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Cluster tool architecture for processing a substrate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05C-013/02
  • C23C-014/00
  • H01L-021/677
출원번호 UP-0106824 (2008-04-21)
등록번호 US-7743728 (2010-07-19)
발명자 / 주소
  • Ishikawa, Tetsuya
  • Roberts, Rick J.
  • Armer, Helen R.
  • Volfovski, Leon
  • Pinson, Jay D.
  • Rice, Michael
  • Quach, David H.
  • Salek, Mohsen S.
  • Lowrance, Robert
  • Backer, John A.
  • Weaver, William Tyler
  • Carlson, Charles
  • Wang, Chongyang
  • Hudgens, Jeffrey
  • Herchen, Harald
  • Lue, Brian
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Patterson & Sheridan, LLP
인용정보 피인용 횟수 : 18  인용 특허 : 562

초록

Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterne

대표청구항

We claim: 1. A cluster tool for processing substrates, comprising: a first processing rack comprising a first substrate processing chamber and a second substrate processing chamber, wherein the second substrate processing chamber is positioned at a first vertical distance from the first substrate p

이 특허에 인용된 특허 (562)

  1. Harada Koji,JPX, Adhesion apparatus.
  2. Tran Chuong R. (San Jose CA), Air elimination system.
  3. Matsumura Yoshio (Shiga JPX) Matsui Hiroshi (Kyoto JPX), Apparatus and a method for carrying wafers.
  4. Deguchi Masatoshi,JPX ; Yoshihara Kosuke,JPX, Apparatus and method for applying process solution.
  5. Deguchi, Masatoshi; Yoshihara, Kosuke, Apparatus and method for applying process solution.
  6. Kimura, Yoshio; Ishida, Seiki, Apparatus and method for coating treatment.
  7. Oka Yoshiji,JPX ; Fukutomi Yoshiteru,JPX ; Itaba Masayuki,JPX ; Koyama Yasufumi,JPX ; Yuge Toshiya,JPX, Apparatus and method for detecting and conveying substrates in cassette.
  8. Inada Hiroichi (Kumamoto JPX) Tsunematsu Kunie (Kumamoto JPX), Apparatus and method for developing resist coated on a substrate.
  9. Tanaka Hideya,JPX ; Morioka Norimitsu,JPX ; Yoshihara Kosuke,JPX, Apparatus and method for developing resist coated on substrate.
  10. Yamamoto, Taro; Fujimoto, Akihiro; Yoshihara, Kousuke; Kyouda, Hideharu; Takeguchi, Hirofumi, Apparatus and method for development.
  11. Muraoka Yusuke,JPX, Apparatus and method for drying substrates.
  12. Konishi Nobuo,JPX ; Hirose Keizo,JPX, Apparatus and method for forming liquid film.
  13. Takashi Takekuma, Apparatus and method for processing a substrate.
  14. Hayashi Eiichiro (Shiga JPX) Fujikawa Kazunori (Shiga JPX), Apparatus and method for rinsing and drying substrate.
  15. Sakamoto Kazuo,JPX ; Fujimoto Akihiro,JPX ; Ishizaka Nobukazu,JPX ; Hasegawa Izumi,JPX, Apparatus and method for supplying a process solution.
  16. Hashimoto Hiroshi,JPX ; Tateyama Kiyohisa,JPX ; Yamaguchi Kiyomitsu,JPX ; Matsuda Yoshitaka,JPX ; Uchihira Norio,JPX ; Sakai Mitsuhiro,JPX ; Satou Fumio,JPX, Apparatus and method for supplying process solution to surface of substrate to be processed.
  17. Tateyama Kiyohisa,JPX, Apparatus and method of applying resist.
  18. Sakai Hiroyuki,JPX ; Matsuo Kazutaka,JPX, Apparatus and method of cleaning nozzle and apparatus of processing substrate.
  19. Sakai Hiroyuki,JPX ; Matsuo Kazutaka,JPX, Apparatus and method of cleaning nozzle and apparatus of processing substrate.
  20. Ogata Kunie,JPX, Apparatus and method of forming resist film.
  21. Shinya, Hiroshi; Mizumoto, Kazuyoshi; Hayashida, Kazuhisa; Sekimoto, Eiichi, Apparatus and method of thermal processing and method of pattern formation.
  22. Boris Govzman ; Konstantin Volodarsky ; Leon Volfovski, Apparatus and methods for handling a substrate.
  23. Toyohide Hayashi JP, Apparatus for and method of heat treatment and substrate processing apparatus.
  24. Nishihama Takamichi (Shiga JPX) Matsumoto Kiyoshi (Shiga JPX), Apparatus for and method of positioning and holding photosensitive material.
  25. Matsumura Yoshio,JPX, Apparatus for and method of processing substrate.
  26. Sanada, Masakazu; Harumoto, Masahiko; Kobayashi, Hiroshi; Matsunaga, Minobu, Apparatus for and method of processing substrate.
  27. Yoshitani Mitsuaki,JPX, Apparatus for and method of treating substrate.
  28. Sugimoto Kenji (Kyoto JPX) Fujita Mitsuhiro (Kyoto JPX), Apparatus for applying liquid agent on surface of rotating substrate.
  29. Tanaka Masato (Nagahama JPX), Apparatus for applying photo-resist to substrate.
  30. Kandori Takefumi (Hikone JPX) Sawa Jyouitsu (Hikone JPX) Takeuchi Toshimasa (Hikone JPX), Apparatus for coating elongated material with photoresist.
  31. Yoshioka Kazutoshi,JPX ; Ogata Kunie,JPX, Apparatus for coating resist and developing the coated resist.
  32. Motoda Kimio (Kumamoto JPX) Tateyama Kiyohisa (Kumamoto JPX) Anai Noriyuki (Kumamoto-ken JPX), Apparatus for coating resist on substrate.
  33. Umaba Takayuki (Kyoto JPX), Apparatus for coating substrate.
  34. Yabe Manabu (Kyoto JPX) Kitagawa Masaru (Kyoto JPX) Ohki Takafumi (Kyoto JPX) Fujita Mitsuhiro (Kyoto JPX), Apparatus for delivering a silica film forming solution.
  35. Yamamoto Satoshi (Kyoto JPX) Kamei Kenji (Kyoto JPX), Apparatus for detecting position of a notch in a semiconductor wafer.
  36. Tanaka Hideya (Kumamoto JPX) Morioka Norimitsu (Kumamoto JPX) Yoshihara Kosuke (Kumamoto JPX), Apparatus for developing a resist-coated substrate.
  37. Sanada, Masakazu; Harumoto, Masahiko, Apparatus for developing substrate.
  38. Motoda Kimio,JPX ; Kawasaki Tetsu,JPX, Apparatus for forming coating film for semiconductor processing.
  39. Terauchi Ken-ichi,JPX, Apparatus for forming film and method for forming film.
  40. Anthony Kurt G., Apparatus for handling and transporting plate like substrates.
  41. Harris,Randy; Woodruff,Daniel J., Apparatus for manually and automatically processing microelectronic workpieces.
  42. Kimura Yoshio,JPX ; Ueda Issei,JPX, Apparatus for processing a substrate.
  43. Ohtani Masami,JPX ; Matsunaga Minobu,JPX ; Ueyama Tutomu,JPX ; Kitakado Ryuji,JPX ; Aoki Kaoru,JPX, Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section.
  44. Kuriu Sadao,JPX ; Yamamoto Kyonosuke,JPX ; Urasaki Jun,JPX ; Takano Yoshikazu,JPX ; Harada Tsuyoshi,JPX ; Kunihiro Akira,JPX ; Tanabe Kunihiro,JPX ; Miyasaka Eiji,JPX ; Kimura Masaharu,JPX ; Kawaguch, Apparatus for processing photosensitive material.
  45. Urasaki Jun,JPX ; Takano Yoshikazu,JPX ; Kunihiro Akira,JPX ; Miyasaka Eiji,JPX ; Kimura Masaharu,JPX ; Kawaguchi Yasuhiro,JPX, Apparatus for processing photosensitive material.
  46. Nishida Masami (Kyoto JPX) Orgami Nobutoshi (Shiga JPX), Apparatus for processing substrate surface.
  47. Iseki Izuru,JPX ; Sato Seiichiro,JPX ; Muraoka Yusuke,JPX, Apparatus for processing substrates.
  48. Park, Jae Heon, Apparatus for processing wafers.
  49. Inuta Kazuo (Shiga JPX) Watanabe Akira (Hiroshima JPX), Apparatus for processing wafers and the like.
  50. Hayashi Noriyuki (Shiga JPX) Murayama Hiromi (Kyoto JPX) Ishino Yukihiko (Kyoto JPX), Apparatus for removing organic substance from substrate.
  51. Konishi Nobuo (Tokyo JPX) Sekiguchi Kenji (Tokyo JPX), Apparatus for removing process liquid.
  52. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Apparatus for rinsing and drying surfaces.
  53. Ikeda Masahide,JPX ; Ohtani Masami,JPX, Apparatus for substrate holding.
  54. Motoda Kimio,JPX ; Yamaguchi Kiyomitsu,JPX ; Matsuda Yoshitaka,JPX ; Kawasaki Tetsu,JPX, Apparatus for treating a substrate with resist and resist-treating method.
  55. Mimasaka Masahiro (Kyoto JPX) Hirai Hiroyuki (Kyoto JPX), Apparatus for treating a wafer surface.
  56. Sugimoto Kenji (Kyoto JPX), Apparatus for treating the surfaces of wafers.
  57. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Apparatus for treating wafers with process fluids.
  58. Biggerstaff Rex L. (Lubbock TX) Skinner Charles W. (Lubbock TX) Syverson Daniel J. (Robbinsdale MN) Jenson Mark L. (Princeton MN) Kegley James G. (St. Paul MN), Apparatus for wafer processing with in situ rinse.
  59. Wood ; III David B. (West Chester OH), Article gripping apparatus.
  60. Haruhiro Tsuneda JP; Yasuyuki Kitahara JP, Articulated robot.
  61. Kimura Akira (Tokyo JPX) Tominaga Morio (Kanagawa JPX), Articulated robot.
  62. Suzuki Shiaki,JPX, Articulated robot.
  63. Terauchi Tsuneo (Aichi JPX) Nishimura Takaaki (Aichi JPX), Articulated robot.
  64. Head ; III Claude D., Assembly line system and apparatus controlling transfer of a workpiece.
  65. Hayashi Toyohide,JPX ; Sugimoto Hiroaki,JPX ; Asai Masaya,JPX ; Yokono Noriaki,JPX, Atmosphere concentration monitoring for substrate processing apparatus and life determination for atmosphere processing unit of substrate processing apparatus.
