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Angular encapsulation of tandem stacked printed circuit boards

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-043/00
  • H05K-013/00
  • H05K-003/36
  • H05K-003/30
  • B28B-001/00
  • B32B-015/00
출원번호 UP-0606961 (2006-12-01)
등록번호 US-7712213 (2010-06-03)
발명자 / 주소
  • Karmazyn, Michael J.
출원인 / 주소
  • AAI Corporation
대리인 / 주소
    Venable LLP
인용정보 피인용 횟수 : 0  인용 특허 : 45

초록

A method is provided for making an encapsulated stack of circuit boards. The method includes assembling the stack of circuit boards from a plurality of circuit boards, the circuit boards being spaced apart from each other; inserting the stack into an internal volume of a shell, the shell having a fi

대표청구항

What is claimed is: 1. A method of making a finished encapsulated unit, comprising: constructing a circuit board assembly from a plurality of circuit boards, the circuit boards being spaced apart from each other and interconnected via at least one wire or electrical contact; inserting the circuit b

이 특허에 인용된 특허 (45)

  1. Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Apparatus for circuit encapsulation.
  2. Weber Patrick O., Apparatus for encapsulating electronic packages.
  3. Weber Patrick O. (San Jose CA), Apparatus for encapsulating electronic packages.
  4. John R. Saxelby, Jr. ; Walter R. Hedlund, III, Circuit encapsulation.
  5. Saxelby, Jr., John R.; Hedlund, III, Walter R., Circuit encapsulation.
  6. Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Circuit encapsulation process.
  7. Ishiguro, Masaaki; Sato, Akiyoshi, Electric junction box and process for producing the same.
  8. Avila Andres Eduardo ; Vess David Jay ; Hawes Kevin Joseph ; Gladd Joseph Howard ; Carano Dominic ; Natoli Richard Alan, Electrical interconnect system and method for integrating a bussed electrical distribution center with a printed circuit board.
  9. Leighton Robert D. (Brockton MA), Electronic circuit encapsulation.
  10. Centofante, Charles A., Electronic device encapsulated directly on a substrate.
  11. Jaklic ; Jr. ; Albin ; Stephens ; Donald S., Encapsulated electrical inductive apparatus.
  12. Scharlack Ronald S. (Brookline MA) Tornstrom Eric (Acton MA), Encapsulated solar cell array.
  13. Jaffe Donald (Emmaus PA) Soos Nicholas Alec (Macungie PA), Encapsulation of integrated circuits.
  14. Gold Marvin H. (5050 Dory Way Fair Oaks CA 95628), High voltage cable splicing - additive reaction.
  15. Boutin Lynda,CAX ; Letourneau Martial A.,CAX ; Tetreault Real,CAX, Integrated circuit chip package.
  16. Hack,Jonathan A.; Hsieh,Timothy M., Integrated circuit device.
  17. Hamburgen William R. (Menlo Park CA) Fitch John S. (Newark CA), Integrated circuit protection by liquid encapsulation.
  18. Magni, Pierangelo; Cigada, Andrea, Manufacturing method of an electronic device package.
  19. Variot Patrick (San Jose CA), Method for encapsulating an integrated circuit package.
  20. Kodai Shojiro (Itami JPX) Ochi Katsunori (Itami JPX) Baba Fumiaki (Amagasaki JPX), Method for manufacturing an encapsulated IC card having a molded frame and a circuit board.
  21. Boccard Alexis,FRX ; Chevassus Nicolas,FRX, Method for manufacturing composite material pieces by resin transfer moulding.
  22. Drummond Brian (Austin TX), Method for molding using venting pin.
  23. DeCarlo David J. (Toms River NJ) Mineur Thomas L. (High Bridge NJ) Stanwick Ronald S. (Belvidere NJ), Method for protection of cable splices.
  24. Val Christian (St Remy les Chevreuse FRX) Gerard Andre (Viroflay FRX), Method for the 3D interconnection of packages of electronic components using printed circuit boards.
  25. Mihara Akio (Atsugi JPX), Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device.
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  27. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
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  30. Platusich Bruce M. (Bristol IN), Method of reaction injection molding a valve.
  31. McBride Richard (Trenton NJ) Wong Ching-Ping (Lawrenceville NJ), Methods for encapsulating electronic devices.
  32. Andin, Rafael Victor; Weldon, Tracy; Turek, Richard Charles, Mold and method for casting ophthalmic lenses.
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  37. Il Kwon Shim SG; Vincent DiCaprio ; Paul Hoffman ; Byung Joon Han SG, Package for stacked integrated circuits.
  38. Lee Sang S. ; Chen Che-Yuan, Packaging assemblies for encapsulated integrated circuit devices.
  39. Bolanos Mario A. ; Libres Jeremias L. ; Bednarz George A., Pre-packaged liquid molding for component encapsulation.
  40. Wang Kuo K. ; Han Sejin, Pressurized underfill encapsulation of integrated circuits.
  41. Eckardt, Helmut; van der Steen, Stephan; Wulfrath, Marc; Schwesinger, Rolf, Process and apparatus for injection molding of molded parts having at least one cavity.
  42. Kiritani, Mika, Semiconductor resin molding method.
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  45. Farnworth, Warren M., Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography.
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