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Computer having apparatuses for cooling elements 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-005/00
  • H05K-007/20
  • F28F-007/00
  • H01L-023/26
출원번호 UP-0957418 (2007-12-15)
등록번호 US-7742296 (2010-07-12)
우선권정보 CN-2007 1 0201537(2007-08-30)
발명자 / 주소
  • Lai, Hsiu-Chang
  • Ye, Zhen-Xing
  • Sun, Ke
  • Chen, Ming-Ke
  • Chen, Xiao-Zhu
출원인 / 주소
  • Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
  • Hon Hai Precision Industry Co., Ltd.
대리인 / 주소
    Niranjan, Frank R.
인용정보 피인용 횟수 : 10  인용 특허 : 64

초록

A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. Th

대표청구항

What is claimed is: 1. A computer comprising: a chassis comprising a rear wall at a rear side thereof and a sidewall at a lateral side thereof, the rear wall defining a plurality of inlet holes therein, and the sidewall defining a plurality of outlet holes therein; a motherboard being received in t

이 특허에 인용된 특허 (64)

  1. Cravens,Zachary A.; Wobig,Eric C., Adjustable heat sink shroud.
  2. Vinson,Wade D.; Giardina,Jeffery M.; Allen,Joseph R.; Malone,Christopher G.; Patel,Chandrakant; Paquin,David M.; Bargerhuff,Rich, Air distribution system.
  3. Malone,Christopher G.; Simon,Glenn C.; Bolich,Bryan; Tam,Victoria Tsang, Air duct with airtight seal.
  4. Cheng,Sheng Hsiung; Lin,Te An; Wang,Wu Nan; Huang,Chia Chia, Air guide device and computer housing applying the air guide device.
  5. Chen,Richard, Air shroud for dissipating heat from an electronic component.
  6. Artman, Paul T.; Bailey, Mark M., Airflow shroud mounted fan system and method for cooling information handling system components.
  7. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  8. Gourdine Meredith C. (Houston TX), Apparatus and method for cooling heat generating electronic components in a cabinet.
  9. Chen I-Fee,TWX ; Liu Alvin,TWX ; Sun Chung-Jung,TWX, Apparatus for adjustable mounting a cooling device to a computer enclosure.
  10. Holmes,Steven; Heirich,Douglas L., Apparatus for air cooling of an electronic device.
  11. Behl Sunny (San Jose CA) Friedman Jack (San Jose CA), Apparatus for cooling a memory storage device.
  12. McClellan, Jeffrey R.; Heller, Deborah H.; Torok, James Xavier; Krisher, Dale, Apparatus for cooling electronics.
  13. Eberle Robert,DEX ; Haller Ulrich,DEX, Battery charger for power tools.
  14. Davis,David R.; Flannery,Michael R., CPU fan assembly.
  15. Bo-Ju Su TW, Case assembly for computer mainframe.
  16. Liang,Hsien Rong, Chassis air guide thermal cooling solution.
  17. Chen, Yun-Lung, Computer enclosure incorporating fixing structures for fans.
  18. Kitlas Kenneth ; Patel Anita ; Nishtala Satyanarayana ; Winick Alan Lee ; Lam Alan ; Leung Winiie C. ; Lown Kenneth A. ; Tantoush Mohammed, Computer system cooling configuration.
  19. Wung,Shih Hsun; Chen,Chun Chi; Chen,Bao Chun, Computer system with cooling device for CPU.
  20. Vinson,Wade D.; Taylor,Christopher A.; Belady,Christian L.; Peterson,Eric C., Computer system with external air mover.
  21. Behl Sunny, Convectively cooled memory storage device housing.
  22. Nelson, Daryl J.; Lofland, Steve J.; Salskov, Eric J., Converging cooling duct for a computer cooling system.
  23. Nakai Yasuhiro,JPX ; Ozaki Yuzo,JPX ; Gomibuchi Osamu,JPX ; Hokao Shigeyuki,JPX, Cooling assisting device, cooling assisting method, electronic apparatus, and information processor.
  24. Anderson Paul H. ; Geddes A. James ; Boyd Thomas A., Cooling duct for a computer cooling system with redundant air moving units.
  25. Wong, Sidney S., Cooling duct for computer.
  26. Katooka Masao (Kawanishi JPX) Kawashima Yoshimasa (Kobe JPX) Sakurada Makoto (Yao JPX) Makitani Atsushi (Toyonaka JPX), Cooling structure for power supply device.
  27. Winick Alan Lee ; Mitty Nagaraj ; Harpell Gary A., Cooling system for enclosed electronic components.
  28. Dodson Douglas A. (31510 Mountain Way Bonsall CA 92003), Cooling system for personal computer.
  29. Chang,Yao Ting, Cooling system for server and server having the same.
  30. Gagnon Kevin M. (1668 Larwood Rd. Lemon Grove CA 91945) Goulter Victor H. (485 Molimo Dr. San Francisco CA 94127-1655), Dual filtered airflow systems for cooling computer components, with optimally placed air vents and switchboard control p.