  66. Caccoma George Anthony (Poughkeepsie NY) Castrucci Paul Philip (Poughkeepsie NY) Druschel William Otto (Granite Springs NY), Automated integrated circuit manufacturing system.
  67. Genov ; deceased Genco ; Botev Roumen G. ; Todorov Alexander D., Automated opening and closing of ultra clean storage containers.
  68. Moriyama Masashi (Tokorozawa JPX), Automatic coating system.
  69. Chen Shou-Shan,TWX, Automobile deceleration indicating device.
  70. Yoshioka Kazutoshi,JPX, Baking apparatus and baking method.
  71. Yoshioka Kazutoshi,JPX, Baking apparatus and baking method.
  72. Biche Michael R. (Union City CA) Lurye Alexander (Fremont CA), Cassette input/output unit for semiconductor processing system.
  73. Nakajima Kazuo (Shiga-ken JPX) Tanaka Katsunori (Shiga-ken JPX), Chemical agent producing device and method thereof.
  74. Goto, Shigehiro; Yoshioka, Katsushi; Matsunaga, Minobu, Chemical treating apparatus.
  75. Smith Jeremy C., Circuit and method for reducing parasitic bipolar effects during electrostatic discharges.
  76. Ishikawa,Tetsuya; Roberts,Rick J.; Armer,Helen R.; Volfovski,Leon; Pinson,Jay D.; Rice,Michael; Quach,David H.; Salek,Mohsen S.; Lowrance,Robert; Backer,John A.; Weaver,William Tyler; Carlson,Charles; Wang,Chongyang; Hudgens,Jeffrey; Herchen,Harald; Lue,Brian, Cluster tool architecture for processing a substrate.
  77. Parodi Michael L. (Alamo CA) Biche Michael R. (Union City CA) Anderson H. Alexander (Santa Cruz CA) Lurye Alexander (Fremont CA), Clustered photolithography system.
  78. Talieh Homayoun ; Lurye Alex, Coater having a controllable pressurized process chamber for semiconductor processing.
  79. Akimoto Masami,JPX ; Yoshioka Kazutoshi,JPX ; Sakamoto Kazuo,JPX ; Semba Norio,JPX, Coating a resist film, with pretesting for particle contamination.
  80. Matsushita, Michiaki; Matsunaga, Masataka; Kozawa, Seiji, Coating and developing apparatus and pattern forming method.
  81. Akihiro Fujimoto JP; Kazuo Sakamoto JP; Nobukazu Ishizaka JP; Izumi Hasegawa JP, Coating apparatus.
  82. Akimoto Masami (Kumamoto JPX) Fujimoto Akihiro (Kumamoto JPX) Iwatsu Haruo (Kumamoto JPX), Coating apparatus.
  83. Akimoto Masami,JPX, Coating apparatus.
  84. Fujimoto Akihiro (Kumamoto-ken JPX) Sakamoto Yasuhiro (Kumamoto-ken JPX), Coating apparatus.
  85. Hasbe, Keizo; Nishikido, Shuuichi; Konishi, Nobuo; Toshima, Takayuki; Yoshioka, Kazutoshi, Coating apparatus.
  86. Hayashi, Shinichi; Ookuma, Hirofumi; Suefuji, Kouichi, Coating apparatus.
  87. Kitano Takahiro,JPX ; Okumura Katsuya,JPX ; Ito Shinichi,JPX, Coating apparatus.
  88. Konishi Nobuo,JPX, Coating apparatus.
  89. Motoda, Kimio, Coating apparatus.
  90. Sakai Hiroyuki (Koshi JPX) Shirakawa Eiichi (Kumamoto JPX) Yamaguchi Chizo (Kumamoto JPX) Takekuma Takashi (Yamaga JPX), Coating apparatus.
  91. Fujimoto Akihiro,JPX, Coating apparatus and coating method.
  92. Kitano Takahiro,JPX ; Okumura Katsuya,JPX ; Ito Shinichi,JPX, Coating apparatus and coating method.
  93. Kitano Takahiro,JPX ; Okumura Katsuya,JPX ; Ito Shinichi,JPX, Coating apparatus and coating method.
  94. Takamori, Hideyuki; Anai, Noriyuki; Nomura, Masafumi; Tateyama, Kiyohisa; Omori, Tsutae, Coating apparatus and coating method.
  95. Takekuma Takashi (Yamaga JPX) Murakami Masaaki (Kumamoto JPX) Deguchi Masatoshi (Kumamoto JPX) Fujimoto Akihiro (Kumamoto-ken JPX), Coating apparatus and method.
  96. Ushijima Mitsuru (Tama JPX) Hirakawa Osamu (Kumamoto JPX) Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Taimei JPX) Anai Noriyuki (Kumamoto JPX), Coating apparatus and method for applying a liquid to a semiconductor wafer including selecting a nozzle on a stand by s.
  97. Ushijima Mitsuru (Tama JPX) Hirakawa Osamu (Kumamoto JPX) Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Taimei JPX) Anai Noriyuki (Kumamoto JPX), Coating apparatus and method for applying a liquid to a semiconductor wafer, including selecting a nozzle in a stand-by.
  98. Kimura Yoshio,JPX ; Morita Satoshi,JPX ; Matsuyama Yuuji,JPX, Coating apparatus and method of controlling the same.
  99. Kimura Yoshio,JPX ; Morita Satoshi,JPX ; Matsuyama Yuuji,JPX, Coating apparatus and method of controlling the same.
  100. Motoda Kimio,JPX ; Tateyama Kiyohisa,JPX, Coating apparatus and method therefor.
  101. Motoda Kimio,JPX ; Tateyama Kiyohisa,JPX, Coating apparatus therefor.
  102. Konishi Nobuo (Kofu JPX) Takamori Hideyuki (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Tateyama Kiyohisa (Kumamoto JPX), Coating apparatus with nozzle moving means.
  103. Toshima Takayuki (Nirasaki JPX) Hirakawa Osamu (Kumamoto JPX), Coating device.
  104. Kitano, Takahiro; Koga, Norihisa; Takei, Toshichika; Kawafuchi, Yoshiyuki, Coating film forming apparatus.
  105. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Coating film forming apparatus.
  106. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Coating film forming apparatus and coating film forming method.
  107. Takahiro Kitano JP; Masateru Morikawa JP; Yukihiko Esaki JP; Nobukazu Ishizaka JP; Norihisa Koga JP; Kazuhiro Takeshita JP; Hirofumi Ookuma JP; Masami Akimoto JP, Coating film forming apparatus and coating film forming method.
  108. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Coating film forming apparatus and coating unit.
  109. Minami, Tomohide; Sugimoto, Shinichi; Kitano, Takahiro; Ookura, Jun; Kurishima, Hiroaki, Coating film forming method and apparatus.
  110. Hideyuki Takamori JP, Coating film forming method and coating apparatus.
  111. Takamori Hideyuki,JPX, Coating film forming method and coating apparatus.
  112. Tateyama Kiyohisa,JPX, Coating film forming method and coating apparatus.
  113. Shiraishi Masatoshi,JPX ; Kiba Yukio,JPX ; Ogata Kunie,JPX, Coating film forming method and coating film forming apparatus.
  114. Yoshihara, Kousuke; Terashita, Yuichi, Coating film forming method and coating film forming apparatus.
  115. Kitano, Takahiro; Kawafuchi, Yoshiyuki; Koga, Norihisa; Takei, Toshichika, Coating film forming system.
  116. Hayashi, Shinichi; Ookuma, Hirofumi; Suefuji, Kouichi, Coating method.
  117. Matsumura Kimiharu (Kumamoto JPX) Sakai Hiroyuki (Koshi JPX), Coating method and apparatus.
  118. Tateyama Kiyohisa,JPX, Coating method and apparatus.
  119. Tateyama Kiyohisa,JPX ; Motoda Kimio,JPX ; Anai Noriyuki,JPX, Coating method and apparatus for semiconductor process.
  120. Tateyama, Kiyohisa; Motoda, Kimio; Anai, Noriyuki, Coating method and apparatus for semiconductor process.
  121. Masakazu Sanada JP; Kayoko Nakano JP; Shigehiro Goto JP; Minobu Matsunaga JP, Coating solution applying method and apparatus.
  122. Sanada Masakazu,JPX, Coating solution applying method and apparatus.
  123. Sanada Masakazu,JPX ; Matsunaga Minobu,JPX, Coating solution applying method and apparatus.
  124. Sanada Masakazu,JPX ; Mimasaka Masahiro,JPX, Coating solution applying method and apparatus.
  125. Fujimoto Akihiro,JPX, Coating unit.
  126. Inada, Hiroichi; Hayashi, Shinichi, Coating unit and coating method.
  127. Nakajima Kazuo,JPX ; Tanaka Katsunori,JPX ; Ogami Nobutoshi,JPX, Concentration controlling method and a substate treating apparatus utilizing same.
  128. Matsuura, Hideki, Conductor connecting apparatus.
  129. Ramanan, Natarajan, Control of robotic systems.
  130. Schaper Charles D. ; Bolandi Hooman ; Young Douglas W., Control system and method for providing variable ramp rate operation of a thermal cycling system.
  131. Tateyama Kiyohisa,JPX, Cooling apparatus, cooling method, and processing apparatus.
  132. Sada Tetsuya,JPX ; Hirose Osamu,JPX ; Tateyama Kiyohisa,JPX, Cooling device and cooling method.
  133. Sada Tetsuya,JPX ; Hirose Osamu,JPX ; Tateyama Kiyohisa,JPX, Cooling device and cooling method.
  134. Tateyama Kiyohisa,JPX, Cooling method, cooling apparatus and treatment apparatus.
  135. Akimoto Masami,JPX, Cooling process system.
  136. Tateyama Kiyohisa,JPX, Deaerating apparatus and treatment apparatus with gas permeable films.
  137. Tateyama Kiyohisa,JPX, Deaerating apparatus, deaerating method, and treatment apparatus.
  138. Inada Hiroichi,JPX, Developing apparatus.
  139. Matsuoka Fuminori (Kofu JPX), Developing apparatus.
  140. Takeda Morihiro (Hikone JPX) Miyasaka Eiji (Hikone JPX) Handa Masayuki (Hikone JPX), Developing apparatus.
  141. Mimasaka Masahiro,JPX ; Matsunaga Minobu,JPX ; Tanaka Akiko,JPX ; Uchitani Koji,JPX, Developing apparatus and developing method.
  142. Sanada, Masakazu; Harumoto, Masahiko; Kobayashi, Hiroshi; Matsunaga, Minobu, Developing apparatus and developing method.
