초록 ▼

The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a transluce

The present invention relates to a camera module, which comprises a packaged image sensor, an IR filter, a lens and a holder for holding these components and has a reduced overall size and height. A camera module according to the present invention comprises an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package. At this time, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate. Alternatively, the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the horizontal portion is formed to be flat such that it is attached to a peripheral portion of a top surface of the translucent substrate. Otherwise, the holder comprises a horizontal portion formed with a through-hole, and a bottom surface of the horizontal portion is attached to at least a peripheral portion of a top surface of the translucent substrate.

대표청구항 ▼

What is claimed is: 1. A camera module, comprising: an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package, wherein the image sensor package comprises a translucent substrate; a pattern

What is claimed is: 1. A camera module, comprising: an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package, wherein the image sensor package comprises a translucent substrate; a patterned metal layer formed on the translucent substrate; a patterned insulating film formed on the metal layer to form at least one through-hole; an image sensor chip coupled to the metal layer formed on the translucent substrate by a flipchip solder joint through the at least one through-hole formed on the insulating film; a solder ball formed on the metal layer outside the image sensor chip; and a dust-seal layer formed between the metal layer formed on the translucent substrate and the image sensor chip inside a region defined by the flipchip solder joint, wherein guide pins that extend downwardly and come into contact with a lateral surface of the translucent substrate are formed integrally with an outer surface of the holder, and wherein the guide pins are removed after the holder and the translucent substrate are bonded to each other. 2. The camera module as claimed in claim 1, wherein the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the connecting portion is formed with an inner stepped portion so as to be attached to a peripheral portion of a top surface and a lateral surface of the translucent substrate. 3. The camera module as claimed in claim 1, wherein the holder comprises a horizontal portion formed with a through-hole and a connecting portion extending downwardly from an edge of the horizontal portion, and an end surface of a lower end of the horizontal portion is formed to be flat such that it is attached to a peripheral portion of a top surface of the translucent substrate. 4. The camera module as claimed in claim 1, wherein the holder comprises a horizontal portion formed with a through-hole, and a bottom surface of the horizontal portion is attached to at least a peripheral portion of a top surface of the translucent substrate. 5. The camera module as claimed in claim 1, wherein the translucent substrate and the holder are attached to each other by means of a double-sided adhesive tape, and the double-sided adhesive tape is attached on a surface of the translucent substrate on which the metal layer is not formed. 6. The camera module as claimed in claim 1, wherein a portion of the translucent substrate exposed to the outside is provided with a light-shielding portion. 7. The camera module as claimed in claim 1, wherein the translucent substrate and the holder are attached to each other by providing an adhesive on a boundary therebetween. 8. The camera module as claimed in claim 1, wherein an IR filter film is attached to or coated on a top surface of the translucent substrate. 9. The camera module as claimed in claim 1, wherein a lens is integrally provided in the holder. 10. The camera module as claimed in claim 6, wherein the light-shielding portion is made of opaque epoxy or paint. 11. The camera module as claimed in claim 7, wherein the adhesive includes opaque epoxy or paint. 12. A camera module, comprising an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package, wherein the image sensor package comprises a translucent substrate; a patterned metal layer formed on the translucent substrate; a patterned insulating film formed on the metal layer to form at least one through-hole; an image sensor chip coupled to the metal layer formed on the translucent substrate by a flipchip solder joint through the at least one through-hole formed on the insulating film; a passive element and a connection pad formed on the metal layer outside the image sensor chip and a dust-seal layer formed between the metal layer formed on the translucent substrate and the image sensor chip inside a region defined by the flipchip solder joint, wherein guide pins that extend downwardly and come into contact with a lateral surface of the translucent substrate are formed integrally with an outer surface of the holder, and wherein the guide pins are removed after the holder and the translucent substrate are bonded to each other. 13. A camera module, comprising: an image sensor package having a translucent substrate formed thereon; and a holder having a lower end attached to the translucent substrate of the image sensor package, wherein the image sensor package comprises a translucent substrate; a metal wire formed on the translucent substrate; an image sensor chip electrically connected to the translucent substrate through a flipchip solder joint; a connection pad formed on the metal wire outside the image sensor chip; and a dust-seal layer formed between the translucent substrate and the image sensor chip, wherein guide pins that extend downwardly and come into contact with a lateral surface of the translucent substrate are formed integrally with an outer surface of the holder, and wherein the guide pins are removed after the holder and the translucent substrate are bonded to each other.