IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
UP-0958457
(2007-12-18)
|
등록번호 |
US-7753731
(2010-08-02)
|
발명자
/ 주소 |
- Cohen, Thomas S.
- Kirk, Brian
- Cartier, Jr., Marc B.
|
출원인 / 주소 |
|
대리인 / 주소 |
Wolf, Greenfield & Sacks, P.C.
|
인용정보 |
피인용 횟수 :
64 인용 특허 :
34 |
초록
▼
An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performan
An electrical connector includes a wafer formed with a ground shield made from a non-conductive material made conductive with conductive particles disposed therein, thereby eliminating the necessity of the metal ground shield plate found in prior art connectors while maintaining sufficient performance characteristics and minimizing electrical noise generated in the wafer. The wafer housing is formed with a first, insulative housing at least partially surrounding a pair of signal strips and a second, conductive housing at least partially surrounding the first, insulative housing and the signal strips. The housings provide the wafer with sufficient structural integrity, obviating the need for additional support structures or components for a wafer. Ground strips may be employed in the wafer and may be formed in the same plane as the signal strips. The second, conductive housing may be connected (e.g., molded) to the ground strips and spaced appropriately from the signal strips. The wafer may also include air gaps between the signal strips of one wafer and the conductive housing of an adjacent wafer further reducing electrical noise or other losses (e.g., cross-talk) without sacrificing significant signal strength.
대표청구항
▼
What is claimed is: 1. An electrical connector comprising at least one lead frame and at least one housing, each lead frame of the at least one lead frames comprising: a) a plurality of first conductors disposed in pairs in a column, each of the first conductors having a first width, the first widt
What is claimed is: 1. An electrical connector comprising at least one lead frame and at least one housing, each lead frame of the at least one lead frames comprising: a) a plurality of first conductors disposed in pairs in a column, each of the first conductors having a first width, the first width being measured along the column; b) a plurality of second conductors disposed in the column, each of the second conductors having an edge end that faces an edge end of a first conductor of the plurality of first conductors, the conductors of the plurality of second conductors having a second width, the second width being measured along the column, and the second width being greater than the first width; and c) wherein each housing of the at least one housings comprises an insulative portion and a conductive portion, the plurality of first conductors being disposed, at least in part, within the insulative portion of the housing of the at least one housings, and the plurality of second conductors being electrically connected to the conductive portion of the housing of the at least one housings. 2. The electrical connector of claim 1, wherein the first conductors and the second conductors form a repeating pattern of two first conductors and one second conductor. 3. The electrical connector of claim 1, wherein the second conductors are ground conductors. 4. The electrical connector of claim 1, wherein each of the first conductors and each of the second conductors has a mating contact portion, each mating contact portion having at least two members, the at least two members providing two points of contact. 5. The electrical connector of claim 1, wherein the plurality of first conductors are electrically isolated from the second, conductive housing. 6. The electrical connector of claim 1, wherein the second, conductive housing is formed of a non-conductive binder material having conductive particles associated therewith, thereby rendering the second, conductive housing conductive. 7. The electrical connector of claim 1, wherein the second, conductive housing is configured and arranged relative to the plurality of first conductors to shield at least some of the plurality of first conductors to reduce or eliminate electrical noise. 8. A wafer for an electrical connector, the wafer comprising: at least one housing; a plurality of first conductors disposed in pairs in a column, each of the first conductors having a first width, the first width being measured along the column; and a plurality of second conductors disposed in the column, the plurality of first conductors and the plurality of second conductors forming a single column, each of the second conductors adjacent at least one pair of the plurality of first conductors with a portion of the at least one housing disposed between the second conductor and the adjacent pair of first conductors, the conductors of the plurality of second conductors having a second width, the second width being measured along the column, and the second width being greater than the first width. 9. The wafer of claim 8, wherein the plurality of first conductors comprise signal conductors and the plurality of second conductors comprise ground conductors. 10. The wafer of claim 8, wherein: the at least one housing comprises an insulative portion and a conductive portion, the plurality of first conductors being held in the insulative portion and the plurality of second conductors being electrically coupled to the conductive portion. 11. The wafer of claim 10, wherein: the wafer has a first side and a second side, opposite the first side, each of the first side and the second side being parallel to the plurality of first conductors; and the insulative portion defines the first side and the conductive portion defines the second side. 12. The wafer of claim 11, wherein the conductive portion comprises a planar region and a plurality of projecting regions, each projecting region extending from the planar region to make an electrical connection to a conductor of the plurality of second conductors. 13. The wafer of claim 12, wherein the each projecting region has a width less than the second width. 14. The wafer of claim 12, wherein: each second conductor of the plurality of second conductors comprises an edge facing an adjacent first conductor; and each projecting region of the plurality of projecting regions is adapted and configured to abut a second conductor of the plurality of second conductors with a setback from the edge of the second conductor. 15. An electrical connector including a plurality of columns, the electrical connector comprising: in each of the plurality of columns: a plurality of first conductors disposed in pairs in the column, each of the first conductors having a first width, the first width being measured along the column; a plurality of second conductors disposed in the column, the conductors of the plurality of second conductors having a second width, the second width being measured along the column, and the second width being greater than the first width, wherein the plurality of first conductors and the plurality of second conductors in the column are disposed in a plane; and a housing comprising a plurality of insulative portions and a plurality of conductive portions, each of the plurality of first conductors of the plurality of columns being disposed, at least in part, within an insulative portion of the plurality of insulative portions, and each of the plurality of second conductors of the plurality of columns being electrically connected to a conductive portion of the plurality of conductive portions, wherein adjacent columns of the plurality of columns are separated by a conductive portion of the plurality of conductive portions. 16. The electrical connector of claim 15, wherein the first conductors and the second conductors in each of the plurality of columns form a repeating pattern of two first conductors and one second conductor. 17. The electrical connector of claim 15, wherein the connector is comprised of a plurality of wafers, each wafer comprising a column, an insulative portion of the plurality of insulative portions, and a conductive portion of the plurality of conductive portions.
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