  143. Sanada, Masakazu; Harumoto, Masahiko; Kobayashi, Hiroshi; Matsunaga, Minobu; Morita, Akihiko, Developing apparatus and developing method.
  144. Nagamine Shuichi,JPX ; Akimoto Masami,JPX ; Nishiya Akira,JPX ; Kosugi Hitoshi,JPX, Developing apparatus and developing nozzle.
  145. Sakamoto Kazuo,JPX ; Nagamine Shuichi,JPX, Developing apparatus and method thereof.
  146. Takekuma, Takashi, Developing apparatus with a porous film nozzle.
  147. Mimasaka Masahiro,JPX ; Uchitani Koji,JPX, Developing apparatus, developing method and substrate processing apparatus.
  148. Ogata Kunie,JPX, Developing method.
  149. Akimoto Masami,JPX, Developing method and apparatus.
  150. Sugimoto Kenji (Kyoto JPX), Developing method and apparatus.
  151. Hitoshi Kosugi JP; Hideharu Kyouda JP, Developing method and developing apparatus.
  152. Kazuo Sakamoto JP; Akira Nishiya JP, Developing method and developing apparatus.
  153. Kazuo Sakamoto JP; Shuuichi Nishikido JP, Developing method and developing apparatus.
  154. Konishi Nobuo,JPX ; Toshima Takayuki,JPX ; Omori Tsutae,JPX, Developing method and developing apparatus.
  155. Nobuo Konishi JP; Takayuki Toshima JP; Tsutae Omori JP, Developing method and developing apparatus.
  156. Sakamoto Kazuo,JPX ; Nishikido Shuuichi,JPX, Developing method and developing apparatus.
  157. Takayuki Toshima JP; Tsutae Omori JP; Yoshio Kimura JP, Developing method and developing apparatus.
  158. Toshima, Takayuki; Omori, Tsutae; Kimura, Yoshio, Developing method and developing apparatus.
  159. Yuji Matsuyama JP; Shuichi Nagamine JP, Developing method and developing unit.
  160. Hiroichi Inada JP, Developing process and developing unit.
  161. Nishiya, Akira; Sakamoto, Kazuo, Developing treatment method and developing treatment unit.
  162. Tetsuya Kitamura JP, Developing unit and developing method.
  163. Putzi,Christian, Device and method for transporting wafer-shaped articles.
  164. Nguyen, Binh Quoc; Phillips, Alton, Device for handling wafers in microelectronic manufacturing.
  165. Yoshioka Katsushi (Kyoto JPX) Nakagawa Koji (Kyoto JPX) Itaba Masayuki (Kyoto JPX) Hiraoka Nobuyasu (Kyoto JPX) Takeoka Masafumi (Kyoto JPX), Device for holding and rotating a substrate.
  166. Fujikawa Kazonori (Shiga JPX) Tanaka Masato (Shiga JPX) Muraoka Yusuke (Kyoto JPX), Device for rinsing and drying substrate.
  167. Weber Martin,DEX ; Oshinowo John,DEX, Device for treating substrates in a fluid container.
  168. Weber Martin,DEX ; Oshinowo John,DEX, Device for treating substrates in a fluid container.
  169. Masuda Yoshihiro (Kyoto JPX) Yagi Takashi (Kyoto JPX) Murata Akira (Kyoto JPX), Device for venting fumes given off by automatic developing equipment.
  170. Nomoto, Hiroshi, Device supporting apparatus.
  171. Liu, Lianjun, Dry silylation plasma etch process.
  172. Fairbairn Kevin ; Lane Christopher ; Colborne Kelly ; Sundar Satish, Dual blade robot.
  173. Babbs, Daniel A.; Kim, Jae Hong; Coady, Matt W.; Fosnight, William J., Edge grip aligner with buffering capabilities.
  174. Emir Gurer ; Ed C. Lee ; Tom Zhong ; Kevin Golden ; John W. Lewellen ; Scott C. Wackerman ; Reese Reynolds, Environment exchange control for material on a wafer surface.
  175. Gurer Emir ; Lee Ed C. ; Zhong Tom ; Golden Kevin ; Lewellen John W. ; Reynolds Reese ; Wackerman Scott C., Environment exchange control for material on a wafer surface.
  176. Gurer, Emir; Lee, Ed C.; Zhong, Tom; Golden, Kevin; Lewellen, John W.; Wackerman, Scott C.; Reynolds, Reese, Environment exchange control for material on a wafer surface.
  177. Fayfield Robert T. ; Schwab Brent, Equipment for UV wafer heating and photochemistry.
  178. Kitano, Junichi; Hada, Keiko; Ono, Yuko; Katano, Takayuki; Matsui, Hidefumi, Evaluating method of hydrophobic process, forming method of resist pattern, and forming system of resist pattern.
  179. Kawano Yukihiro,JPX, Film coating apparatus.
  180. Noriyuki Anai JP; Tsutae Omori JP; Masaaki Takizawa JP; Mitsuhiro Sakai JP, Film forming apparatus.
  181. Kitano, Takahiro; Morikawa, Masateru; Akimoto, Masami; Takeshita, Kazuhiro, Film forming apparatus and film forming method.
  182. Kiyohisa Tateyama JP; Tsutae Omori JP, Film forming apparatus and film forming method.
  183. Takahiro Kitano JP; Masateru Morikawa JP; Masami Akimoto JP; Kazuhiro Takeshita JP, Film forming apparatus and film forming method.
  184. Hasebe Keizo,JPX ; Nishikido Shuuichi,JPX ; Konishi Nobuo,JPX ; Toshima Takayuki,JPX ; Yoshioka Kazutoshi,JPX, Film forming method and film forming apparatus.
  185. Hasebe, Keizo; Nishikido, Shuuichi; Konishi, Nobuo; Toshima, Takayuki; Yoshioka, Kazutoshi, Film forming method and film forming apparatus.
  186. Inada, Hiroichi; Nagamine, Shuichi, Film forming method and film forming apparatus.
  187. Inada, Hiroichi; Nagamine, Shuichi, Film forming method and film forming apparatus.
  188. Konishi, Nobuo; Iwashita, Mitsuaki, Film forming method and film forming apparatus.
  189. Takahiro Kitano JP; Masami Akimoto JP; Tomohide Minami JP; Masateru Morikawa JP, Film forming method and film forming apparatus.
  190. Kitano, Takahiro; Kobayashi, Shinji; Esaki, Yukihiko; Morikawa, Masateru, Film forming unit.
  191. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Film forming unit.
  192. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Film forming unit.
  193. Kitano, Takahiro; Morikawa, Masateru; Esaki, Yukihiko; Ishizaka, Nobukazu; Koga, Norihisa; Takeshita, Kazuhiro; Ookuma, Hirofumi; Akimoto, Masami, Film forming unit.
  194. Masakazu Katayama JP; Seiji Oku JP; Tomonori Kojimaru JP; Yusuke Muraoka JP, Fluid heating apparatus.
  195. Miyamoto,Toshio, Hand device for working robot.
  196. Koji Harada JP; Issei Ueda JP, Heat and cooling treatment apparatus and substrate processing system.
  197. Sada Tetsuya,JPX, Heat process apparatus and heat process method.
  198. Shirakawa Eiichi,JPX, Heat processing apparatus.
  199. Shirakawa, Eiichi; Fukuoka, Tetsuo; Nogami, Tsuyoshi, Heat processing apparatus.
  200. Kuga, Yasuhiro; Tanoue, Mitsuhiro; Tanaka, Kouichirou, Heat processing apparatus of substrate.
  201. Mizosaki Kengo,JPX ; Yoshida Masaaki,JPX, Heat processing device with hot plate and associated reflector.
  202. Matsuyama Yuji,JPX, Heat processing method and apparatus.
  203. Hirose Osamu,JPX ; Tateyama Kiyohisa,JPX, Heat treating apparatus.
  204. Hirose Osamu,JPX ; Tateyama Kiyohisa,JPX, Heat treating apparatus.
  205. Shirakawa Eiichi,JPX ; Sata Nobuyuki,JPX, Heat treating apparatus.
  206. Eiichi Shirakawa JP; Nobuyuki Sata JP, Heat treatment apparatus.
  207. Shirakawa Eiichi,JPX ; Sata Nobuyuki,JPX, Heat treatment apparatus.
  208. Shirakawa Eiichi,JPX ; Sata Nobuyuki,JPX, Heat treatment apparatus.
  209. Takashi Tanaka JP; Shinji Nagashima JP; Hiroyuki Sakai JP, Heat treatment apparatus and method.
  210. Kulp John, Heat treatment apparatus and method, detecting temperatures at plural positions each different in depth in holding plate, and estimating temperature of surface of plate corresponding to detected resu.
  211. Eiichi Shirakawa JP; Nobuyuki Sata JP, Heat treatment apparatus and substrate processing system.
  212. Shirakawa Eiichi,JPX ; Sata Nobuyuki,JPX, Heat treatment apparatus and substrate processing system.
  213. Suzuki, Fujio; Wakai, Hideki, Heat treatment apparatus for preventing an initial temperature drop when consecutively processing a plurality of objects.
  214. Ohkase Wataru (Sagamihara JPX) Yagi Yasushi (Zama JPX) Kawachi Satoshi (Yokohama JPX), Heat treatment apparatus utilizing flat heating elements for treating semiconductor wafers.
  215. Takamori Hideyuki (Kumamoto JPX) Satoh Takami (Kumamoto JPX), Heat treatment device.
  216. Matsuyama Yuji,JPX ; Mizutani Yoji,JPX ; Nagashima Shinji,JPX ; Yonemizu Akira,JPX, Heat treatment method, heat treatment apparatus and treatment system.
  217. Tanoue, Mitsuhiro; Oda, Tetsuya, Heat treatment unit and heat treatment method.
  218. Tanoue, Mitsuhiro; Oda, Tetsuya, Heat treatment unit and heat treatment method.
  219. Jun Ookura JP; Koji Harada JP, Heat treatment unit, cooling unit and cooling treatment method.
  220. Ookura, Jun; Harada, Koji, Heat treatment unit, cooling unit and cooling treatment method.
  221. Young Douglas W. ; Bolandi Hooman ; Schaper Charles D., Heater for use in substrate processing.
  222. Shirakawa, Eiichi, Heating apparatus and heating method.
  223. Sekimoto Eiichi,JPX ; Tanoue Mitsuhiro,JPX, Heating apparatus for heating an object to be processed.
  224. Yamagata, Masahiro; Oshiba, Hisanori; Sakashita, Yoshihiko; Inoue, Yoichi; Muraoka, Yusuke; Saito, Kimitsugu; Mizobata, Ikuo; Kitakado, Ryuji, High pressure processing apparatus.
