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A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protru

A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

대표청구항 ▼

What is claimed is: 1. A heat sink for dissipating heat from an electronic component, comprising: a lower plate forming a protrusion therefrom to contact the electronic component; an upper plate secured on the lower plate; and a plurality of heat pipes sandwiched between the lower plate and the upp

What is claimed is: 1. A heat sink for dissipating heat from an electronic component, comprising: a lower plate forming a protrusion therefrom to contact the electronic component; an upper plate secured on the lower plate; and a plurality of heat pipes sandwiched between the lower plate and the upper plate; wherein a surface of the protrusion which is for contacting the electronic component is milled to be flat and smooth; and the lower plate comprises a panel forming the protrusion therefrom, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a pair of flanges extending outwardly from tops of the pair of sidewalls, respectively. 2. The heat sink as claimed in claim 1, wherein only the surface of the protrusion is milled. 3. The heat sink as claimed in claim 1, wherein a cavity is defined in the lower plate corresponding to the protrusion. 4. The heat sink as claimed in claim 3, wherein the plurality of heat pipes forms bulges projecting downwardly therefrom to be received in the cavity in the lower plate. 5. The heat sink as claimed in claim 1, wherein the upper plate is fixed on the pair of flanges of the lower plate in parallel relationship with the panel. 6. The heat sink as claimed in claim 1, wherein the plurality of heat pipes is spaced from the pair of sidewalls of the lower plate to form air passages therebetween. 7. The heat sink as claimed in claim 1, wherein a pair of securing members are secured to a pair of horizontal wings at the opposite side of the panel of the lower plate, the wings being located corresponding to two lateral sides of the protrusion. 8. The heat sink as claimed in claim 7, wherein a pair of holes are defined through the pair of securing members and the pair of wings of the lower plate, respectively, adapted for extension of fasteners through the lower plate and the securing members to thereby attach the heat sink on a printed circuit board where the electronic component is mounted. 9. The heat sink as claimed in claim 7, wherein the securing members have tops extending beyond the flanges to resiliently engage the upper plate. 10. A method for manufacturing a heat sink, comprising steps of: providing a lower plate, the lower plate comprising a panel; punching the lower plate to form a downward protrusion located at the panel; milling a bottom surface of the protrusion so that the bottom surface is flat and smooth; providing a plurality of heat pipes and welding them on the lower plate; and providing an upper plate and soldering it on the plurality of heat pipes and the lower plate, wherein the plurality of heat pipes is sandwiched between the lower plate and the upper plate; and wherein the lower plate further comprises a pair of sidewalls extending upwardly from two opposite sides of the panel, and a pair of flanges extending outwardly from tops of the pair of sidewalls, respectively. 11. The method for manufacturing a heat sink as claimed in claim 10, further comprising a step of: providing a plurality of fins and welding them on the lower plate and the upper plate respectively. 12. A heat sink comprising: a lower plate having a lower protrusion extending downwards from a bottom face thereof and a cavity in a top face thereof corresponding to the lower protrusion, wherein a bottom surface of the lower protrusion is used to contact a top surface of a heat-generating electronic component, the bottom surface of the lower protrusion being machined to be flat and smooth so that the bottom surface can have an intimate contact with the top surface of the heat-generating electronic component; and a plurality of first fins mounted over the top face of the lower plate; wherein the lower plate comprises a panel forming the protrusion therefrom, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a pair of flanges extending outwardly from tops of the pair of sidewalls, respectively. 13. The heat sink as claimed in claim 12, further comprising an upper plate mounted on the lower plate, at least a heat pipe sandwiched between the lower and upper plates and a plurality of second fins mounted on the bottom face of the lower plate, wherein the first fins are mounted on a top face of the upper plate. 14. The heat sink as claimed in claim 13, wherein the at least a heat pipe has a bulge extending into the cavity defined in the top face of the lower plate.