IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
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출원번호 |
UP-0348671
(2009-01-05)
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등록번호 |
US-7732325
(2010-06-29)
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발명자
/ 주소 |
- Yang, Michael X.
- Itoh, Toshio
- Xi, Ming
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
5 인용 특허 :
287 |
초록
▼
In one embodiment, a method for depositing materials on a substrate is provided which includes forming a titanium nitride barrier layer on the substrate by sequentially exposing the substrate to a titanium precursor containing a titanium organic compound and a nitrogen plasma formed from a mixture o
In one embodiment, a method for depositing materials on a substrate is provided which includes forming a titanium nitride barrier layer on the substrate by sequentially exposing the substrate to a titanium precursor containing a titanium organic compound and a nitrogen plasma formed from a mixture of nitrogen gas and hydrogen gas. In another embodiment, the method includes exposing the substrate to the deposition gas containing the titanium organic compound to form a titanium-containing layer on the substrate, and exposing the titanium-containing layer disposed on the substrate to a nitrogen plasma formed from a mixture of nitrogen gas and hydrogen gas. The method further provides depositing a conductive material containing tungsten or copper over the substrate during a vapor deposition process. In some examples, the titanium organic compound may contain methylamido or ethylamido, such as tetrakis(dimethylamido)titanium, tetrakis(diethylamido)titanium, or derivatives thereof.
대표청구항
▼
The invention claimed is: 1. A method for depositing materials on a substrate, comprising: depositing a titanium layer on a substrate; depositing a conformal titanium nitride layer comprising a plurality of titanium nitride layers over the titanium layer by a cyclical deposition process, wherein th
The invention claimed is: 1. A method for depositing materials on a substrate, comprising: depositing a titanium layer on a substrate; depositing a conformal titanium nitride layer comprising a plurality of titanium nitride layers over the titanium layer by a cyclical deposition process, wherein the cyclical deposition process comprises: exposing the substrate to a deposition gas comprising a titanium precursor to form a titanium-containing layer on the substrate, wherein the titanium precursor comprises a titanium organic compound comprising methylamido or ethylamido; exposing the titanium-containing layer disposed on the substrate to a nitrogen plasma formed from a nitrogen precursor gas comprising a mixture of nitrogen gas and hydrogen gas; and sequentially exposing the substrate to the deposition gas and the nitrogen plasma to form the conformal titanium nitride layer; and depositing a conductive material comprising tungsten or copper over the substrate during a vapor deposition process. 2. The method of claim 1, wherein the titanium layer is formed during a chemical vapor deposition process. 3. The method of claim 1, wherein the titanium layer is formed by a cyclical deposition process. 4. The method of claim 1, wherein the titanium organic compound comprises tetrakis(dimethylamido) titanium, tetrakis(diethylamido) titanium, or derivatives thereof. 5. The method of claim 1, wherein the deposition gas further comprises a nitrogen carrier gas. 6. The method of claim 5, wherein the conductive material comprises copper. 7. The method of claim 5, wherein the conductive material comprises tungsten. 8. A method for depositing materials on a substrate, comprising: forming a conformal titanium nitride layer comprising a plurality of titanium nitride layers on a substrate during a cyclical deposition process by sequentially exposing the substrate to a deposition gas comprising a titanium organic compound and a nitrogen plasma formed from a mixture of nitrogen gas and hydrogen gas; and depositing a conductive material comprising tungsten or copper over the conformal titanium nitride layer during a vapor deposition process. 9. The method of claim 8, wherein the titanium organic compound comprises methylamido or ethylamido. 10. The method of claim 9, wherein the titanium organic compound comprises tetrakis(dimethylamido) titanium, tetrakis(diethylamido) titanium, or derivatives thereof. 11. The method of claim 8, wherein the deposition gas further comprises a nitrogen carrier gas. 12. The method of claim 11, wherein the conductive material comprises copper. 13. The method of claim 11, wherein the conductive material comprises tungsten. 14. A method for depositing materials on a substrate, comprising: depositing a titanium layer on a substrate; depositing a conformal titanium nitride layer comprising a plurality of titanium nitride layers over the titanium layer by a cyclical deposition process, wherein the cyclical deposition process comprises: exposing the substrate to a deposition gas comprising a titanium organic compound to form a titanium-containing layer on the substrate; exposing the titanium-containing layer disposed on the substrate to a nitrogen plasma formed from a nitrogen precursor gas comprising a mixture of nitrogen gas and hydrogen gas; and sequentially exposing the substrate to the deposition gas and the nitrogen plasma to form the conformal titanium nitride layer; and depositing a conductive material comprising tungsten or copper over the substrate during a vapor deposition process. 15. The method of claim 14, wherein the titanium layer is formed during a chemical vapor deposition process. 16. The method of claim 14, wherein the titanium layer is formed by a cyclical deposition process. 17. The method of claim 14, wherein the titanium organic compound comprises methylamido or ethylamido. 18. The method of claim 17, wherein the titanium organic compound comprises tetrakis(dimethylamido) titanium, tetrakis(diethylamido) titanium, or derivatives thereof. 19. The method of claim 14, wherein the deposition gas further comprises a nitrogen carrier gas and the conductive material comprises copper. 20. The method of claim 14, wherein the deposition gas further comprises a nitrogen carrier gas and the conductive material comprises tungsten.
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