  225. Sakashita, Yoshihiko; Watanabe, Katsumi; Yamagata, Masahiro; Oshiba, Hisanori; Sarumaru, Shogo; Muraoka, Yusuke; Saito, Kimitsugu; Mizobata, Ikuo; Kitakado, Ryuji, High pressure processing apparatus and high pressure processing method.
  226. Michaluk, Christopher A.; Huber, Louis E.; Kawchak, Mark N.; Maguire, Jr., James D., High purity tantalum, products containing the same, and methods of making the same.
  227. Saito, Kimitsugu; Muraoka, Yusuke; Kitakado, Ryuji; Miyake, Takashi; Iwata, Tomomi; Mizobata, Ikuo, High-pressure drying apparatus, high-pressure drying method and substrate processing apparatus.
  228. Tetsuya Oda JP; Mitsuhiro Tanoue JP; Toshichika Takei JP, Hot plate cooling method and heat processing apparatus.
  229. Tetsuya Oda JP; Mitsuhiro Tanoue JP; Toshichika Takei JP; Eiichi Shirakawa JP, Hot plate cooling method and heat processing apparatus.
  230. Omori Tsutae (Yamanashi JPX) Harada Kouji (Kumamoto JPX) Satoh Takami (Kumamoto JPX) Anai Noriyuki (Kumamoto JPX) Nomura Masafumi (Kumamoto JPX), Hydrophobic processing apparatus including a liquid delivery system.
  231. Omori Tsutae (Yamanashi-ken JPX) Harada Kouji (Kumamoto-ken JPX) Satoh Takami (Kumamoto-ken JPX) Anai Noriyuki (Kumamoto-ken JPX) Nomura Masafumi (Kumamoto-ken JPX), Hydrophobic treatment method involving delivery of a liquid process agent to a process space.
  232. Keppler Rainer (Poxdorf DEX) Kolb Roland (Hemhofen DEX) Eberle Manfred (Erlangen DEX), Industrial robot.
  233. Ohtani Masami (Kyoto JPX) Oka Yoshiji (Kyoto JPX) Okamoto Takeo (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX), Interface apparatus for transporting substrates between substrate processing apparatus.
  234. Ting Chiu H. ; Holtkamp William H. ; Brodowski Richard W. ; Wytman Joseph B., Introducing and reclaiming liquid in a wafer processing chamber.
  235. Nishijima, Yuuichi; Okamura, Kouji, Judging method and processing apparatus.
  236. Nureki Shinji,JPX, Line printer.
  237. Ishida, Seiki; Iwano, Junichi; Ookura, Jun; Saito, Michishige, Liquid coating apparatus with temperature controlling manifold.
  238. Iwatsu Haruo (Shichijo JPX) Sakamoto Yasuhiro (voth of Kumamoto JPX) Iwakiri Junro (voth of Kumamoto JPX), Liquid coating device.
  239. Hasebe Keizo (Kofu JPX) Tateyama Kiyohisa (Kumamoto JPX) Yoshimoto Yuji (Shisui JPX) Matsuyama Yuji (Oozu JPX) Nakahara Tetsuro (Mashiki JPX) Kimura Yoshio (Koshi JPX), Liquid coating system.
  240. Kimura Yoshio (Kumamoto JPX), Liquid supply apparatus.
  241. Kimura Yoshio,JPX ; Morita Satoshi,JPX ; Matsuyama Yuji,JPX ; Semba Norio,JPX, Liquid supplying device.
  242. Minami, Tomohide; Shinya, Hiroshi; Kitano, Takahiro, Low-pressure dryer and low-pressure drying method.
  243. Verhovsky Yuli, Mechanism for transporting semiconductor-process masks.
  244. Gurer Emir ; Savage Richard, Method and apparatus for adaptive process control of critical dimensions during spin coating process.
  245. Pollack Steven H. (Washington Crossing PA) Hoffman Brian D. (Somerville NJ), Method and apparatus for anti-collision and collision protection for multiple robot system.
  246. Akimoto Masami,JPX ; Yoshioka Kazutoshi,JPX ; Sakamoto Kazuo,JPX ; Semba Norio,JPX, Method and apparatus for coating a film on an object being processed.
  247. Yoshioka Kazutoshi,JPX ; Ogata Kunie,JPX, Method and apparatus for coating resist and developing the coated resist.
  248. Morimoto Toru,JPX, Method and apparatus for controlling substrate processing apparatus.
  249. Batchelder William T. ; Parodi Michael L. ; Biche Michael R., Method and apparatus for curing photoresist.
  250. Sugimoto Hiroaki,JPX ; Kitagawa Masaru,JPX, Method and apparatus for degassing processing solution for substrates.
  251. Dusan Jevtic, Method and apparatus for handling deadlocks in multiple chamber cluster tools.
  252. Akimoto Masami (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto-ken JPX) Harada Kouji (Kumamoto-ken JPX), Method and apparatus for heat-treating substrate.
  253. Malin Cosmas (Mauren LIX) Sawatzki Harry (Vaduz LIX), Method and apparatus for holding and conveying platelike substrates.
  254. Shiraishi Masatoshi (Kikuchi JPX) Hamada Tomoko (Kumamoto JPX), Method and apparatus for hydrophobic treatment.
  255. Shiraishi Masatoshi (Kikuchi JPX) Hamada Tomoko (Kumamoto JPX), Method and apparatus for hydrophobic treatment.
  256. Everett Louis J. (College Station TX) Hsu Tsing-Wong (El Paso TX), Method and apparatus for locating physical objects.
  257. Miyasaka Eiji (Hikone JPX) Handa Masayuki (Hikone JPX) Takeda Morihiro (Hikone JPX) Tsujino Hiroyuki (Hikone JPX), Method and apparatus for processing photosensitive material.
  258. Miyasaka Eiji (Hokone JPX), Method and apparatus for processing photosensitive material.
  259. Akimoto Masami,JPX ; Deguchi Yoichi,JPX, Method and apparatus for processing resist.
  260. Kawasaki Tetsu,JPX ; Motoda Kimio,JPX, Method and apparatus for processing substrates.
  261. Hilario Oh, Method and apparatus for resolving conflicts in a substrate processing system.
  262. Oh, Hilario, Method and apparatus for resolving conflicts in a substrate processing system.
  263. Oh, Hilario, Method and apparatus for resolving conflicts in a substrate processing system.
  264. Hayashi Noriyuki (Hikone JPX), Method and apparatus for rinsing materials or articles.
  265. Jevtic Dusan ; Venkatesh Srilakshmi, Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot.
  266. Nishizawa Hisao (Shiga JPX) Morita Masaru (Minami JPX) Tanaka Masato (Nagahama JPX), Method and apparatus for surface treating of substrates.
  267. Chai ; deceased An-Ti, Method and apparatus for thermocapillary drying.
  268. Du-Nour, Ofer; Rubinstein, Vladimir, Method and apparatus for thickness decomposition of complicated layer structures.
  269. Reimer, Peter; Patel, Jayesh, Method and apparatus for transferring a semiconductor substrate.
  270. Toshima Takayuki (Nirasaki JPX) Aoyama Tohru (Yamanashi-ken JPX), Method and apparatus for treating film coated on substrate.
  271. Thakur, Randhir P. S., Method and apparatus to control the formation of layers useful in integrated circuits.
  272. Wolke, Klaus; Weber, Martin, Method and device for drying substrates.
  273. St-Germain, Nicolas, Method and device for remote monitoring of LED lamps.
  274. Kitano, Junichi; Matsuyama, Yuji; Kitano, Takahiro; Yaegashi, Hidetami, Method and system for coating and developing.
  275. Inoue, Yoichi; Sakashita, Yoshihiko; Watanabe, Katsumi; Kawakami, Nobuyuki; Ishii, Takahiko; Muraoka, Yusuke; Saito, Kimitsugu; Iwata, Tomomi; Mizobata, Ikuo; Miyake, Takashi; Kitakado, Ryuji, Method and system for processing substrate.
  276. Christenson Kurt K., Method and system to control the concentration of dissolved gas in a liquid.
  277. Konishi Nobuo (Kofu JPX) Takamori Hideyuki (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Tateyama Kiyohisa (Kumamoto JPX) Murakami Masaaki (Kumamoto JPX) Morioka Norimitsu (Kumamoto JPX) Takekuma Taka, Method for applying process solution to substrates.
  278. Toshima Takayuki,JPX ; Konishi Nobuo,JPX, Method for developing front surface of substrate with improved developing function of developing solution and apparatus thereof.
  279. Yoshihara, Kousuke; Tanaka, Keiichi; Yamamoto, Taro; Kyouda, Hideharu; Takeguchi, Hirofumi; Ookouchi, Atsushi, Method for developing processing and apparatus for supplying developing solution.
  280. Semba Norio,JPX, Method for developing treatment.
  281. Wolke Klaus,DEX ; Weber Martin,DEX, Method for drying substrates.
  282. Matsumura Kimiharu (Kumamoto JPX) Sakai Hiroyuki (Nishigoshi JPX) Murakami Masaaki (Kumamoto JPX) Oda Tetsuya (Tamana JPX) Yamaguchi Chizo (Sencho JPX), Method for heat-processing semiconductor device and apparatus for the same.
  283. David Alan Bourne ; Sivaraj Sivarama Krishnan IN, Method for planning/controlling robot motion.
  284. Wagener Thomas J. ; Patrin John C. ; Inhofer William P. ; Siefering Kevin L., Method for transferring a microelectronic device to and from a processing chamber.
  285. Gurer Emir ; Zhong Tom ; Lewellen John W. ; Lee Eddie, Method for two dimensional adaptive process control of critical dimensions during spin coating process.
  286. Gurer, Emir; Zhong, Tom; Lewellen, John W.; Lee, Eddie, Method for two dimensional adaptive process control of critical dimensions during spin coating process.
  287. Matsui Hiroshi,JPX, Method of an apparatus for forming film on substrate by sensing atmospheric pressure.
  288. Ogami Nobutoshi,JPX ; Nishizawa Hisao,JPX, Method of and an apparatus for processing a substrate.
  289. Onishi Hiroyuki (Otsu JPX) Sano Tetsuo (Kyoto JPX) Hoki Tetsuo (Kyoto JPX) Kodama Eiji (Higashiosaka JPX) Tsujinaka Hisayuki (Kyoto JPX) Kitakado Ryuji (Kyoto JPX), Method of and apparatus for detecting pattern defects.
  290. Akimoto Masami,JPX ; Yoshihara Kosuke,JPX ; Fukuda Yuji,JPX, Method of and apparatus for processing photoresist, method of evaluating photoresist film, and processing apparatus using the evaluation method.
