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Semiconductor-based porous structure enabled by capillary force

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-031/028
출원번호 UP-0932951 (2007-10-31)
등록번호 US-7723760 (2010-06-14)
발명자 / 주소
  • Henderson, H. Thurman
  • Shuja, Ahmed
  • Parimi, Srinivas
  • Gerner, Frank M.
  • Medis, Praveen
출원인 / 주소
  • University of Cincinnati
대리인 / 주소
    Perkins Coie LLP
인용정보 피인용 횟수 : 3  인용 특허 : 40

초록

The present invention is a MEMS-based two-phase LHP (loop heat pipe) and CPL (capillary pumped loop) using semiconductor grade silicon and microlithographic/anisotrophic etching techniques to achieve a planar configuration. The principal working material is silicon (and compatible borosilicate glass

대표청구항

What is claimed is: 1. A semiconductor-based structure, the structure comprising: a first set of porous regions of a capillary-force enabled liquid pump comprising a plurality of uniform through-holes along a vertical direction of the semiconductor structure between a first surface of the semicondu

이 특허에 인용된 특허 (40)

  1. Woodruff, Daniel J.; Hanson, Kyle M.; Eudy, Steve L.; Weber, Curtis A.; Harris, Randy, Adaptable electrochemical processing chamber.
  2. Hildebrandt, James, Apparatus and system for cooling electronic circuitry, heat sinks, and related components.
  3. Rogers,C. James, Bonded silicon, components and a method of fabricating the same.
  4. Valenzuela, Javier A., Capillary evaporator.
  5. Van Oost Stephane,BEX, Capillary pumped heat transfer loop.
  6. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  7. Torrence Robert J. (Addison IL), Controlling superheat in a refrigeration system.
  8. Keetman, Eric; Suess, Karl-Heinz, Device and method for the in-situ foaming of hollow profiles with metal foam.
  9. Christophersen,Marc; Bahr,J?rg; Carstensen,J?rgen; Steen,Kay; Popkirov,Georgi; F?ll,Helmut, Device for etching semiconductors with a large surface area.
  10. Pleskach, Michael David; Koeneman, Paul Bryant; Smith, Brian Ronald; Newton, Charles Michael; Gamlen, Carol Ann, Electro-fluidic device and interconnect and related methods.
  11. Foell Helmut (Munich DEX) Lehmann Volker (Munich DEX), Etching method for generating apertured openings or trenches in layers or substrates composed of n-doped silicon.
  12. Ogushi Tetsurou,JPX ; Murakami Masaaki,JPX ; Yao Akira,JPX ; Okamoto Takeshi,JPX ; Masumoto Hiromitsu,JPX ; Yamakage Hisaaki,JPX, Evaporator and loop-type heat pipe using the same.
  13. Kobayashi, Takashi; Ogushi, Tetsuro; Tsujimori, Atsushi; Kamoya, Yoshihiro, Evaporator, a heat absorber, a thermal transport system and a thermal transport method.
  14. Wenger,Todd M., Fluid circuit heat transfer device for plural heat sources.
  15. Marcus Bruce D. (Los Angeles CA) Edwards Donald K. (Los Angeles CA), Graded pore size heat pipe wick.
  16. Masseth, Robert E.; Wilson, Daniel E.; Quan, Michael, Heat exchanger having silicon nitride substrate for mounting high power electronic components.
  17. Eastman George Y. (Lancaster PA), Heat pipe.
  18. Thayer,John Gilbert; Ernst,Donald M., Heat pipe evaporator with porous valve.
  19. Zuo, Jon; Ernst, Donald M., Heat pipe having a wick structure containing phase change materials.
  20. Holtzapple Mark T. (Brazos TX) Ernst Donald M. (Leola PA), High efficiency, orientation-insensitive evaporator.
  21. Anderson, William G.; Eastman, G. Yale; Sarraf, David B.; Zuo, Jon, Hybrid loop cooling of high powered devices.
  22. Huang,Bin Juine, Illumination apparatus of light emitting diodes and method of heat dissipation thereof.
  23. Ota,Shigemi; Matsushita,Shinji, Liquid cooling system for a rack-mount server system.
  24. Ravi Prasher ; Dave Payne, Loop heat pipe for mobile computers.
  25. Hoang, Triem T., Loop heat pipe method and apparatus.
  26. Belady,Christian L.; Zeighami,Roy, Loop thermosyphon with wicking structure and semiconductor die as evaporator.
  27. Kroliczek,Edward J.; Yun,James Seokgeun; Nikitkin,Michael; Wolf, Sr.,David A., Manufacture of a heat transfer system.
  28. Strongin, Geoffrey S. S.; Qureshi, Qadeer Ahmad, Method and apparatus for removing speculative memory accesses from a memory access queue for issuance to memory or discarding.
  29. Chesser,Jason B.; Faneuf,Barrett M.; Montgomery,Stephen W., Modular capillary pumped loop cooling system.
  30. Gluck Donald F. ; Gerhart Charlotte, Multifunctional capillary system for loop heat pipe statement of government interest.
  31. Phillips, Fred A. L., Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator.
  32. Nakamura, Yoshio; Niekawa, Jun; Enomoto, Hisao; Kojima, Yasushi; Yamazaki, Naoya; Mogi, Masahiro, Plate type heat pipe.
  33. Chung,Vinh; Mallari,Jonathan Chan, Porous silicon undercut etching deterrent masks and related methods.
  34. Garner, Scott D., Porous vapor valve for improved loop thermosiphon performance.
  35. Ippoushi,Shigetoshi; Uehara,Nobuaki; Yamada,Akira; Ogushi,Tetsuro, Pump-free water-cooling system.
  36. Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
  37. Mok,Lawrence S.; Colgan,Evan G.; Lu,Minhua; Shih,Da Yuan, Thermal interposer for thermal management of semiconductor devices.
  38. Mok,Lawrence S.; Colgan,Evan G.; Lu,Minhua; Shih,Da Yuan, Thermal interposer for thermal management of semiconductor devices.
  39. Garner, Scott D., Thermal management system and method for electronics system.
  40. Garner, Scott D., Thermal management system and method for electronics system.

이 특허를 인용한 특허 (3)

  1. Yao, Qizhou Matthew; Legge, Ryan J., Liquid cooling with parasitic phase-change pumps.
  2. Thomas, Mark A.; Gammel, Dennis; Achanta, Shankar V., Thermal management of a communication transceiver in an electrical communication device.
  3. Shuja, Ahmed, Two-phase cooling for light-emitting devices.
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