초록 ▼

A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are

A method of making microelectronic packages includes making a subassembly by providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, attaching a compliant layer to the top surface of the plate, the compliant layer having openings that are aligned with the openings extending through the plate, and providing electrically conductive features on the compliant layer. After making the subassembly, the bottom surface of the plate is attached with the top surface of a semiconductor wafer so that the openings extending through the plate are aligned with contacts on the wafer. At least some of the electrically conductive features on the compliant layer are electrically interconnected with the contacts on the semiconductor wafer.

대표청구항 ▼

The invention claimed is: 1. A method of making microelectronic packages comprising: making a subassembly including providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, said plate including ledges extending into each said opening so th

The invention claimed is: 1. A method of making microelectronic packages comprising: making a subassembly including providing a plate having a top surface, a bottom surface and openings extending between the top and bottom surfaces, said plate including ledges extending into each said opening so that each said opening has a larger diameter adjacent the top surface of said plate and a smaller diameter adjacent the bottom surface of said plate, attaching a compliant layer to the top surface of said plate, said compliant layer having openings that are aligned with the openings extending through said plate, providing electrically conductive features on said compliant layer, wherein at least some of said electrically conductive features extend onto said ledges; after making said subassembly, providing a semiconductor wafer having a top surface and contacts accessible at the top surface; attaching the bottom surface of said plate with the top surface of said semiconductor wafer so that the openings extending through said plate are aligned with the contacts on said wafer; electrically interconnecting the contacts on said semiconductor wafer with said electrically conductive features. 2. The method as claimed in claim 1, wherein the attaching said compliant layer to said plate step comprises using an adhesive to attach said compliant layer and said plate together. 3. The method as claimed in claim 1, wherein the attaching said plate to said semiconductor wafer comprises using an adhesive to attach said plate and said semiconductor wafer together. 4. The method as claimed in claim 1, wherein said plate and said semiconductor wafer having matching coefficients of thermal expansion. 5. The method as claimed in claim 1, wherein at least some of said electrically conductive features are selected from the group consisting of conductive traces, conductive bond ribbons, conductive terminals, conductive bond pads and conductive posts. 6. The method as claimed in claim 1, wherein at least some of said electrically conductive features are accessible at the top surface of said compliant layer. 7. The method as claimed in claim 1, wherein the electrically interconnecting step comprises forming wire bonds between the contacts on said wafer and the at least some of said electrically conductive features extending onto said ledges. 8. The method as claimed in claim 7, further comprising encapsulating said wire bond with an encapsulant material. 9. The method as claimed in claim 1, wherein said compliant layers comprises a plurality of compliant bumps that are spaced from one another. 10. The method as claimed in claim 1, further comprising, after the electrically interconnecting step, dicing said semiconductor wafer to provide a plurality of microelectronic packages. 11. The method as claimed in claim 1, further comprising plating conductive posts atop said conductive features so that said conductive posts project from the top surface of said compliant layer. 12. The method as claimed in claim 1, wherein said semiconductor wafer includes a plurality of die, and wherein at least one of said openings extending through said plate and said compliant layer is associated with one of said plurality of die.