  291. Kimura, Masahiro, Method of and apparatus for processing substrate.
  292. Shinbara Kaoru,JPX ; Eitoku Atsuro,JPX ; Miyake Katsuyuki,JPX, Method of and apparatus for processing substrate.
  293. Mimasaka Masahiro,JPX ; Tanaka Akiko,JPX ; Takamura Yukihiro,JPX, Method of and apparatus for supplying developing solution onto substrate.
  294. Nishida Masami (Kyoto JPX) Himoto Masahiro (Kyoto JPX) Hamada Tetsuya (Kyoto JPX) Yokono Noriaki (Kyoto JPX) Okamoto Takeo (Kyoto JPX), Method of and device for transporting semiconductor substrate in semiconductor processing system.
  295. Burkman Don C. (Excelsior MN), Method of apparatus for applying chemicals to substrates in an acid processing system.
  296. Takeshita, Kazuhiro; Nagashima, Shinji; Muramatsu, Makoto; Mizutani, Yoji; Yano, Kazutoshi; Katayama, Kyoshige, Method of coating film, coating unit, aging unit, solvent replacement unit, and apparatus for coating film.
  297. Chiba Takatoshi (Kyoto JPX), Method of controlling heat treatment apparatus for substrate.
  298. Masuda Yoshihiro (Kyoto JPX) Yagi Takashi (Kyoto JPX) Nishimura Eiji (Kyoto JPX), Method of controlling temperature for drying photosensitive material.
  299. Mimasaka Masahiro (Kyoto JPX), Method of detecting an end point of surface treatment.
  300. Tateyama Kiyohisa (Kumamoto JPX) Motoda Kimio (Kumamoto JPX) Sekiguchi Kenji (Yamanashi-ken JPX) Omori Tsutae (Kumamoto JPX), Method of forming a coating film.
  301. Tateyama Kiyohisa,JPX ; Motoda Kimio,JPX ; Sekiguchi Kenji,JPX ; Omori Tsutae,JPX, Method of forming a coating film and coating apparatus.
  302. Hasebe Keizo (Kofu JPX) Fujimoto Akihiro (Kumamoto-ken JPX) Inada Hiroichi (Kumamoto JPX) Iino Hiroyuki (Nirasaki JPX) Kitamura Shinzi (Kumamoto-ken JPX) Deguchi Masatoshi (Kumamoto JPX) Nambu Mitsuh, Method of forming coating film and apparatus therefor.
  303. Hasebe Keizo,JPX ; Fujimoto Akihiro,JPX ; Inada Hiroichi,JPX ; Iino Hiroyuki,JPX ; Kitamura Shinzi,JPX ; Deguchi Masatoshi,JPX ; Nambu Mitsuhiro,JPX, Method of forming coating film and apparatus therefor.
  304. Yanagimoto Katsutoshi (Hikone JPX) Nagai Shoichi (Hikone JPX), Method of forming corrosion resistant film on the surface of substrate composed of copper or copper alloy.
  305. Kitano, Takahiro; Kobayashi, Shinji; Esaki, Yukihiko; Morikawa, Masateru, Method of forming film and apparatus thereof.
  306. Konishi Nobuo,JPX ; Hirose Keizo,JPX, Method of forming resist film.
  307. Orgami Nobutoshi (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX), Method of heat treating a substrate with standby and treatment time periods.
  308. Biche Michael R. ; Anderson H. Alexander, Method of processing a substrate in a photolithography system utilizing a thermal process module.
  309. Yaegashi Hidetami,JPX ; Kawakami Yasunori,JPX ; Park Jae Hoon,JPX ; Kanzawa Keiko,JPX ; Katano Takayuki,JPX ; Toshima Takayuki,JPX ; Kakazu Yuji,JPX, Method of processing resist utilizing alkaline component monitoring.
  310. Yaegashi Hidetami,JPX ; Kawakami Yasunori,JPX ; Park Jae Hoon,JPX ; Kanzawa Keiko,JPX ; Katano Takayuki,JPX ; Toshima Takayuki,JPX ; Kakazu Yuji,JPX, Method of processing resist utilizing alkaline component monitoring.
  311. Yamamoto Toshio (Shiga JPX) Kawasaki Masaru (Shiga JPX) Kandori Takefumi (Shiga JPX) Ando Ryoichi (Shiga JPX), Method of processing thin metal sheets by photoetching.
  312. Hrmann Michael (Mmbris DEX) Bach Otto (Schneck DEX), Method of producing a tantalum stock material of high ductility.
  313. Rice,Mike; Hudgens,Jeffrey; Carlson,Charles; Weaver,William Tyler; Lowrance,Robert; Englhardt,Eric; Hruzek,Dean C.; Silvetti,Mario David; Kuchar,Michael; Van Katwyk,Kirk; Hoskins,Van; Shah,Vinay, Method of retaining a substrate during a substrate transferring process.
  314. Tanaka Masato (Shiga JPX), Method of treating wafer surface.
  315. Mandal Robert P. (Saratoga CA) Grambow James C. (San Jose CA) Bettes Ted C. (Newark CA) Sauer Donald R. (San Jose CA) Gurer Emir (Sunnyvale CA) Ward Edmond R. (Monte Sereno CA), Method of uniformly coating a substrate.
  316. Mandal Robert P. ; Grambow James C. ; Dettes Ted C. ; Sauer Donald R. ; Gurer Emir ; Ward Edmond R., Method of uniformly coating a substrate.
  317. Alan E. Walter, Methods for treating objects.
  318. Walter Alan E., Methods for treating objects.
  319. Kloiber Allan J. (Marshall Township ; Allegheny County PA) Bubien Gary G. (Center PA) Osmanski Gerald S. (Brighton Township ; Beaver County PA), Modular apparatus and method for surface treatment of parts with liquid baths.
  320. Slocum Alexander H. ; Van Doren Matthew J. ; Ziegenhagen ; II Rodney Scott ; Sauer Don, Modular system.
  321. Asakawa Teruo,JPX ; Saeki Hiroaki,JPX, Multi-chamber treatment system.
  322. Muka Richard S., Multi-level substrate processing apparatus.
  323. Fairbairn Kevin ; Sinha Ashok, Multideck wafer processing system.
  324. Lowrance, Robert B.; Grunes, Howard, Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers.
  325. Yoshio Kimura JP; Issei Ueda JP, Multistage spin type substrate processing system.
  326. Moreau Defarges Alain,FRX ; Moreau Defarges Xavier,FRX, Needleless jet injection device comprising a moulded-on cartridge.
  327. Baroudi Walid ; Saghafian David, Photoresist coater.
  328. Yoshihara Kosuke,JPX, Photoresist coating method and apparatus.
  329. Awazu Yasunobu (Kyoto JPX) Masuda Yoshihiro (Kyoto JPX) Nishimura Eiji (Kyoto JPX), Photosensitive material detecting apparatus.
  330. Hatakeyama, Jun; Watanabe, Jun; Harada, Yuji, Polymer, chemically amplified resist composition and patterning process.
  331. Yoshida,Tetsuo; Sasaki,Yoshiaki; Saeki,Hiroaki; Taniyama,Yasushi; Takizawa,Hiroshi, Port structure in semiconductor processing system.
  332. Blackwood Robert S. (Chanhassen MN), Positive developing method and apparatus.
  333. McConnell Christopher F. (West Chester PA) Walter Alan E. (Exton PA), Process and apparatus for drying surfaces.
  334. Kawano Yukihiro,JPX ; Takekuma Takashi,JPX, Process liquid film forming apparatus.
  335. Takekuma, Takashi; Furusho, Toshinobu; Ohto, Takeshi; Miyamoto, Hiroyuki; Yoshihara, Kousuke; Hori, Shinya; Hara, Hiroyuki, Process liquid supply mechanism and process liquid supply method.
  336. Kimura Yoshio,JPX ; Okubo Takahiro,JPX, Process solution supply system, substrate processing apparatus employing the system, and intermediate storage mechanism employed in the system.
  337. Tateyama Kiyohisa,JPX, Processing apparatus.
  338. Semba Norio,JPX ; Kitano Junichi,JPX ; Katano Takayuki,JPX, Processing apparatus and method using solution.
  339. Tateyama Kiyohisa,JPX ; Nomura Masafumi,JPX ; Tomoeda Takayuki,JPX, Processing apparatus and processing method.
  340. Tateyama Kiyohisa,JPX ; Nomura Masafumi,JPX ; Tomoeda Takayuki,JPX, Processing apparatus and processing method.
  341. Sasada Shigeru (Kyoto JPX) Aoki Kaoru (Kyoto JPX) Kodama Mitsumasa (Kyoto JPX) Sugimoto Kenji (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX) Inoue Hidekazu (Kyoto JPX), Processing apparatus having parts for thermal and non-thermal treatment of substrates.
  342. Harada, Koji; Nakayama, Hisakazu; Ookura, Jun, Processing apparatus, processing system, distinguishing method, and detecting method.
  343. Matsushita, Minoru; Kodashima, Yasushi; Kumai, Toshikazu, Processing apparatus, transferring apparatus and transferring method.
  344. Moriyama, Masashi; Yamahira, Yutaka; Matsuyama, Yuji, Processing liquid supply unit.
  345. Minami Tomohide,JPX, Processing solution supply apparatus.
  346. Harada Koji,JPX ; Kawano Fumihiko,JPX, Processing solution supplying apparatus, processing apparatus and processing method.
  347. Hisai Akihiro,JPX ; Matsunaga Minobu,JPX ; Kobayashi Hiroshi,JPX, Processing system hot plate construction substrate.
  348. Oh, Hilario, Recipe cascading in a wafer processing system.
  349. Kitano, Takahiro; Hama, Manabu; Sugimoto, Shinichi; Hirakawa, Naoya, Reduced-pressure drying unit and coating film forming method.
  350. Ogata Kunie,JPX, Resist coating and developing unit.
  351. Kosuke Yoshihara JP, Resist film forming method and resist coating apparatus.
  352. Yoshihara, Kosuke, Resist film forming method and resist coating apparatus.
  353. Yuji Matsuyama JP, Resist pattern forming method and film forming method.
  354. Akimoto Masami (Kikuyo JPX) Kimura Yoshio (Kumamoto JPX) Hirakawa Osamu (Kumamoto JPX) Anai Noriyuki (Kumamoto JPX) Tateyama Masanori (Kumamoto JPX) Sakamoto Yasuhiro (Kumamoto JPX), Resist process apparatus.
