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Information processing device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H05K-005/00
  • G06F-001/20
  • H01L-023/495
  • F28F-007/00
출원번호 UP-0857514 (2007-09-19)
등록번호 US-7755896 (2010-08-02)
우선권정보 JP-2006-256428(2006-09-21)
발명자 / 주소
  • Tamaki, Yuuta
  • Aoki, Keiichi
출원인 / 주소
  • Sony Computer Entertainment Inc.
대리인 / 주소
    Katten Muchin Rosenman LLP
인용정보 피인용 횟수 : 11  인용 특허 : 45

초록

An information processing device includes: an object to be cooled (51, 52) as a heat-generating body; a cooling unit (32) that is provided on a first side of the object (51) to be in contact therewith; and a plate spring (36) disposed on a second side of the object (51) opposite to first side and at

대표청구항

What is claimed is: 1. An information processing device, comprising: an object to be cooled, the object being a heat generating body and being provided on one side of a circuit board; a cooling unit that is in contact with a first side of the object and radiates the heat transferred from the object

이 특허에 인용된 특허 (45)

  1. Smith, Grant M.; Jochym, Daniel A.; Wessel, Mark W., Apparatus and method for shielding a circuit board.
  2. Gonsalves Daniel D. ; Antonuccio Robert S. ; Carney James M. ; Montagna Joseph J., Apparatus for dissipating heat from a circuit board having a multilevel surface.
  3. Yeh Chih-Chiang,TWX, Bearing structure of a central processing unit.
  4. Rubenstein,Brandon Aaron; Delano,Andrew D.; Clements,Bradley E., Bolster plate assembly for processor module assembly.
  5. Sasaki,Chiyoshi; Hirata,Kouji; Itoh,Katsushi; Ootori,Yasuhiro; Kubota,Ryouichi, Circuit substrate unit and electronic equipment.
  6. Wheaton Chris, Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism.
  7. Hori,Yuji; Takamoto,Junji; Wakitani,Noboru; Kitano,Yasuhisa, Electronic appliance.
  8. Sugai, Toshimichi; Kuwana, Teruaki; Gendo, Katsunori, Electronic device having cooling unit.
  9. Nagata, Hideo; Takamoto, Junji; Hori, Yuji, Electronic equipment and television game machine having heat radiation structure.
  10. Goldmann,Lewis S., Electronic module assembly.
  11. Boitard Pierre-Yves (Sainte Savine FRX) Furier Bernard (Laubressel FRX), Fixing device for fixing electronic component against a wall of a heatsink.
  12. Hung, Min-Hsiung; Chen, Hua-Shing; Tu, Yin-Fa, Flexible assembly system and mechanism adapted for an optical projection apparatus.
  13. Huang, Chun-Hsien; Wen-Yuan, Tsai; Ho, Chao-Teh; Huang, King-Tung, Heat dissipating assembly.
  14. Truong, Phu; Chen, Rong-Che, Heat dissipating assembly with thermal plates.
  15. Pedoeem,Albert; Braun,Willie Ernst; Yuan,Lang; Dayton,Corey M.; Cherry,Steven M., Heat dissipating housing with interlocking chamfers and ESD resistance.
  16. Ali Ihab A. ; Hermerding James ; Bhatia Rakesh, Heat dissipation apparatus and method.
  17. Chen,Bing; Peng,Xue Wen, Heat dissipation device for computer add-on cards.
  18. Yoshitsugu Koseki JP; Hung-Ji Yu TW, Heat sink assembly retainer for electronic integrated circuit package.
  19. Yang,Chih Kai; Wang,Frank; Cheng,Yi Lun, Heat sink conduction apparatus.
  20. Sasaki, Chiyoshi; Sotani, Junji; Ohmi, Masaru; Hama, Toshikatsu; Ootori, Yasuhiro, Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin.
  21. Hashimoto, Suzushi; Kinaga, Kazuo; Akutsu, Shoji, Heat sinks for CPUs for use in personal computers.
  22. Ho Kang Chu, IC package assembly with retention mechanism.
  23. Richard J Luebs ; Jonathan W Craig ; Jeffrey L. Deeney ; David W. Peters, Integrated circuit device package including multiple stacked components.
