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"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Structurally isolated thermal interface

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) F24J-002/00   
미국특허분류(USC) 126/569; 136/246; 165/146; 165/185; 165/276; 165/277
출원번호 UP-0829456 (2007-07-27)
등록번호 US-7743763 (2010-07-19)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Klintworth & Rozenblat IP LLC
인용정보 피인용 횟수 : 12  인용 특허 : 64
초록

In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the ...

대표
청구항

The invention claimed is: 1. A heat conducting assembly comprising: a first body and a second body; a plurality of high conductivity members attached to both the first and second bodies, wherein the high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies; and at least one of the following: (1) the plurality of high conductivity members are more flexible in lateral X and Y directions than the first and second bodies in order to produce a low bending stiffne...

이 특허에 인용된 특허 (64)

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이 특허를 인용한 특허 피인용횟수: 12

  1. Stuckey, Larry. Advanced thermal control interface. USP2014068757250.
  2. Steenwyk, Meredith Marie; Coxon, Danny Weldon; Streyle, John Jay; Vander Ploeg, Benjamin Jon. Avionics chassis. USP2011118059409.
  3. Streyle, John Jay; Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon. Avionics chassis. USP2011098023267.
  4. Vander Ploeg, Benjamin Jon; Steenwyk, Meredith Marie; Coxon, Danny Weldon; Horton, Paul James; Streyle, John Jay. Avionics chassis. USP2012078222541.
  5. Jiang, John Yue Jun. Method and system for providing piggyback roaming for sponsoring split roaming relationships. USP2014068761760.
  6. Jiang, John Yue Jun. Method and system for providing piggyback roaming for sponsoring split roaming relationships. USP2012088254918.
  7. Yao, Yuan; Dai, Feng-Wei; Wang, Ji-Cun; Zhang, Hui-Ling; Wang, You-Sen; Liu, Chang-Hong. Method for making thermal interface material. USP2012078221667.
  8. Cherian, Gabe. SPRDR—heat spreader—tailorable, flexible, passive. USP2016109459056.
  9. Grip, Robert Erik; Rawdon, Blaine Knight; Crooks, Tab Hunter; Stoia, Michael F.. Strain isolation layer assemblies and methods. USP2015028957303.
  10. Hartmann, Mark; Roda, Greg. Systems structures and materials for electronic device cooling. USP2013118587945.
  11. Hartmann, Mark; Roda, Greg. Systems, structures and materials for electronic device cooling. USP2016079392730.
  12. Grip, Robert E.; Brown, John J.. Two-surface sandwich structure for accommodating in-plane expansion of one of the surfaces relative to the opposing surface. USP2017019555871.