  355. Hasebe Keizo,JPX ; Iino Hiroyuki,JPX ; Semba Norio,JPX ; Kimura Yoshio,JPX, Resist processing apparatus.
  356. Akimoto Masami,JPX ; Ogawa Shizuo,JPX ; Nagano Toshihiko,JPX, Resist processing apparatus having an interface section including two stacked substrate waiting tables.
  357. Ueda Tatsuji, Resist processing apparatus which measures temperature of heat-sensing substrate and measuring method therein.
  358. Tateyama Kiyohisa (Kumamoto JPX) Akimoto Masami (Kumamoto JPX) Ushijima Mitsuru (Tama JPX), Resist processing method.
  359. Toshima Takayuki,JPX ; Konishi Nobuo,JPX, Resist processing method.
  360. Fukuda Yuji ; Ogata Kunie,JPX, Resist processing method and apparatus.
  361. Tomoeda Takayuki (Kumamoto-ken JPX) Murakami Masaaki (Kumamoto-ken JPX) Nishioka Kenichi (Kumamoto-ken JPX), Resist processing method and apparatus.
  362. Tomoeda Takayuki,JPX ; Murakami Masaaki,JPX ; Nishioka Kenichi,JPX, Resist processing method and apparatus.
  363. Toshima, Takayuki; Konishi, Nobuo, Resist processing method and resist processing apparatus.
  364. Kiba Yukio,JPX ; Semba Norio,JPX ; Hasebe Keizo,JPX, Resist processing method and resist processing system.
  365. Fukuda, Yuji; Ogata, Kunie, Resist processing method controlled through reflectivity data.
  366. Akimoto Masami,JPX, Resist processing system.
  367. Okamura Kouji,JPX ; Akimoto Masami,JPX, Resist processing system and resist processing method.
  368. Kiba Yukio,JPX ; Semba Norio,JPX ; Hasebe Keizo,JPX, Resist processing system having process solution deaeration mechanism.
  369. Kumar, Subodha; Ramanan, Natarajan; Sriskandarajah, Chelliah, Robotic system control.
  370. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  371. Schmidt Wayne J. ; Oberlitner Thomas H., Robots for microelectronic workpiece handling.
  372. Sugimoto Kenji (Shiga JPX), Rotary wafer drier.
  373. Mukuta, Nobuhiro; Kawai, Jun, Scheduling method and program for a substrate processing apparatus.
  374. Mukuta, Nobuhiro; Kawai, Jun; Akao, Kiyoshi; Horiguchi, Osamu, Scheduling method and program for a substrate processing apparatus.
  375. Hiroki Tsutomu,JPX, Semiconductor processing apparatus.
  376. Hanson, Kyle; Dix, Mark; Woodruff, Daniel J.; Schmidt, Wayne J.; Coyle, Kevin W., Semiconductor processing apparatus having linear conveyer system.
  377. Savage, Richard N.; Menagh, Frank S.; Carvalheira, Helder R.; Troiani, Philip A.; Cossentine, Dan L.; Vaughan, Eric R.; Mayer, Bruce E., Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system.
  378. Toshima, Takayuki; Omori, Tsutae; Yamashita, Masami, Silylation treatment unit and method.
  379. Uno Masahito (Kanagawa) Sugimoto Koichi (Hiratsuka) Taniguchi Ichiro (Yokohama) Tanaka Katuhisa (Ayase JPX), Six-degree-of-freedom articulated robot mechanism and assembling and working apparatus using same.
  380. Matsuyama, Yuji; Nagamine, Shuichi, Solution processing apparatus.
  381. Yuji Matsuyama JP; Shuichi Nagamine JP, Solution processing apparatus.
  382. Matsuyama, Yuji; Nagamine, Shuichi, Solution processing apparatus and method.
  383. Matsuyama, Yuji; Nagamine, Shuichi, Solution processing apparatus and method.
  384. Takekuma Takashi,JPX, Solution treatment apparatus.
  385. Nagamine, Shuichi, Solution treatment method and solution treatment unit.
  386. Nagamine, Shuichi, Solution treatment unit.
  387. Hasebe Keizo,JPX ; Fujimoto Akihiro,JPX ; Inada Hiroichi,JPX ; Iino Hiroyuki,JPX ; Kitamura Shinzi,JPX ; Deguchi Masatoshi,JPX ; Nambu Mitsuhiro,JPX, Solvent and resist spin coating apparatus.
  388. Mitsuhiro Sakai JP; Hideyuki Takamori JP; Masafumi Nomura JP, Spin coating apparatus.
  389. Sasaki Tadashi (all Kyoto JPX) Okamoto Yoshio (all Kyoto JPX) Kizaki Koji (all Kyoto JPX), Spin coating apparatus.
  390. Shoda Mikio (Kyoto JPX) Yamamoto Masaaki (Kyoto JPX), Spin coating apparatus with an upper spin plate cleaning nozzle.
  391. Sakai Mitsuhiro,JPX ; Takamori Hideyuki,JPX ; Nomura Masafumi,JPX, Spin coating process.
  392. Clapp Daniel W. (Hackettstown NJ), Storage rack.
  393. Sakai, Takamasa; Hirae, Sadao, Substrate cleaning apparatus.
  394. Morinishi Kenya,JPX ; Ohtani Masami,JPX ; Nishimura Joichi,JPX ; Morita Akihiko,JPX, Substrate cleaning apparatus and method.
  395. Kobayashi, Shinji; Kitano, Takahiro; Morikawa, Masateru; Takeshita, Kazuhiro; Kawafuchi, Yoshiyuki, Substrate coating unit and substrate coating method.
  396. Ohtani Masami,JPX, Substrate container cassette, interface mechanism, and substrate processing.
  397. Matsunaga Minobu (Kyoto JPX) Tsuji Masao (Kyoto JPX), Substrate cooling apparatus.
  398. Matsunaga Minobu (Kyoto JPX) Mizohata Yasuhiro (Kyoto JPX), Substrate cooling device and substrate heat-treating apparatus.
  399. Mizohata Yasuhiro (Kyoto JPX) Matsunaga Minobu (Kyoto JPX), Substrate cooling method and apparatus.
  400. Okuda Seiichiro,JPX ; Sugimoto Kenji,JPX, Substrate developing method and apparatus.
  401. Masahiro Kimura JP, Substrate dryer.
  402. Masahiro Kimura JP; Hiroyuki Araki JP, Substrate drying apparatus and substrate processing apparatus.
  403. Nakajima Toshihiro (Kyoto JPX) Chiba Takatoshi (Kyoto JPX) Nishii Kiyofumi (Kyoto JPX) Sato Toru (Kyoto JPX), Substrate heat treatment apparatus.
  404. Tateyama Kiyohisa,JPX ; Hirose Osamu,JPX, Substrate heat treatment table apparatus.
  405. Hasegawa Moriyoshi (Kyoto) Matsumura Yoshio (Kyoto) Fukutomi Yoshiteru (Kyoto JPX), Substrate heat-treating apparatus.
  406. Kawamoto Takanori,JPX ; Ohtani Masami,JPX ; Imanishi Yasuo,JPX ; Tsuji Masao,JPX ; Iwami Masaki,JPX ; Nishimura Joichi,JPX ; Morita Akihiko,JPX, Substrate heat-treating apparatus.
  407. Fujikawa Kazunori,JPX ; Yasui Kenji,JPX ; Nishizawa Hisao,JPX, Substrate holder.
  408. Nonomura Masahiro (Kyoto JPX) Kitagawa Masaru (Kyoto JPX), Substrate holder for a substrate spin treating apparatus.
  409. Fukutomi Yoshiteru (Kyoto JPX) Ohtani Masami (Kyoto JPX) Nakamura Yasushi (Kyoto JPX), Substrate holding apparatus of a simple structure for holding a rotating substrate, and a substrate processing apparatus.
  410. Blackwood Robert S. (Lubbock TX) Vaughn David R. (Lubbock TX) Masten Billy R. (Shallowater TX) Vaughn Timothy B. (Lubbock TX), Substrate location and detection apparatus.
  411. Matsuyama Yuji,JPX, Substrate process apparatus.
  412. Hideyuki Takamori JP; Kiyohisa Tateyama JP; Kengo Mizosaki JP; Noriyuki Anai JP; Mitsuhiro Sakai JP; Shinobu Tanaka JP; Yoichi Honda JP; Yuji Shimomura JP, Substrate process method and substrate process apparatus.
  413. Takamori Hideyuki,JPX ; Tateyama Kiyohisa,JPX ; Mizosaki Kengo,JPX ; Anai Noriyuki,JPX ; Sakai Mitsuhiro,JPX ; Tanaka Shinobu,JPX ; Honda Yoichi,JPX ; Shimomura Yuji,JPX, Substrate process method and substrate process apparatus.
  414. Akira Izumi JP, Substrate processing apparatus.
  415. Deguchi, Masatoshi; Sekimoto, Eiichi, Substrate processing apparatus.
  416. Eitoku Atsuro,JPX ; Kunihiro Takao,JPX, Substrate processing apparatus.
  417. Fukutomi, Yoshiteru; Yoshioka, Katsushi; Inagaki, Yukihiko, Substrate processing apparatus.
  418. Hashimoto, Koji, Substrate processing apparatus.
  419. Hirose Osamu,JPX, Substrate processing apparatus.
  420. Issei Ueda JP, Substrate processing apparatus.
  421. Issei Ueda JP; Takashi Takekuma ; Kenji Okumura JP, Substrate processing apparatus.
  422. Joichi Nishimura JP; Masami Ohtani JP; Yasuhiko Hashimoto JP, Substrate processing apparatus.
  423. Kajino, Itsuki; Adachi, Hideki, Substrate processing apparatus.
  424. Kanagawa, Kouzou, Substrate processing apparatus.
  425. Kinose Kazuo,JPX, Substrate processing apparatus.
  426. Masami Akimoto JP, Substrate processing apparatus.
  427. Masatoshi Deguchi JP, Substrate processing apparatus.
  428. Matsumura Yoshio (Hikone JPX) Shimaji Katsumi (Hikone JPX), Substrate processing apparatus.
  429. Miya Katsuhiko,JPX ; Izumi Akira,JPX, Substrate processing apparatus.
  430. Nishimura, Joichi; Ohtani, Masami; Hashimoto, Yasuhiko, Substrate processing apparatus.
  431. Nishimura, Joichi; Ohtani, Masami; Hashinoki, Kenji; Shiga, Masayoshi; Hashimoto, Koji, Substrate processing apparatus.
  432. Ohtani Masami,JPX, Substrate processing apparatus.
  433. Ohtani Masami,JPX ; Matsunaga Minobu,JPX ; Ueyama Tutomu,JPX ; Kitakado Ryuji,JPX ; Aoki Kaoru,JPX ; Tsuji Masao,JPX, Substrate processing apparatus.
