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Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces

Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.

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What is claimed is: 1. A method of producing a removed item originally soldered to a printed circuit board, the printed circuit board readily absorbing infrared energy at a certain set of wavelengths, said method comprising the steps of: transporting said printed circuit board containing the solder

What is claimed is: 1. A method of producing a removed item originally soldered to a printed circuit board, the printed circuit board readily absorbing infrared energy at a certain set of wavelengths, said method comprising the steps of: transporting said printed circuit board containing the soldered item to be removed from a printed circuit board entry port to a printed circuit board exit port of an apparatus configured to remove said item; controlling a travel speed of said printed circuit board; heating a solder of the item to be removed, by applying to the printed circuit board containing the soldered item to be removed, infrared radiation at one or more selected wavelengths different from the certain wavelengths that are readily absorbed by said printed circuit board, the one or more selected wavelengths applied being readily absorbed by the solder and having sufficient energy to melt the solder of the item to be removed, the one or more selected wavelengths applied being not readily absorbed by the printed circuit board, such that the printed circuit board exits the exit port of the apparatus at a temperature that can be grasped with a bare hand; applying mechanical forces to the printed circuit board having the melting solder of the item to be removed situated between said printed circuit board entry port and said printed circuit board exit port of said apparatus; controlling an amplitude of the mechanical forces applied to the printed circuit board; catching at least one item that becomes disconnected from the printed circuit board; and transporting to a first collection location said disconnected item under the influence of gravity; whereby said printed circuit board bearing said item soldered thereto is separated from said item when said printed circuit board bearing said item is transported from said entry port to said exit port under the steps of being heated and having mechanical forces applied thereto, wherein the step of transporting the printed circuit board from the printed circuit board entry port to the printed circuit board exit port of the apparatus is completed in approximately 8-12 seconds. 2. The method of claim 1, wherein the step of heating is completed before the step of applying mechanical forces to the printed circuit board commences. 3. The method of claim 1, wherein the step of applying mechanical forces includes: vertically displacing the printed circuit board in an upward direction; arresting vertical displacement of the printed circuit board; allowing gravity to displace the painted circuit board in a downward direction; and abruptly causing the circuit board to reverse direction such that said item separates from said printed circuit board. 4. The method of claim 1, wherein the item to be removed is a through hole mount electronic component. 5. A method of producing a removed item originally soldered to a printed circuit board, wherein said printed circuit board readily absorbs infrared energy at a certain set of wavelengths, said method comprising the steps of: transporting said printed circuit board containing the soldered item to be removed from a printed circuit board entry port to a printed circuit board exit port of an apparatus configured to remove said item; controlling a travel speed of said printed circuit board; heating a solder of the item to be removed, by applying to the printed circuit board containing the soldered item to be removed infrared radiation at one or more selected wavelengths other than the certain wavelengths that are readily absorbed by the printed circuit board, the one or more selected wavelengths applied being readily absorbed by the solder to melt the solder of the item to be removed, the one or more selected wavelengths applied being not readily absorbed by the printed circuit board; applying mechanical forces to the printed circuit board having the melting solder of the item to be removed situated between said printed circuit board entry port and said printed circuit board exit port of said apparatus, wherein the step of applying mechanical forces includes; vertically displacing the printed circuit board in an upward direction; arresting vertical displacement of the printed circuit board; allowing gravity to displace the printed circuit board in a downward direction; and abruptly causing the printed circuit board to reverse direction such that said item separates from said printed circuit board. 6. A method of producing a removed item originally soldered to a printed circuit board, the printed circuit board readily absorbing infrared energy at a certain set of wavelengths, said method of producing the removed item comprising the steps of: transporting the printed circuit board containing the soldered item to be removed from a printed circuit board entry port to a printed circuit board exit port of an apparatus configured to remove the item; controlling a travel speed of the printed circuit board during transport; heating a solder of the item to be removed, by selecting radiating via an infrared heater operating at substantially a 1300 degree Fahrenheit color temperature, infrared energy at a tuned wavelength sufficient to melt the solder without substantially radiating infrared energy at the certain set of wavelengths such that the printed circuit board exits the exit port of the apparatus at a temperature that can be grasped with a bare hand; applying mechanical forces to the printed circuit board having the melting solder of the item to be removed situated between said printed circuit board entry port and said printed circuit board exit port of said apparatus; controlling an amplitude of the mechanical forces applied to the printed circuit board; catching at least one item that becomes disconnected from the printed circuit board; and transporting to a first collection location said disconnected item under the influence of gravity; whereby said printed circuit board bearing said item soldered thereto is separated from said item when said printed circuit board bearing said item is transported from said entry port to said exit port under the steps of being heated and having mechanical forces applied thereto.