$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Membrane probing method using improved contact 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-043/20
출원번호 UP-0705014 (2003-11-10)
등록번호 US-7761986 (2010-08-13)
발명자 / 주소
  • Gleason, Reed
  • Bayne, Michael A.
  • Smith, Kenneth
  • Lesher, Timothy
  • Koxxy, Martin
출원인 / 주소
  • Cascade Microtech, Inc.
대리인 / 주소
    Chernoff, Vilhauer, McClung & Stenzel
인용정보 피인용 횟수 : 5  인용 특허 : 800

초록

A method of probing an electrical device using a membrane probing system having an improved contact. A membrane probe forms a contact having a ridge with a pair of inclined surfaces defining an acute angle such that, when pressed into an electrical pad of a device to be tested, the ridge penetrates

대표청구항

What is claimed is: 1. A probing assembly for probing an electrical device comprising: (a) a pair of contacts formed by locating conductive material within a plurality of depressions of a sacrificial substrate, each contact having a length and a contacting portion located nearer a first end of said

이 특허에 인용된 특허 (800)

  1. Samsavar Amin ; McWaid Thomas ; Yudin Sergey, Acoustic sensor as proximity detector.
  2. Jacobs, Lawrence W., Active differential test probe with a transmission line input structure.
  3. Albert M. Young ; Samuel S. Osofsky, Active feedback pulsed measurement method.
  4. Cherry Robert S. (Redondo Beach CA), Active probe card for high resolution/low noise wafer level testing.
  5. Hunter Ian W. ; Brenan Colin J. H. ; Lafontaine Serge R., Active thermal control of surfaces by steering heating beam in response to sensed thermal radiation.
  6. Gary W. Reed ; J. Steve Lyford, Adapter for a multi-channel signal probe.
  7. Miller, Charles A., Adjustable delay transmission line.
  8. Katsuda Yuji,JPX ; Mori Yukimasa,JPX ; Takahashi Michio,JPX ; Bessho Yuki, Aluminum nitride sintered body, metal embedded article, electronic functional material and electrostatic chuck.
  9. Kell Douglas B. (Aberystwyth GBX) Woodward Andrew M. (Anglesey GBX), Analytical or monitoring apparatus and method.
  10. Gillespie Harvey D. (4848 S. 2200 West Salt Lake City UT 84118), Anchored cable sling system.
  11. Ono Nobuyuki (Tokyo JPX) Hayashi Yoshihisa (Tokyo JPX) Kisuki Atsushi (Tokyo JPX) Ikeda Yasushi (Tokyo JPX), Anechoic chamber and wave absorber.
  12. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Angled flying lead wire bonding process.
  13. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Angled flying lead wire bonding process.
  14. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Angled flying lead wire bonding process.
  15. Leisten Oliver Paul,GBX, Antenna.
  16. Oliver Paul Leisten GB; John Costas Vardaxoglou GB, Antenna.
  17. Masatoshi Sawamura JP; Yoshiki Kanayama JP; Hiroki Ito JP, Antenna apparatus and portable radio set.
  18. Masatoshi Sawamura JP; Hiroki Ito JP, Antenna device and portable radio set.
  19. Ohno,Sadao; Katono,Kazuki, Antenna device mounted on vehicle.
  20. Nakano Akihiko (Nara JPX), Apparatus and a method for checking a semiconductor.
  21. Knebel,Detlef; J채hnke,Torsten; S체nwoldt,Olaf, Apparatus and method for a scanning probe microscope.
  22. Cole, Jr., Edward I.; Tangyunyong, Paiboon; Hawkins, Charles F.; Bruce, Michael R.; Bruce, Victoria J.; Ring, Rosalinda M., Apparatus and method for analyzing functional failures in integrated circuits.
  23. McTigue,Michael T., Apparatus and method for canceling DC errors and noise generated by ground shield current in a probe.
  24. Miller, Charles A.; Hreish, Emad B., Apparatus and method for electromechanical testing and validation of probe cards.
  25. O'Boyle John O., Apparatus and method for retaining a semiconductor wafer during testing.
  26. Keller Timothy J., Apparatus and method for testing a substrate having a plurality of terminals.
  27. Sato Takashi,JPX, Apparatus and method for testing semiconductor devices formed on a semiconductor wafer.
  28. Rothaug,Uwe; Yuschuk,Oleh, Apparatus and method for the testing of circuit boards, and test probe for this apparatus and this method.
  29. Mallory Chester (Campbell CA) Perloff David S. (Sunnyvale CA) Pham Hung V. (San Jose CA) Droblisch Sandor (Monte Sereno CA), Apparatus and methods for semiconductor wafer testing.
  30. Yonezawa Toshihiro,JPX ; Sano Kunio,JPX ; Sato Takashi,JPX, Apparatus for aligning a semiconductor wafer with an inspection contactor.
