초록 ▼

The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitti

The present invention intends to realize a narrow frame of a system on panel. In addition to this, a system mounted on a panel is intended to make higher and more versatile in the functionality. In the invention, on a panel on which a pixel portion (including a liquid crystal element, a light-emitting element) and a driving circuit are formed, integrated circuits that have so far constituted an external circuit are laminated and formed. Specifically, of the pixel portion and the driving circuit on the panel, on a position that overlaps with the driving circuit, any one kind or a plurality of kinds of the integrated circuits is formed by laminating according to a transcription technique.

대표청구항 ▼

What is claimed: 1. A semiconductor device comprising: a first substrate; a pixel portion over the first substrate; a second substrate over the pixel portion; a driving circuit over the first substrate; and a layer comprising an integrated circuit, wherein the layer at least partially overlaps with

What is claimed: 1. A semiconductor device comprising: a first substrate; a pixel portion over the first substrate; a second substrate over the pixel portion; a driving circuit over the first substrate; and a layer comprising an integrated circuit, wherein the layer at least partially overlaps with the driving circuit, wherein the driving circuit and the layer are electrically connected via a bump, and wherein the second substrate does not overlap the driver circuit. 2. The semiconductor device according to claim 1, further comprising a display element that is a light emitting element. 3. The semiconductor device according to claim 1, wherein the pixel portion further comprising a thin film transistor between the first substrate and the second substrate. 4. The semiconductor device according to claim 1, wherein the driving circuit is a source signal line driving circuit. 5. The semiconductor device according to claim 1, wherein the bump comprises at least one of tungsten, tungsten-rhenium, palladium, beryllium copper. 6. The semiconductor device according to claim 1, wherein the integrated circuit comprises at least one of a display controller, a frame memory and a power source circuit. 7. An electronic device comprising the semiconductor device according to claim 1, wherein the electronic device is any one of a group comprising a display device, a notebook type personal computer, a mobile computer, a player with a recording medium, an electronic book, a video camera, a portable telephone, a digital camera, a head-mount display, a car navigation system, a projector and a car stereo. 8. A semiconductor device comprising: a first substrate; a pixel portion over the first substrate; a second substrate over the pixel portion; a driving circuit over the first substrate; and a layer comprising an integrated circuit, wherein the layer at least partially overlaps with the driving circuit, wherein the driving circuit and the layer are electrically connected via a bump, wherein the second substrate does not overlap the driver circuit, and wherein the integrated circuit comprises a CPU. 9. The semiconductor device according to claim 8, further comprising a display element that is a light emitting element. 10. The semiconductor device according to claim 8, wherein the pixel portion further comprising a thin film transistor between the first substrate and the second substrate. 11. The semiconductor device according to claim 8, wherein the driving circuit is a source signal line driving circuit. 12. The semiconductor device according to claim 8, wherein the bump comprise at least one of tungsten, tungsten-rhenium, palladium, beryllium copper. 13. The semiconductor device according to claim 8, wherein the integrated circuit further comprises at least one of a display controller, a frame memory and a power source circuit. 14. An electronic device comprising the semiconductor device according to claim 8, wherein the electronic device is any one of a group comprising a display device, a notebook type personal computer, a mobile computer, a player with a recording medium, an electronic book, a video camera, a portable telephone, a digital camera, a head-mount display, a car navigation system, a projector and a car stereo. 15. A semiconductor device comprising: a first substrate; a pixel portion over the first substrate; a second substrate over the pixel portion; a driving circuit over the first substrate; and a layer comprising an integrated circuit, wherein the layer at least partially overlaps with the driving circuit, wherein the driving circuit and the layer are electrically connected via a bump, wherein the second substrate does not overlap the driver circuit, and wherein the integrated circuit comprises a memory. 16. The semiconductor device according to claim 15, further comprising a display element that is a light emitting element. 17. The semiconductor device according to claim 15, wherein the pixel portion further comprising a thin film transistor between the first substrate and the second substrate. 18. The semiconductor device according to claim 15, wherein the driving circuit is a source signal line driving circuit. 19. The semiconductor device according to claim 15, wherein the bump comprises at least one of tungsten, tungsten-rhenium, palladium, beryllium copper. 20. The semiconductor device according to claim 15, wherein the integrated circuit further comprises at least one of a display controller, a frame memory and a power source circuit. 21. An electronic device comprising the semiconductor device according to claim 15, wherein the electronic device is any one of a group comprising a display device, a notebook type personal computer, a mobile computer, a player with a recording medium, an electronic book, a video camera, a portable telephone, a digital camera, a head-mount display, a car navigation system, a projector and a car stereo. 22. A semiconductor device comprising: a first substrate; a pixel portion over the first substrate; a second substrate over of the pixel portion; a driving circuit over the first substrate; a first layer comprising a first integrated circuit, a second layer comprising a second integrated circuit, wherein the first layer at least partially overlaps with the driving circuit, wherein the second layer at least partially overlaps with the first layer, wherein the driving circuit and the first layer are electrically connected via a bump, wherein the first layer and the second layer are electrically connected via an auxiliary wiring, and wherein the second substrate does not overlap the driver circuit. 23. The semiconductor device according to claim 22, further comprising a display element that is a light emitting element. 24. The semiconductor device according to claim 22, wherein the pixel portion further comprising a thin film transistor between the first substrate and the second substrate. 25. The semiconductor device according to claim 22, wherein the driving circuit is a source signal line driving circuit. 26. The semiconductor device according to claim 22, wherein the bump comprises at least one of tungsten, tungsten-rhenium, palladium, beryllium copper. 27. The semiconductor device according to claim 22, wherein the integrated circuit comprises at least one of a display controller, a frame memory and a power source circuit. 28. The semiconductor device according to claim 22, wherein the electronic device is any one of a group comprising a display device, a notebook type personal computer, a mobile computer, a player with a recording medium, an electronic book, a video camera, a portable telephone, a digital camera, a head-mount display, a car navigation system, a projector and a car stereo.