  24. Charles W. Frank, Jr. ; Thomas D. Hanan ; Wally Szeremeta, Integrated computer module with EMI shielding plate.
  25. Frank J. Juskey ; John R. McMillan ; Ronald P. Huemoeller, Low-cost printed circuit board with integral heat sink for semiconductor package.
  26. Lewis Jeffrey M. ; Rolla Michael R. ; Sullivan Robert L., Low-profile cooling assembly for the CPU chip of a computer or the like.
  27. Goodwin, Jonathan W., Method and apparatus for mounting a lidless semiconductor device.
  28. Patel, Janak G., Method and structure to support heat sink arrangement on chip carrier packages.
  29. Cromwell, Stephen Daniel, Method of assembling an application specific integrated circuit (ASIC) assembly with attach hardware.
  30. Tsai, Hung-Chieh, Modular computer housing.
  31. Gibson William C. (San Antonio TX) Tomlinson William M. (San Antonio TX) Goldstein Eugene T. (San Antonio TX) Ferguson George A. (San Antonio TX), Packaging arrangement for spacecraft computer.
  32. Nakamura Hiroshi,JPX ; Nakajima Yuji,JPX, Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit bo.
  33. Seto Masaru (Tokyo JPX) Shibasaki Kazuya (Tokyo JPX) Arai Satoru (Tokyo JPX), Portable electronic apparatus having a housing for containing circuits board and functional components.
  34. Tanaka, Wataru; Tatsukami, Ikki; Iijima, Takashi, Portable electronic device capable of efficiently cooling heat-generation electronic component.
  35. Izumi Shigeichi (Kawasaki JPX), Printed circuit board assembly having high heat radiation property.
  36. Lin Chin-Chi,TWX, Shock-absorbing device for notebook computer module.
  37. Fred Guerrero, Slotted rail heat sink retainer clip.
  38. Dubovsky, Stephen M.; Mellema, William, Spring spacer assemblies for maintaining electrical components in contact with thermal transfer surfaces.
  39. LaPointe Brion (Sunnyvale CA) Northway David (Palo Alto CA) Riccomini Robert (Saratoga CA) Weber Ken (San Jose CA) Wood Jeff (Sunnyvale CA), Structural frame for portable computer.
  40. Nakajima Yuji,JPX, Structure and method for mounting a circuit module.
  41. Koga, Yuuichi, Substrate unit, cooling device, and electronic device.
  42. Matta Farid (Mountain View CA) Douglas Kevin (San Mateo CA) Pendse Rajendra D. (Fremont CA) Afshari Brahram (Los Altos CA) Scholz Kenneth D. (Palo Alto CA), Tab frame with area array edge contacts.
  43. Turner, Leonard, Thermal transfer plate.
  44. Jacob Tzlil IL; Ronen Zagoory IL, Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module.
  45. Peng,Xue Wen; Chen,Rui Hua, Video graphics array (VGA) card assembly.

이 특허를 인용한 특허 (11)

  1. Fujiwara, Nobuto, Display device and electronic apparatus.
  2. Hirose, Kenji; Nakagawa, Kazuto; Tsuchida, Shinya; Ootori, Yasuhiro, Electronic apparatus.
  3. Hirose, Kenji; Nakagawa, Kazuto; Tsuchida, Shinya; Ootori, Yasuhiro, Electronic apparatus.
  4. Hirose, Kenji; Nakagawa, Kazuto; Tsuchida, Shinya; Ootori, Yasuhiro, Electronic apparatus.
  5. Tetsu, Sumii, Electronic apparatus.
  6. Yukito, Inoue; Yasuhiro, Ootori, Electronic apparatus and fabrication method therefor.
  7. Noborio, Masaki, Electronic device.
  8. Tang, Xue-Dong; Peng, Ke-Hui; Wang, Ren-Wen; Li, Ping, Electronic device.
  9. Inoue, Yukito, Electronic equipment stand.
  10. Goldrian, Gottfried A.; Ries, Manfred, Housing used as heat collector.
  11. Colbert, John L.; Eagle, Jason R.; Hamilton, Roger D., Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint.
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