초록 ▼

The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door.

The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

대표청구항 ▼

What is claimed is: 1. A cooling assembly comprising: a. an electronics enclosure including a first panel having a first air vent and a second panel having a second air vent, wherein the electronics enclosure includes one or more heat generating devices and one or more fluid-based heat exchangers,

What is claimed is: 1. A cooling assembly comprising: a. an electronics enclosure including a first panel having a first air vent and a second panel having a second air vent, wherein the electronics enclosure includes one or more heat generating devices and one or more fluid-based heat exchangers, the one or more heat exchangers are coupled to the first panel; b. a plurality of flexible fluid lines coupled to the first panel; and c. a sliding assembly coupled to the first panel and to side panels of the electronics enclosure, wherein the sliding assembly is configured to slide towards and away from the electronics enclosure. 2. The cooling assembly of claim 1 wherein the flexible fluid lines are configured to bend between a closed position and an open position. 3. The cooling assembly of claim 1 wherein the sliding assembly is configured to slide between a first position and a second position, wherein the first position corresponds to a closed position of the first panel, and the second position corresponds to a maximum open position of the first panel configured to enable removal and installation of the one or more heat generating devices. 4. The cooling assembly of claim 1 wherein the first panel comprises a frame and a sliding door structure including the one or more heat exchangers, wherein the sliding door is configured to slide orthogonally relative to a motion of the sliding assembly from the first position to the second position. 5. The cooling assembly of claim 1 wherein the first panel comprises a plurality of panel segments, at least one heat exchanger coupled to each panel segment, and the sliding assembly comprises a plurality of sliding sub-assemblies, one sliding sub-assembly is coupled to one panel segment and to side panels of the electronics enclosure, further wherein each sliding sub-assembly is configured to slide toward and away from the electronics enclosure such that each panel segment independently moves between a closed position and an open position. 6. The cooling assembly of claim 5 wherein flexible fluid lines are coupled to each panel segment. 7. A cooling assembly comprising: a. an electronics enclosure including a first end having a first air vent and a second end, wherein the electronics enclosure includes one or more heat generating devices and a plurality of fluid-based heat exchangers, each heat exchanger is coupled to the second end and positioned in a substantially horizontal position; b. a plurality of fluid lines coupled to each of the plurality of heat exchangers; and c. a plurality of duct guides, each duct guide having a first end coupled to at least one heat exchanger and a second end coupled to side panels of the electronics enclosure, wherein each duct guide is configured to direct air flow between an interior of the electronics enclosure and the at least one heat exchanger, and each duct guide is further configured to be removable to provide access to the interior of the electronics enclosure. 8. The cooling assembly of claim 7 wherein the duct guides are curved downward to enable vertical air flow through the heat exchangers. 9. The cooling assembly of claim 7 wherein the duct guides are curved upward to enable vertical air flow through the heat exchangers. 10. The cooling assembly of claim 7 wherein the fluid lines are hard-plumbed. 11. The cooling assembly of claim 7 wherein the fluid lines are flexible. 12. The cooling assembly of claim 7 wherein each heat exchanger has a protective cover configured to enable air flow therethrough. 13. A cooling assembly comprising: a. an electronics enclosure including a first end having a first air vent and a second end, wherein the electronics enclosure includes one or more heat generating devices and a plurality of fluid-based heat exchangers, each heat exchanger is pivotally coupled to the second end and configured to rotate about a horizontal axis between a closed position when the heat exchanger is in a vertical position and an open position when the heat exchanger is rotated away from the vertical position, in the open position access to the interior of the electronics enclosure is provided; and b. a plurality of fluid lines coupled to each of the plurality of heat exchangers. 14. The cooling assembly of claim 13 wherein the fluid lines are flexible and are configured to move as the heat exchanger is rotated, thereby maintaining a fluid connection with the heat exchanger. 15. The cooling assembly of claim 13 wherein the fluid lines are hard-plumbed and the fluid lines are coupled to the heat exchangers lines using swivel joints configured to maintain a fluid connection with the heat exchangers. 16. The cooling assembly of claim 13 wherein the fluid lines are flexible and the fluid lines are coupled to the heat exchangers lines using swivel joints configured to maintain a fluid connection with the heat exchangers. 17. The cooling assembly of claim 13 wherein each heat exchanger has a protective cover configured to enable air flow therethrough. 18. The cooling assembly of claim 13 wherein each heat exchanger is configured to rotate between a first position and a second position, wherein the first position corresponds to the closed position, and the second position is at least 90 degrees from the first position to enable removal and installation of the one or more heat generating devices. 19. The cooling assembly of claim 13 wherein each heat exchanger is configured to rotate between a first position and a second position, wherein the first position corresponds to the closed position, and the second position is less than or equal to 90 degrees from the first position. 20. The cooling assembly of claim 13 wherein a top end of each heat exchanger is pivotally coupled to the second end of the electronics enclosure. 21. The cooling assembly of claim 13 wherein a bottom end of each heat exchanger is pivotally coupled to the second end of the electronics enclosure. 22. A cooling assembly comprising: a. an electronics enclosure including a first panel having a first air vent, a second panel, and a top panel having a top air vent, wherein the electronics enclosure includes one or more heat generating devices and a plenum positioned below the top air vent and between the one or more heat generating devices and the second panel; b. a supplemental enclosure coupled to the top panel of the electronics enclosure, the supplemental enclosure including at least one panel having air vents for allowing air to exhaust from the cooling assembly, wherein the supplemental enclosure includes one or more fluid-based heat exchangers coupled to the at least one panel; and c. a plurality of fluid lines coupled to the one or more fluid-based heat exchangers. 23. The cooling assembly of claim 22 wherein the at least one panel comprises a top panel of the supplemental enclosure. 24. The cooling assembly of claim 23 wherein the at least one panel further comprises one or more side panels of the supplemental enclosure. 25. The cooling assembly of claim 23 wherein the second panel comprises a door. 26. A cooling assembly comprising: a. an electronics enclosure comprising a first panel having a first air vent, a second panel, and a top panel having a top air vent, wherein the electronics enclosure further comprises one or more heat generating devices, a first plenum positioned between the one or more heat generating devices and the second panel, and a second plenum positioned between the one or more heat generating devices and the top panel, further wherein the first plenum is coupled to the second plenum; b. one or more fluid-based heat exchangers coupled to the top panel; and c. a plurality of fluid lines coupled to the one or more fluid-based heat exchangers. 27. The cooling assembly of claim 26 wherein the top panel, a top portion of the first panel, and a top portion of the second panel form the second plenum. 28. The cooling assembly of claim 27 wherein the top portion of the first panel has a third air vent, and the cooling assembly further comprises one or more fluid-based heat exchangers coupled to the top portion of the first panel. 29. The cooling assembly of claim 27 wherein the top portion of the second panel has a fourth air vent, and the cooling assembly further comprises one or more fluid-based heat exchangers coupled to the top portion of the second panel. 30. The cooling assembly of claim 26 wherein the second panel comprises a door.