  434. Ohtani Masami,JPX ; Sasaki Tadashi,JPX, Substrate processing apparatus.
  435. Okuda, Seiichiro; Sugimoto, Hiroaki, Substrate processing apparatus.
  436. Sawada Atsushi,JPX ; Okuda Yasuhiko,JPX ; Komatsubara Shouji,JPX, Substrate processing apparatus.
  437. Shibao Takuya,JPX ; Osaki Toshiyuki,JPX ; Hasegawa Koji,JPX, Substrate processing apparatus.
  438. Shigemori, Kazuhito; Sanada, Masakazu; Matsunaga, Minobu; Yoshioka, Katsushi; Sugimoto, Kenji; Aoki, Kaoru; Yano, Moritaka; Yamamoto, Satoshi; Mitsuhashi, Tsuyoshi; Nagao, Takashi; Kodama, Mitsumasa;, Substrate processing apparatus.
  439. Sugimoto, Hiroaki; Okuda, Seiichiro; Kuroda, Takuya, Substrate processing apparatus.
  440. Tanaka, Akiko; Sanada, Masakazu; Tamada, Osamu; Harumoto, Masahiko; Nakano, Kayoko, Substrate processing apparatus.
  441. Ueda Issei,JPX, Substrate processing apparatus.
  442. Yoshihara, Kousuke; Fujimoto, Akihiro, Substrate processing apparatus.
  443. Yoshihara, Kousuke; Fujimoto, Akihiro, Substrate processing apparatus.
  444. Yoshioka Katsushi,JPX ; Ogura Hiroyuki,JPX ; Sanari Takuya,JPX, Substrate processing apparatus.
  445. urface ; said end sleeves being disposed around said first and second ends of the polymer-surrounded support stent with the end sleeves' internal surfaces in contact with the polymer tubular member a, Substrate processing apparatus.
  446. Yoshioka Katsushi,JPX ; Fukutomi Yoshiteru,JPX ; Sugimoto Kenji,JPX, Substrate processing apparatus and air supply method in substrate processing apparatus.
  447. Matsuyama Yuji,JPX ; Nagamine Shuichi,JPX ; Asaka Koichi,JPX, Substrate processing apparatus and method.
  448. Morimoto Toru (Kyoto JPX) Hashinoki Kenji (Kyoto JPX) Hamada Tetsuya (Kyoto JPX) Kamei Kenji (Kyoto JPX), Substrate processing apparatus and method.
  449. Morimoto Toru (Kyoto JPX) Hashinoki Kenji (Kyoto JPX) Hamada Tetsuya (Kyoto JPX) Kamei Kenji (Kyoto JPX), Substrate processing apparatus and method.
  450. Adachi, Hideki; Miya, Katsuhiko; Izumi, Akira; Kajino, Itsuki, Substrate processing apparatus and substrate processing method.
  451. Akimoto Masami,JPX, Substrate processing apparatus and substrate processing method.
  452. Iseki, Izuru; Ueyama, Tsutomu, Substrate processing apparatus and substrate processing method.
  453. Issei Ueda JP; Shinichi Hayashi JP; Naruaki Iida JP; Yuji Matsuyama JP; Yoichi Deguchi JP, Substrate processing apparatus and substrate processing method.
  454. Jun Ookura JP; Koji Harada JP, Substrate processing apparatus and substrate processing method.
  455. Kitano, Takahiro; Matsuyama, Yuji; Kitano, Junichi, Substrate processing apparatus and substrate processing method.
  456. Masami Akimoto JP, Substrate processing apparatus and substrate processing method.
  457. Nishi, Takanori; Shirakawa, Eiichi, Substrate processing apparatus and substrate processing method.
  458. Okamoto, Yoshio, Substrate processing apparatus and substrate processing method.
  459. Okubo, Kenichi; Kanbayashi, Akira, Substrate processing apparatus and substrate processing method.
  460. Ookura, Jun; Harada, Koji, Substrate processing apparatus and substrate processing method.
  461. Ueda, Issei; Hayashi, Shinichi; Iida, Naruaki; Matsuyama, Yuji; Deguchi, Yoichi, Substrate processing apparatus and substrate processing method.
  462. Ueda, Issei; Kudou, Hiroyuki, Substrate processing apparatus and substrate processing method.
  463. Iwata, Tomomi; Muraoka, Yusuke; Saito, Kimitsugu; Mizobata, Ikuo; Miyake, Takashi; Kitakado, Ryuji, Substrate processing apparatus equipping with high-pressure processing unit.
  464. Morita Akihiko,JPX ; Ohtani Masami,JPX ; Imanishi Yasuo,JPX ; Tsuji Masao,JPX ; Iwami Masaki,JPX ; Nishimura Joichi,JPX ; Nishimura Kazuhiro,JPX ; Hamada Tetsuya,JPX ; Yamamoto Satoshi,JPX ; Kamei Ke, Substrate processing apparatus having regulated power consumption and method therefor.
  465. Shiga, Masayoshi; Hashinoki, Kenji; Ohtani, Masami; Nishimura, Joichi, Substrate processing apparatus, substrate inspection method and substrate processing system.
  466. Ohtani Masami,JPX ; Imanishi Yasuo,JPX ; Tsuji Masao,JPX ; Kawamoto Takanori,JPX ; Iwami Masaki,JPX ; Nishimura Joichi,JPX ; Morita Akihiko,JPX, Substrate processing apparatus, substrate transport apparatus and substrate transfer apparatus.
  467. Matsumura Yoshio,JPX, Substrate processing device and method for substrate from the substrate processing device.
  468. Hamada Tetsuya,JPX ; Inoue Hidekazu,JPX, Substrate processing management system with recipe copying functions.
  469. Nishijima, Kazuhiro; Mizuno, Tsuyoshi, Substrate processing method.
  470. Takamori Hideyuki,JPX ; Nomura Masafumi,JPX ; Omori Tsutae,JPX, Substrate processing method.
  471. Fujimoto Akihiro (Kumamoto-ken JPX) Takekuma Takashi (Yamaga JPX) Sonobe Kiyomi (Tokyo JPX), Substrate processing method and substrate processing apparatus.
  472. Kitano, Junichi, Substrate processing method and substrate processing apparatus.
  473. Nakano, Masayuki; Deguchi, Yoichi, Substrate processing method and substrate processing apparatus.
  474. Toshima, Takayuki; Orii, Takehiko, Substrate processing method and substrate processing apparatus.
  475. Toshima, Takayuki; Orii, Takehiko, Substrate processing method and substrate processing apparatus.
  476. Fujishima, Sadayuki, Substrate processing method and substrate processing system.
  477. Kitano, Takahiro; Sugimoto, Shinichi; Kobayashi, Shinji; Hirakawa, Naoya; Fukutomi, Akira; Ishizaka, Nobukazu, Substrate processing method and substrate processing system.
  478. Koji Harada JP; Ryoichi Uemura JP, Substrate processing method and substrate processing unit.
  479. Fukuda, Yuji; Ogata, Kunie, Substrate processing system and substrate processing method.
  480. Kitano, Takahiro; Akimoto, Masami; Toshimitsu, Takafumi, Substrate processing system and substrate processing method.
  481. Tateyama, Masanori; Fujimaru, Syuzo, Substrate processing system and substrate processing method.
  482. Tateyama, Masanori; Miyata, Akira, Substrate processing system and substrate processing method.
  483. Tateyama, Masanori; Okubo, Kenichi; Ookura, Jun, Substrate processing system and substrate processing method.
  484. Yuji Fukuda ; Kunie Ogata JP, Substrate processing system and substrate processing method.
  485. Kitano, Takahiro; Sugimoto, Shinichi; Kobayashi, Shinji; Hirakawa, Naoya; Fukutomi, Akira; Ishizaka, Nobukazu, Substrate processing unit.
  486. Kitano, Takahiro; Kobayashi, Shinji; Esaki, Yukihiko; Morikawa, Masateru, Substrate processing unit and processing method.
  487. Shinbara Kaoru,JPX, Substrate processing unit and substrate processing apparatus using the same.
  488. Sugimoto Kenji,JPX ; Yoshioka Katsushi,JPX ; Okuda Seiichiro,JPX ; Mitsuhashi Tsuyoshi,JPX, Substrate spin coating apparatus.
  489. Kawamoto Takanori,JPX ; Fujita Mitsuhiro,JPX, Substrate spin treating apparatus.
  490. Ueyama Tsutomu,JPX ; Izumi Akira,JPX ; Adachi Hideki,JPX, Substrate spin treating apparatus.
  491. Morita Akihiko,JPX ; Ueno Kenji,JPX, Substrate spin treating method and apparatus.
  492. Okuda Seiichiro,JPX ; Sugimoto Kenji,JPX ; Yoshii Hiroshi,JPX, Substrate spin treating method and apparatus.
  493. Yoshioka Katsushi (Kyoto JPX) Fukutomi Yoshiteru (Kyoto JPX) Mitsuhashi Tsuyoshi (Kyoto JPX) Sugimoto Kenji (Kyoto JPX), Substrate spin treating method and apparatus.
  494. Ueda Issei,JPX ; Yamaguchi Tadayuki,JPX, Substrate transfer apparatus and substrate processing apparatus.
  495. Fujii, Kenji; Asa, Fuminori; Hayama, Ryuichi; Komura, Tomoyuki, Substrate transfer apparatus and substrate transfer method.
  496. Itaba Masayuki,JPX ; Nishimura Kazuhiro,JPX, Substrate transfer method and interface apparatus.
  497. Fukutomi Yoshiteru (Kyoto JPX) Ohtani Masami (Kyoto JPX) Okamoto Takeo (Kyoto JPX), Substrate transport apparatus.
  498. Yasuo Kawamatsu JP; Yoshihiko Watanabe JP; Yasuhiko Hashimoto JP, Substrate transport apparatus and transport teaching system.
  499. Koyama Yasufumi,JPX, Substrate transport method and apparatus.
  500. Fukutomi, Yoshiteru; Sugimoto, Kenji; Ito, Takashi; Okamoto, Takeo; Inagaki, Yukihiko; Yoshioka, Katsushi; Mitsuhashi, Tsuyoshi, Substrate treating apparatus.
  501. Inagaki, Yukihiko, Substrate treating apparatus.
  502. Koyama, Yasufumi; Kamei, Kenji; Kitamoto, Toru; Hashinoki, Kenji; Yamamoto, Satoshi; Dainin, Toshiaki, Substrate treating apparatus.
