초록 ▼

A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the firs

A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.

대표청구항 ▼

What is claimed is: 1. An electronic device comprising: an enclosure; a printed circuit board assembly: an acoustic damping pad positioned between the enclosure and the printed circuit board assembly of the electronic device, the acoustic dampening pad comprising: a first surface and an opposing se

What is claimed is: 1. An electronic device comprising: an enclosure; a printed circuit board assembly: an acoustic damping pad positioned between the enclosure and the printed circuit board assembly of the electronic device, the acoustic dampening pad comprising: a first surface and an opposing second surface defined by a periphery; and a first set of perforations extending between the first surface and the second surface of the acoustic damping pad, wherein each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern. 2. The electronic device of claim 1, wherein the periphery of the pad corresponds with a periphery of the printed circuit board assembly which is secured to the acoustic dampening pad. 3. The electronic device of claim 2, wherein the first set of perforations is positioned on the acoustic damping pad at a location that corresponds with a location on the printed circuit board assembly which includes deflection. 4. The electronic device of claim 1, wherein each of the first set of perforations is substantially circular shaped. 5. The electronic device of claim 1, wherein each of the first set of perforations have substantially similar sizes and geometric shapes. 6. The electronic device of claim 1, further comprising a second set of perforations extending between the first surface and the second surface of the acoustic damping pad, wherein each adjacent perforation in the second set of perforations is uniformly spaced apart from each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern. 7. The electronic device of claim 6, wherein each of the second set of perforations have substantially similar sizes and geometric shapes. 8. The electronic device of claim 6, wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations. 9. The electronic device of claim 6, wherein the first set of perforations and the second set of perforations include geometric shapes selected from one of a circle, an ellipse and a rectangle. 10. An electronic device comprising: a housing including an external surface; a printed circuit board assembly coupled to the housing, the printed circuit board assembly including at least one area susceptible to deflection when coupled to the housing; and an acoustic dampening pad compressively positioned between the external surface of the housing and the printed circuit board assembly, the acoustic dampening pad including a first surface facing the external surface of the housing, a second surface facing the printed circuit board assembly and a plurality of perforations extending between the first surface and the second surface of the pad that are positioned on the acoustic dampening pad in a location that corresponds with the at least one area of deflection of the printed circuit board assembly. 11. The electronic device of claim 10, wherein the plurality of perforations comprises a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern. 12. The electronic device of claim 11, wherein each perforation of the first set of perforations comprises similar geometric shapes and sizes. 13. The electronic device of claim 10, wherein the plurality of perforations comprises: a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern; and a second set of perforations uniformly spaced apart from each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern. 14. The electronic device of claim 13, wherein each perforation of the second set of perforations comprises similar geometric shapes and sizes. 15. The electronic device of claim 13, wherein the wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations. 16. The electronic device of claim 13, wherein the first set of perforations and the second set of perforations include geometric shapes selected from one of a circle, an ellipse and a rectangle. 17. An electronic device comprising: an acoustic damping pad compressively positioned between an enclosure and a printed circuit board assembly of the electronic device, the acoustic dampening pad comprising: a first surface and an opposing second surface defined by a periphery; and a plurality of perforations extending between the first surface and the second surface of the pad that are positioned in a location that correspond with at least one area of deflection on the printed circuit board assembly, wherein each adjacent perforation is uniformly spaced apart from each other to form at least one uniform pattern. 18. The electronic device of claim 17, wherein the plurality of perforations comprises a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern. 19. The electronic device of claim 17, wherein the plurality of perforations comprises: a first set of perforations uniformly spaced apart from each other across a first select surface area of the first surface and a corresponding first select surface area of the opposing second surface to form a uniform pattern; and a second set of perforations uniformly spaced apart from each other across a second select surface area of the first surface and a corresponding second select surface area of the opposing second surface to form a uniform pattern. 20. The electronic device of claim 19, wherein the wherein each of the first set of perforations include different sizes and geometric shapes than each of the second set of perforations.