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Method of making thermally enhanced substrate-base package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
  • H01L-023/34
  • H05K-007/20
출원번호 UP-0807650 (2007-05-30)
등록번호 US-7741158 (2010-07-12)
발명자 / 주소
  • Leung, Timothy
  • Ramos, Mary Jean Bajacan
  • Yeow, Gan Kian
  • Lwin, Kyaw Ko
  • San Antonio, Romarico Santos
  • Subagio, Anang
출원인 / 주소
  • Unisem (Mauritius) Holdings Limited
대리인 / 주소
    Wiggin and Dana LLP
인용정보 피인용 횟수 : 53  인용 특허 : 11

초록

An array-type package encasing one or more semiconductor devices. The package includes a dielectric substrate having opposing first and second sides with a plurality of electrically conductive vias and a centrally disposed aperture extending from the first side to the second side. A heat slug has a

대표청구항

What is claimed is: 1. A method for the manufacture of an array-type package for encasing one or more semiconductor devices comprising the steps of: a) providing a heat slug array containing a dielectric substrate with a plurality of apertures and a plurality of interconnected heat slugs having opp

이 특허에 인용된 특허 (11)

  1. Zhao,Sam Ziqun; Khan,Reza ur Rahman, Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages.
  2. Mahulikar Deepak ; Hoffman Paul R. ; Braden Jeffrey S., Ball grid array electronic package.
  3. Mahulikar Deepak (Madison CT), Electronic package with improved electrical performance.
  4. Bolken, Todd O., Flip chip integrated package mount support.
  5. Chillara Satya (San Jose CA) Mostafazadeh Shahram (San Jose CA), High density integrated circuit assembly combining leadframe leads with conductive traces.
  6. Chillara Satya (San Jose CA) Mostafazadeh Shahram (San Jose CA), High density integrated circuit assembly combining leadframe leads with conductive traces.
  7. Mahulikar Deepak (Madison CT) Hoffman Paul R. (Modesto CA) Braden Jeffrey S. (Livermore CA), Metal ball grid array package with improved thermal conductivity.
  8. Parthasarathi Arvind ; Mahulikar Deepak, Semiconductor package with molded plastic body.
  9. Medeiros ; III Manuel (Acushnet MA) Greenspan Jay S. (South Dartmouth MA), Surface mount device with high thermal conductivity.
  10. Lau,Daniel K.; Law,Edward L. T., Thermal enhanced package for block mold assembly.
  11. Wang Hsing-Seng,TWX ; Lee Rong-Shen,TWX ; Chen Pou-Huang,TWX, Thermally and electrically enhanced PBGA package.

이 특허를 인용한 특허 (53)

  1. Lee, Han-Hsiang; Lin, Yi-Cheng; Hung, Pei-Chun; Lu, Bau-Ru; Chen, Da-Jung; Li, Jeng-Jen, Electronic package structure.
  2. Tran, Tu-Anh N.; Carpenter, Burton J., Embedded electronic component.
  3. Tseng, Tzyy-Jang; Wang, Chin-Sheng; Chuang, Chih-Hong, Fabricating method of semiconductor package structure.
  4. Leal, George R.; Pham, Tim V., Matrix lid heatspreader for flip chip package.
  5. Leal, George R.; Pham, Tim V., Matrix lid heatspreader for flip chip package.
  6. Lam, Ken; Kovats, Julius Andrew, Metal leadframe package with secure feature.
  7. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump.
  8. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a bump/base heat spreader and an inverted cavity in the bump.
  9. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a bump/base/ledge heat spreader, dual adhesives and a cavity in the bump.
  10. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a ceramic/metal substrate.
  11. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader.
  12. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post.
  13. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace.
  14. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole.
  15. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate.
  16. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding.
  17. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal.
  18. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives.
  19. Wang, Chia-Chung; Lin, Charles W. C., Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing.
  20. Wang, Chia-Chung; Lin, Charles W. C., Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing.
  21. Lin, Charles W. C.; Wang, Chia-Chung; Shih, Ming Yu, Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via.
  22. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer.
  23. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity.
  24. Lin, Charles W. C.; Wang, Chia-Chung; Sigmond, David M., Method of making a semiconductor chip assembly with a post/base/cap heat spreader.
  25. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base/post heat spreader.
  26. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts.
  27. Lin, Charles W. C.; Wang, Chia-Chung, Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader.
  28. Ku, Hyun Mo; Jeong, Jin; Choi, Deog Soon; Chung, Chris, Printed circuit board with thermal via.
  29. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace.
  30. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with base heat spreader and cavity in base.
  31. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with bump/base heat spreader and cavity in bump.
  32. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump.
  33. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump.
  34. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with ceramic/metal substrate.
  35. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal.
  36. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with post/base heat spreader and cavity in post.
  37. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with post/base heat spreader and ceramic block in post.
  38. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with post/base heat spreader and dual adhesives.
  39. Wang, Chia-Chung; Lin, Charles W. C., Semiconductor chip assembly with post/base heat spreader and horizontal signal routing.
  40. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace.
  41. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader and plated through-hole.
  42. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader and signal post.
  43. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader and substrate.
  44. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base heat spreader with ESD protection layer.
  45. Lin, Charles W. C.; Wang, Chia-Chung; Shih, Ming Yu, Semiconductor chip assembly with post/base heat spreader with thermal via.
  46. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with post/base heat spreader, signal post and cavity.
  47. Lin, Charles W. C.; Wang, Chia-Chung; Sigmond, David M., Semiconductor chip assembly with post/base/cap heat spreader.
  48. Lin, Charles W. C.; Wang, Chia-Chung; Lim, Sangwhoo, Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange.
  49. Lin, Charles W. C.; Wang, Chia-Chung, Semiconductor chip assembly with post/base/post heat spreader.
  50. Park, Sung Sun; Jun, Ik Su; Ahn, Ye Sul, Semiconductor device with electromagnetic interference shielding.
  51. Tseng, Tzyy-Jang; Wang, Chin-Sheng; Chuang, Chih-Hong, Semiconductor package structure and fabricating method of semiconductor package structure.
  52. Higgins, III, Leo M., Thermally enhanced package with lid heat spreader.
  53. Higgins, III, Leo M., Thermally enhanced package with lid heat spreader.
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