  503. Morita Akihiko,JPX ; Nishimura Joichi,JPX ; Ohtani Masami,JPX, Substrate treating apparatus.
  504. Shinbara Kaoru (Shiga JPX) Kurata Yasuhiro (Shiga JPX) Sawamura Masashi (Shiga JPX), Substrate treating apparatus.
  505. Tanaka Masato,JPX ; Kobayashi Teruyuki,JPX, Substrate treating apparatus.
  506. Tateyama Kiyohisa,JPX, Substrate treating apparatus.
  507. Yoshitani Mitsuaki,JPX, Substrate treating apparatus.
  508. Sugimoto, Kenji; Matsunaga, Minobu; Sanada, Masakazu; Yoshioka, Katsushi; Aoki, Kaoru; Yano, Moritaka; Yamamoto, Satoshi; Mitsuhashi, Tsuyoshi; Nagao, Takashi; Kodama, Mitsumasa, Substrate treating apparatus and method.
  509. Yoshitani Mitsuaki,JPX ; Wada Eiichi,JPX ; Mori Makoto,JPX ; Tanaka Iwao,JPX ; Matsushita Yoshihiko,JPX, Substrate treating apparatus and method for treating substrate.
  510. Hiroyuki Araki JP; Kenichiro Arai JP; Masaaki Yabuta JP, Substrate treating apparatus and substrate treating method.
  511. Hideyuki Takamori JP; Kiyohisa Tateyama JP; Kengo Mizosaki JP; Noriyuki Anai JP; Yoshitaka Matsuda JP, Substrate treating method.
  512. Iseki Izuru,JPX ; Yamashita Tetsuro,JPX, Substrate treating method and apparatus.
  513. Mitsuhashi Tsuyoshi,JPX ; Wada Takuya,JPX ; Hashimoto Koji,JPX ; Osada Naoyuki,JPX, Substrate treating method and apparatus.
  514. Fujimoto Akihiro,JPX, Substrate treatment apparatus.
  515. Akimoto Masami (Kumamoto JPX) Gotou Kazuyuki (Kumamoto JPX) Ito Yasushi (Kawasaki NY JPX) Okumura Katsuya (Poughkeepsie NY), Substrates processing device.
  516. Ueyama Tsutomu (Kyoto JPX) Adachi Hideki (Kyoto JPX) Matsumura Yoshio (Hikone JPX) Tanaka Yasuhide (Kyoto JPX), Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus.
  517. Akimoto Masami (Kikuyo JPX), Supply nozzle for applying liquid resist to a semiconductor wafer.
  518. Tanaka Masato (Shiga JPX), Surface treating apparatus and method using vapor.
  519. Yamada Takuma (Moriyama JPX), Surface treatment method and apparatus therefor.
  520. Yamada Takuma (Moriyama JPX), Surface treatment method and apparatus therefor.
  521. Kobayashi Atsuo (Hikone JPX) Yamada Takuma (Moriyama JPX) Akao Kiyoshi (Hikone JPX), Surface treatment method and apparatus thereof.
  522. Kobayashi Atsuo (Hikone JPX) Yamada Takuma (Moriyama JPX) Akao Kiyoshi (Hikone JPX), Surface treatment method and apparatus thereof.
  523. Ishikawa Yoshio (Tokyo JPX) Arami Junichi (Tokyo JPX) Ikeda Towl (Kofu JPX) Iwata Teruo (Nirasaki JPX), Surface-heating apparatus and surface-treating method.
  524. Tateyama Kiyohisa (Kumamoto JPX) Hasebe Keizo (Kofu JPX), System and method for applying a liquid.
  525. Kashihara, Hideaki, System for and method of managing jobs.
  526. Yoshida, Takushi; Hamada, Tetsuya, System for and method of processing substrate.
  527. Tanaka Masato (Shiga JPX), System for treating a surface of a rotating wafer.
  528. Simondet, Sean D., Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector.
  529. Biche Michael B. (Union City CA) Nguyen Vuong P. (San Jose CA), Thermal control line for delivering liquid to a point of use in a photolithography system.
  530. Charles Schaper ; Douglas W. Young ; Hooman Bolandi, Thermal cycling module.
  531. Schaper Charles D., Thermal cycling module and process using radiant heat.
  532. Biche Michael R. (Union City CA) Anderson H. Alexander (Santa Cruz CA), Thermal process module for substrate coat/develop system.
  533. Matsushita Masanao,JPX ; Taniguchi Hideyuki,JPX, Thermal processing apparatus.
  534. Adachi, Hideki, Thin film forming apparatus, film supplier, film cassette, transport mechanism and transport method.
  535. Kroeker Tony R., Three chamber load lock apparatus.
  536. Adachi Hideki,JPX ; Inada Tatsuhiko,JPX, Transfer apparatus for and method of transferring substrate.
  537. Takamatsu Kazuhisa (Kyoto JPX) Hisai Akihiro (Kyoto JPX) Kato Hiroshi (Kyoto JPX) Ohtani Masami (Kyoto JPX), Treating liquid supplying apparatus for a substrate spin treating apparatus.
  538. Hayashi Toyohide,JPX ; Iwami Masaki,JPX, Treating liquid supplying method and apparatus.
  539. Shigemori, Kazuhito; Sanada, Masakazu, Treating solution applying method.
  540. Sanada Masakazu,JPX, Treating solution supplying method and apparatus.
  541. Ohtani Masami,JPX ; Fukutomi Yoshiteru,JPX, Treating solution supplying method and substrate treating apparatus.
  542. Arai Kenichiro,JPX ; Shirakawa Hajime,JPX, Treating tank, and substrate treating apparatus having the treating tank.
  543. Koji Harada JP; Junichi Nagata JP; Yasunori Kawakami JP; Masatoshi Kaneda JP; Norio Semba JP; Yoshio Kimura JP; Masami Akimoto JP; Yasuhiro Sakamoto JP; Nobuyuki Jinnai JP, Treatment apparatus and treatment method.
  544. Sada Tetsuya,JPX ; Uchihira Norio,JPX ; Sakai Mitsuhiro,JPX ; Yamaguchi Kiyomitsu,JPX, Treatment device.
  545. Fujimoto, Akihiro; Yoshihara, Kousuke; Enomoto, Masahiro, Treatment solution supply apparatus and treatment solution supply method.
  546. Inada, Hiroichi; Ookuma, Hirofumi, Treatment solution supply apparatus and treatment solution supply method.
  547. Issei Ueda JP, Treatment solution supply method.
  548. Ueda, Issei, Treatment solution supply method and treatment solution supply unit.
  549. Mohindra Raj ; Bhushan Abhay ; Bhushan Rajiv ; Puri Suraj ; Anderson ; Sr. John H. ; Nowell Jeffrey, Ultra-low particle semiconductor cleaner.
  550. Kizaki Koji,JPX ; Miyagi Masahiro,JPX ; Narita Katsunaga,JPX, Ultraviolet irradiator for substrate, substrate treatment system, and method of irradiating substrate with ultraviolet.
  551. Rangarajan, Bharath; Singh, Bhanwar; Subramanian, Ramkumar, Using scatterometry to measure resist thickness and control implant.
  552. Sloan Ben J. (Garland TX), Vertical multi-process bake/chill apparatus.
  553. Van Doren Matthew J. (Pleasanton CA) Sauer Don (San Jose CA) Slocum Alexander H. (Concord NH) Rocki David Pap (Pleasanton CA) Tam Johann (Mountain View CA) Gerszewski Larry (Sunnyvale CA), Wafer gripper.
  554. Shinbara Kaoru (Kusatsu JPX), Wafer holding mechanism.
  555. Hobson Phillip M. (Los Altos CA) Dick Paul H. (San Jose CA), Wafer processing chuck using slanted clamping pins.
  556. Silvernail James M. (Maple Plain MN) Schneider Dallas J. (Cologne MN), Wafer processing machine.
  557. Silvernail James M. (Maple Plain MN) Schneider Dallas J. (Cologne MN), Wafer processing machine.
  558. Mandal, Robert P.; Babikian, Dikran, Wafer track apparatus and methods for dispensing fluids with rotatable dispense arms.
  559. Ohtani Masami (Kyoto JPX) Nishida Masami (Kyoto JPX), Wafer transfer apparatus having an improved wafer transfer portion.
  560. Fossey Michael E. ; Johnson Kirk Rodney ; Poduje Noel Stephen, Wafer transfer robot.
  561. Otani Masami (Nagaokakyo JPX) Nishida Masami (Muko JPX) Himoto Masahiro (Takatsuki JPX) Tsuchiya Akio (Muko JPX), Wafer transferring device.
  562. Adachi Hideki,JPX ; Izumi Akira,JPX, Wet/dry substrate processing apparatus.

이 특허를 인용한 특허 (18)

  1. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lu, Brian, Cluster tool architecture for processing a substrate.
  2. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lu, Brian, Cluster tool architecture for processing a substrate.
  3. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lu, Brian, Cluster tool architecture for processing a substrate.
  4. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
  5. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  6. Aoki, Shigeki; Sakai, Yuichi; Yamashita, Mitsuo; Shinya, Hiroshi, Heat processing apparatus and heat processing method.
  7. Gage, Chris; Genetti, Damon, High throughput method of in transit wafer position correction in a system using multiple robots.
  8. Gage, Chris; Genetti, Damon, High throughput method of in transit wafer position correction in system using multiple robots.
  9. Keigler, Arthur; Goodman, Daniel L.; Guarnaccia, David G., Parallel single substrate marangoni module.
  10. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L., Parallel single substrate processing system.
  11. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L.; Haynes, Jonathan, Parallel single substrate processing system.
  12. Keigler, Arthur, Parallel single substrate processing system with alignment features on a process section frame.
  13. Goodman, Daniel; Keigler, Arthur; Guarnaccia, David G., Substrate holder.
  14. Goodman, Daniel; Keigler, Arthur; Fisher, Freeman, Substrate loader and unloader.
  15. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Van Katwyk, Kirk; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a Cartesian robot cluster tool.
  16. Rice, Mike; Hudgens, Jeffrey; Carlson, Charles; Weaver, William Tyler; Lowrance, Robert; Englhardt, Eric; Hruzek, Dean C.; Silvetti, Dave; Kuchar, Michael; Katwyk, Kirk Van; Hoskins, Van; Shah, Vinay, Substrate processing sequence in a cartesian robot cluster tool.
  17. Genetti, Damon; Hamilton, Shawn; Blank, Rich; Templeton, James Sheldon, Wafer position correction with a dual, side-by-side wafer transfer robot.
  18. Genetti, Damon; Hamilton, Shawn; Blank, Rich; Templeton, Sheldon, Wafer position correction with a dual, side-by-side wafer transfer robot.
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