  31. Wu, Chia Kang; Chen, Li Ping, Electronic device with airflow guiding duct.
  32. Lee,Hsieh Kun; Chen,Chun Chi; Wung,Shin Hsuu; Huang,Yu, Electronic system having a fan duct.
  33. Wrycraft,Sean Conor; Osborn,Jay Kevin, Electronics assembly with arrangement for air cooling.
  34. Bestwick, Graham Spencer, Electronics assembly with cooling arrangement.
  35. Gan, Li Yuan, Fan duct assembly.
  36. Shoei-Yuan Shih TW, Fan flow guide.
  37. Brovald, Russell K.; Ong, Brett C.; Kim, Donggyu, Fan holder and components cooling duct assembly.
  38. Rolf A. Konstad, Fan-cooled card.
  39. Chi,Yen Shu; Ou,Tony Zan How, Heat dissipating apparatus of a computer system.
  40. Liu, Wei Ji, Heat dissipating device with air duct.
  41. Shieh,Tong Wen, Heat dissipating system of personal computer.
  42. Chen, Yun Lung, Heat dissipation system.
  43. Garnett,Paul Jeffrey; Osborn,Jay Kevin; Burnham,Andrew Stephen, Heatsink apparatus.
  44. Lau Tim O. (Milpitas CA) Huang Alexander (Menlo Park CA) Lo Douglas P. (San Jose CA), Housing cooling system.
  45. Rothschild, Philon, Housing for data storage devices or for accommodating such devices.
  46. Dalheimer, Volker, Housing system for housing electronic components, especially flat desktop PC or multimedia housing.
  47. Watanabe, Hayato, Information processing apparatus.
  48. Behl Sunny ; Friedman Jack, Memory storage device housing and cooling device.
  49. Paquin David ; Deis David ; Good Lowell, Method and apparatus for cooling and acoustic noise reduction in a computer.
  50. David K. J. Kim ; William W. Ruckman ; Dimitry Struve, Method and apparatus for cooling electronic components.
  51. Korinsky, George K.; Crawford, Craig, Method and apparatus for dissipating heat from an electronic device.
  52. Kawamura Ichirou (Osaka JPX) Imanaka Ryoichi (Hirakata JPX), Optical disk apparatus with cooling arrangement.
  53. Lucero,Christopher D.; Leija,Javier, Reconfigurable airflow director for modular blade chassis.
  54. Galis Oscar, Retrofit Computer Cooler.
  55. Chao-Hsuan Yu TW, Screwless wind conduit positioning device.
  56. Wu, Jeff, Server having an air flow guide device.
  57. Wyler Gregory T. (Winchester MA), Silent air cooled computer having a hard disk drive with an acoustic shield and a heat sink arranged exterior to the dri.
  58. Wyler Gregory T. (Winchester MA), Silent disk drive assembly.
  59. Bash,Cullen E.; Simon,Glenn C.; Malone,Christopher G.; Sharma,Ratnesh K., Small form factor liquid loop cooling system.
  60. Tucker,Sean W.; Searby,Tom J.; Roesner,Arlen L., System and method for cooling components in an electronic device.
  61. Hara,Chikashi; Hayakawa,Kazuyo; Kumai,Satoru; Nomura,Taichiroh; Sakurai,Toshio; Takenoshita,Hiroyuki, System for cooling interior and external housing surfaces of an electronic apparatus.
  62. Schmid, Michael, Tower PC configuration.
  63. Korinsky George K., Ultra-quiet, thermally efficient cooling system for forced air cooled electronics.
  64. Le Bao G. (Orange CA) Kabenjian Gregory V. (Duarte CA), Ventilated backplane for mounting disk drives in computer systems.

이 특허를 인용한 특허 (10)

  1. Makley, Albert V.; Farrow, Timothy S.; Martin-Otto, William F.; Pamley, Marc R., Apparatus, system, and method of power supply disposition and cooling.
  2. Sun, Hong-Zhi; Wang, Tian, Computer system with airflow guiding duct.
  3. Lai, Yu-Chia, Cooling system for electronic device and electronic device having same.
  4. Tsuchida, Shinya, Electronic apparatus.
  5. Shu, Si-Wen, Electronic device having fan duct.
  6. Wang, Jin, Hard disk drive mounting structure and computer incorporating the same.
  7. Ji, Jin-Biao; Zhang, Zhi-Guo; Xu, Li-Fu, Heat dissipating system with fan module.
  8. Miller, Daniel L.; Hotchkiss, Adam R., High-density rack unit systems and methods.
  9. Nihashi, Kiyotaka, Information processing terminal.
  10. Wiltzius, Andrew L.; Searby, Tom J; Crane, Robert Lee; Gomez, Adolfo Adolfo, Removable airflow guide assembly with a processor air cooler and memory bank coolers.
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