional group, and (D) a conductive carbon filler, wherein the polyamide forms a continuous phase and the polyphenylene ether and the component (C) form a discontinuous phase; and wherein the component (C) is contained in an amount of 0.1 to 25 parts by mass based on 100 parts by mass of total amount of the polyamide and the polyphenylene ether. 2. The resin composition according to claim 1, wherein the amount of the component (C) is 1 to 15 parts by mass per 100 parts by mass of the sum of the polyamide and the polyphenylene ether. 3. The resin composition according to claim 1, wherein the amount of the conductive carbon filler is 0.1 to 3 parts by mass per 100 parts by mass of the sum of the polyamide, the polyphenylene ether and the component (C). 4. The resin composition according to claim 1, wherein the conductive carbon filler is one or more members selected from the group consisting of conductive carbon black and carbon fibril. 5. The resin composition according to claim 1, wherein at least a portion of the conductive carbon filler is present in the component (C) phase and/or the interface between the component (C) phase and the polyamide phase. 6. The resin composition according to claim 1, which comprises the conductive carbon filler added in the form of a master batch obtained by previously blending the conductive carbon filler with one or more members selected from the group consisting of the component (C) and the polyamide. 7. The resin composition according to claim 1, wherein the polyphenylene ether is selected from the group consisting of poly(2,6-dimethyl-1,4-phenylene ether)s, copolymers of 2,6-dimethylphenol and 2,3,6-trimethylphenol, and mixtures thereof. 8. The resin composition according to claim 1, which further comprises an elastomer. 9. The resin composition according to claim 8, wherein the elastomer is a hydrogenated product of a block copolymer comprising at least one polymer block composed mainly of an aromatic vinyl compound and at least one polymer block composed mainly of a conjugated diene compound. 10. A method for producing the resin composition according to claim 1, comprising: melt-mixing the polyamide, the polyphenylene ether, and a master batch comprising the conductive carbon filler (D) and the component (C). 11. The method according to claim 10, wherein the master batch further comprises a polyamide. 12. An injection-molded article formed from the resin composition according to claim 1.
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이 특허에 인용된 특허 (11)
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