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Three dimensional six surface conformal die coating 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/58
출원번호 UP-0016558 (2004-12-17)
등록번호 US-7705432 (2010-05-20)
발명자 / 주소
  • Vindasius, Al
  • Robinson, Marc
출원인 / 주소
  • Vertical Circuits, Inc.
대리인 / 주소
    Kennedy, Bill
인용정보 피인용 횟수 : 0  인용 특허 : 111

초록 ▼

Semiconductor die are typically manufactured as a large group of integrated circuit die imaged through photolithographic means on a semiconductor wafer or slice made of silicon. After manufacture, the silicon wafer is thinned, usually by mechanical means, and the wafer is cut, usually with a diamond

대표청구항 ▼

What is claimed is: 1. Individual freestanding silicon die, including six surfaces, which have been singulated from a semiconductor wafer, the die being coated on all six surfaces with a parylene film which has been applied to all surfaces; the parylene film providing electrical insulation and serv

이 특허에 인용된 특허 (111)

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