초록 ▼

The present subject matter includes an apparatus including a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween. In this embodiment, t

The present subject matter includes an apparatus including a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween. In this embodiment, the present subject matter includes at least one conformed film at least partially enveloping the capacitor stack in a bound state and adapted to electrically isolate the capacitor stack.

대표청구항 ▼

What is claimed is: 1. A method, comprising: stacking into a capacitor stack at least one substantially planar anode layer onto at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; aligning the at least one substantially planar anode layer to the

What is claimed is: 1. A method, comprising: stacking into a capacitor stack at least one substantially planar anode layer onto at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; aligning the at least one substantially planar anode layer to the at least one substantially planar cathode layer; enveloping the capacitor stack with at least one conformable continuous heat shrink band film; conforming the at least one conformable heat shrink band film with a thermal process such that the capacitor stack is bound in stacked alignment; positioning the capacitor stack in a capacitor case having at least one feedthrough such that the capacitor stack is connected to the at least one feedthrough; disposing electrolyte in the capacitor case; and sealing the capacitor case. 2. The method of claim 1, wherein the thermal process is a convection process. 3. The method of claim 1, further comprising an exterior of the capacitor stack exterior having an edge surface extending between a first major planar surface and a second major planar surface, the first major planar surface and the second major planar surface being substantially parallel, with a perimeter film substantially enveloping the edge surface. 4. The method of claim 1, wherein the conformed band film includes a polymeric material. 5. The method of claim 4, wherein the polymeric material includes polyethylene terephthalate. 6. The method of claim 1, wherein conforming includes thermally conforming the heat shrink band film. 7. A method, comprising: stacking into a capacitor stack at least one substantially planar anode layer onto at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; aligning the at least one substantially planar anode layer to the at least one substantially planar cathode layer; banding the capacitor stack with at least one continuous conformable heat shrink band film so that the capacitor stack is enveloped; conforming the at least one conformable heat shrink band film with a thermal process such that the capacitor stack is bound in stacked alignment; positioning the capacitor stack in a capacitor case having at least one feedthrough such that the capacitor stack is connected to the at least one feedthrough; disposing electrolyte in the capacitor case; and sealing the capacitor case. 8. The method of claim 7, wherein conforming includes convection heating. 9. The method of claim 7, further comprising enveloping an edge of the capacitor stack. 10. The method of claim 7, wherein conforming includes thermally conforming the heat shrink band film. 11. The method of claim 7, further comprising connecting two ends of a ribbon shaped film, the connection disposed along a seam. 12. The method of claim 7, further comprising piercing the at least one heat shrink film to create a passage for a terminal. 13. The method of claim 7, further comprising excising an opening in the heat shrink film to create a passage for a terminal. 14. The method of claim 7, further comprising enveloping an edge surface of the capacitor stack with a perimeter film. 15. The method of claim 14, further comprising banding the capacitor stack and the perimeter film with a band film. 16. A method, comprising: stacking into a capacitor stack at least one substantially planar anode layer onto at least one substantially planar cathode layer, with at least one separator layer disposed therebetween; aligning the at least one substantially planar anode layer to the at least one substantially planar cathode layer; enveloping the capacitor stack with a conformable heat shrink film that extends in a continuous band around the capacitor stack; conforming the conformable heat shrink film with a thermal process such that the capacitor stack is bound in stacked alignment; positioning the capacitor stack in a capacitor case having at least one feedthrough such that the capacitor stack is connected to the at least one feedthrough; disposing electrolyte in the capacitor case; and sealing the capacitor case. 17. The method of claim 16, wherein conforming includes thermally conforming the heat shrink film.