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Structurally isolated thermal interface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F24J-002/00
출원번호 UP-0829456 (2007-07-27)
등록번호 US-7743763 (2010-07-19)
발명자 / 주소
  • Grip, Robert E.
  • Rawdon, Blaine K.
  • Jalewalia, Gurpreet S.
출원인 / 주소
  • The Boeing Company
대리인 / 주소
    Klintworth & Rozenblat IP LLC
인용정보 피인용 횟수 : 12  인용 특허 : 64

초록

In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity memb

대표청구항

The invention claimed is: 1. A heat conducting assembly comprising: a first body and a second body; a plurality of high conductivity members attached to both the first and second bodies, wherein the high conductivity members are more flexible than the first and second bodies in order to allow for v

이 특허에 인용된 특허 (64)

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  10. Sasaoka, Makoto; Fujisaki, Tatsuo, Concentrating photovoltaic module and concentrating photovoltaic power generating system.
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  12. Schlosser, Erich J.; Bruno, Adrian A.; Shoeb, Mohammed, Curvilinear burner tube.
  13. Woodard, Nathan G.; Kabir, Omar M.; Rathbun, Jeremiah I., Device for cooling a bearing; flywheel energy storage system using such a bearing cooling device and methods related thereto.
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  15. Jed Hacker, Electrical cable for current transmission, and method of transmitting current therethrough.
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  23. O'Donnell, Michael J.; Slaby, Terrance C.; Szucs, Jr., Frank T.; Bedford, Jim; Hollingshead, Wayne, Gas burner.
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  26. Barth, James T.; Kowald, Glenn W., Gas burner assembly for simulating a natural log fire.
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  28. Kenneth D. Cakebread, Gas fireplace artificial log assembly.
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  34. Montesano Mark J. (Fairfax VA), Heat transfer device and method.
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  36. Bhatti, Mohinder Singh; Joshi, Shrikant Mukund, High performance pin fin heat sink for electronics cooling.
  37. Yao Akira,JPX, Interface portion structure and reinforcing structure of flexible thermal joint.
  38. Montesano Mark J. (Fairfax VA), Metal matrix composite heat transfer device and method.
  39. Colin McCullough ; David C. Lueneburg ; Paul S. Werner ; Herve E. Deve ; Michael W. Carpenter ; Kenneth L. Yarina, Metal matrix composite wires, cables, and method.
  40. Huey Larry J. (Both of Granville OH) Beuther Paul D. (Both of Granville OH), Method and apparatus for making non-circular mineral fibers.
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  42. Houston Douglas E. (Ballston Lake NY), Method and apparatus for thermo-compression diffusion bonding.
  43. Browne James M., Method of making and using thermally conductive joining film.
  44. Lo,Adrian; Sekijma,Makoto; Hata,Kenjiro; Kineri,Tohru; Hanashima,Naoki, Optical transceiver and optical module used in the same.
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  46. Belady, Christian L.; Peterson, Eric C., Pin retention for thermal transfer interfaces, and associated methods.
  47. Matyjaszewski,Krzysztof; Kowalewski,Tomasz; Lambeth,David N.; Spanswick,James; Tsarevsky,Nicolay V., Process for the preparation of nanostructured materials.
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  56. W. Scott Bonneville ; Roger A. Stonier, Thermal harness using encased carbon-based fiber and end attachment brackets.
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  58. Fan, Shoushan; Liu, Pao Lo; Huang, Hua; Li, YoungDe, Thermal interface material and method for making same.
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  63. Schilling Michael R. (Clinton LA), Waste container liner and method for manufacturing same.
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  1. Stuckey, Larry, Advanced thermal control interface.
  2. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon, Avionics chassis.
  3. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon, Avionics chassis.
  4. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay, Avionics chassis.
  5. Jiang, John Yue Jun, Method and system for providing piggyback roaming for sponsoring split roaming relationships.
  6. Jiang, John Yue Jun, Method and system for providing piggyback roaming for sponsoring split roaming relationships.
  7. Yao, Yuan; Dai, Feng-Wei; Wang, Ji-Cun; Zhang, Hui-Ling; Wang, You-Sen; Liu, Chang-Hong, Method for making thermal interface material.
  8. Cherian, Gabe, SPRDR—heat spreader—tailorable, flexible, passive.
  9. Grip, Robert Erik; Rawdon, Blaine Knight; Crooks, Tab Hunter; Stoia, Michael F., Strain isolation layer assemblies and methods.
  10. Hartmann, Mark; Roda, Greg, Systems structures and materials for electronic device cooling.
  11. Hartmann, Mark; Roda, Greg, Systems, structures and materials for electronic device cooling.
  12. Grip, Robert E.; Brown, John J., Two-surface sandwich structure for accommodating in-plane expansion of one of the surfaces relative to the opposing surface.
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