  31. Hoover Rex ; Hoover Robert G., Apparatus for aligning two objects.
  32. Mathieu Gaetan L., Apparatus for controlling plating over a face of a substrate.
  33. Ishitani, Tohru; Koike, Hidemi; Sugimoto, Aritoshi; Sekihara, Isamu; Umemura, Kaoru; Tomimatsu, Satoshi; Azuma, Junzo, Apparatus for detecting defect in device and method of detecting defect.
  34. Juengel Richard O. (Romeo MI), Apparatus for detecting the position of a probe relative to a workpiece.
  35. Kamieniecki Emil (Lexington MA) Goldfarb William C. (Melrose MA) Wollowitz Mike (Cambridge MA), Apparatus for making surface photovoltage measurements of a semiconductor.
  36. Oldfield William, Apparatus for measuring and/or injecting high frequency signals in integrated systems.
  37. Shahriary Iradj (Santa Monica CA), Apparatus for on-wafer testing of electrical circuits.
  38. Chang,James Y. C., Apparatus for reducing flicker noise in a mixer circuit.
  39. Benjamin N. Eldridge ; Charles A. Miller, Apparatus for reducing power supply noise in an integrated circuit.
  40. Benjamin N. Eldridge ; Charles A. Miller, Apparatus for reducing power supply noise in an integrated circuit.
  41. Uren Delbert L. (Kansas City MO) Thompson Forrest L. (Kansas City MO), Apparatus for use in testing printed circuit process boards having means for positioning such boards in proper juxtaposi.
  42. Atalar, Ergin; Bottomley, Paul A.; Karmarkar, Parag; Lardo, Albert C.; Zerhouni, Elias, Apparatus, systems, and methods for in vivo magnetic resonance imaging.
  43. Grube, Gary W., Apparatuses and methods for cleaning test probes.
  44. Haulin Tord L.,SEX, Assembly and method for testing integrated circuit devices.
  45. Yeh, Ming-Hau, Atch horn antenna of dual frequency.
  46. Esswein Karlheinz (Aalen-Unterkochen DEX), Attachment of microscope objectives.
  47. Morita, Seiji; Sato, Mitsuyoshi; Uemoto, Atsushi, Automatic focusing system for scanning electron microscope equipped with laser defect detection function.
  48. Hasegawa Yoshiei,JPX ; Osato Eichi,JPX, Auxiliary apparatus for testing device.
  49. Phillips James P. (Lake in the Hills IL) Vannatta Louis J. (Crystal Lake IL), Balun apparatus including impedance transformer having transformation length.
  50. Negishi Isamu (Ina JPX) Hunyu Kazumi (Omiya JPX), Base fabrics for polyurethane-coated fabrics, polyurethane-coated fabrics and processes for their production.
  51. Moulthrop Andrew Alfred ; Muha Michael Steven ; Clark Christopher Joseph ; Silva Christopher Patrick, Baseband time-domain waveform measurement method.
  52. Hutton Gordon R. ; Greene Gerald, Bi-level test fixture for testing printed circuit boards.
  53. Iwasaki, Yukoh, Blade-like connecting needle.
  54. Dhong Sang H. (Mahopac NY) Hwang Wei (Armonk NY) Lu Nicky C. (Yorktown Heights NY), Boost clock circuit for driving redundant wordlines and sample wordlines.
  55. Boll Gregory G. ; Boll Harry J., Broadband impedance matching probe.
  56. Gilbert P. Brunette CA, Broadband multi-layer capacitor.
  57. Yih Christopher (Cupertino CA) Yang Tsen-Shau (Cupertino CA) Huang Kuang-Hua (Cupertino CA) Chou Ger-Chih (San Jose CA), CAD driven microprobe integrated circuit tester.
  58. Dunsmore, Joel, Calibrating a test system using unknown standards.
  59. Hill, Thomas C.; Chen, Xiaofen; Matos, Soraya J.; Willmann, Leroy J.; Bernard, Kyle L.; Gumm, Linley F., Calibration for vector network analyzer.
  60. Sutherland, Alexander Tennant, Calibration of an analogue probe.
  61. Bockelman David E., Calibration technique for a network analyzer.
  62. Toda Akitoshi (Tokyo JPX) Matsuyama Katsuhiro (Tokyo JPX), Cantilever chip for scanning probe microscope.
  63. Chen,Dong, Capacitance probe for thin dielectric film characterization.
  64. Moroney ; III Richard Morgan ; Kumar Rajan ; Fishman Daniel Matt, Capacitive denaturation of nucleic acid.
  65. Crook David T. (Loveland CO) Heumann John M. (Loveland CO) McDermid John E. (Loveland CO) Peiffer Ronald J. (Fort Collins CO) Schlotzhauer Ed O. (Loveland CO), Capacitively-coupled test probe.
  66. Woith Blake F. (Orange CA) Pasiecznik ; Jr. John (Malibu CA) Crumly William R. (Anaheim CA) Betz Robert K. (Long Beach CA), Cast elastomer/membrane test probe assembly.
  67. Logan John K. (26527 Silver Spur Rd. Rancho Palos Verdes CA 90274), Ceramic microstrip probe blade.
  68. Behfar-Rad Abbas (Poughquag NY) Perry Charles H. (Poughkeepsie NY) Sachdev Krishna G. (Hopewell Junction NY), Ceramic probe card and method for reducing leakage current.
  69. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Chip-scale carrier for semiconductor devices including mounted spring contacts.
  70. Ota Masanori (Funabashi JPX) Aoki Masafumi (Funabashi JPX) Nakamura Masashi (Funabashi JPX) Mizusawa Kenichi (Funabashi JPX) Kasahara Kumi (Funabashi JPX), Chloroisocyanuric acid composition having storage stability.
  71. Andrews,Peter; Froemke,Brad; Dunklee,John, Chuck with integrated wafer support.
  72. Tracy Theodore A. (5861 Carbeck Huntington Beach CA 92648) Freuler George H. (1164 North Holly St. Anaheim CA 92801), Circuit board interfacing apparatus.
  73. Miller, Charles A.; Long, John Matthew, Closed-grid bus architecture for wafer interconnect structure.
  74. Miller, Charles A.; Long, John Matthew, Closed-grid bus architecture for wafer interconnect structure.
  75. Burr Jeremy (Portland OR) Nordgren Gregory (Portland OR) Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Coaxial wafer probe with tip shielding.
  76. Toia Michael J. (Box 21 Columbia MD 21045), Coaxially fed dipole antenna.
  77. Nomura Hiroshi (Tokyo JPX), Code plate mounting device.
  78. Ferland Michael R. ; Currin Jeffrey D., Coherent switching power for an analog circuit tester.
  79. Shiell, Thomas J., Collinear four-point probe head and mount for resistivity measurements.
  80. Hayes Gerard James ; Horton Robert Ray, Compact antenna structures including baluns.
  81. Pade, Wolfgang, Compact coupler plug, particularly for a planar broadband lambda probe, in which single-conductor seals are prevented from being lost.
  82. Slater, Joseph B., Compact optical measurement probe.
  83. Miller, Charles A., Compensation for test signal degradation due to DUT fault.
  84. Holmes Frederick J. (Houston TX), Completely wireless dual-access test fixture.
  85. Khandros Igor Y. ; Mathieu Gaetan L., Composite interconnection element for microelectronic components, and method of making same.
  86. Pailthorp Robert M., Compound switching matrix for probing and interconnecting devices under test to measurement equipment.
  87. Buckwitz Richard J. (Issaquah WA) Anderson Leslie A. (Bothell WA) Schlosstein Hugh R. (Renton WA) Walter ; Jr. Alfred E. (Everett WA), Computer aided connector assembly method and apparatus.
  88. John Hefti, Computer program and database structure for detecting molecular binding events.
  89. Ruthrof Klaus (Erlangen DEX) Krner Rudolf (Leinburg DEX) Dorner Jrgen (Olching DEX), Concentric three-conductor cable.
  90. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Concurrent design and subsequent partitioning of product and test die.
  91. Buchoff Leonard S. (Bloomfield NJ) Kosiarski Joseph P. (Englishtown NJ) Dalamangas Chris A. (Fort Lee NJ), Conductive elastomeric contacts and connectors.
  92. Reitter Josef (Moehrendorf DEX), Connecting cable for use with a pulse generator and a shock wave generator.
  93. Kasajima,Tamon; Shiraishi,Masashi, Connection method for probe pins for measurement of characteristics of thin-film magnetic head and characteristic measurement method for thin-film magnetic head.
  94. Boegh-Petersen Allan (Flongvaenget 14 Hedehusene DK-2640 DKX), Connector assembly for a circuit board testing machine, a circuit board testing machine, and a method of testing a circu.
  95. Mok, Sammy; Chong, Fu Chiung; Swiatowiec, Frank John; Lahiri, Syamal Kumar; Haemer, Joseph Michael, Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs.
  96. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  97. Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Dozier, Thomas H.; Smith, William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  98. Byrnes Herbert P. (Poughkeepsie NY) Wahl Richard (Fishkill NY), Contact for an electrical contactor assembly.
  99. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.
  100. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.
  101. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.
  102. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.
  103. Yoshida, Hideaki; Ishii, Toshinori; Matsuda, Atushi; Ueki, Mituyoshi; Tachikawa, Noriyoshi; Nakamura, Tadashi; Katou, Naoki; Tai, Shou; Sasaki, Hayato; Iwamoto, Naohumi; Mishima, Akihumi; Hiji, Toshi, Contact probe and probe device.
  104. Yoshida,Hideaki; Ishii,Toshinori; Matsuda,Atushi; Ueki,Mituyoshi; Tachikawa,Noriyoshi; Nakamura,Tadashi; Katou,Naoki; Tai,Shou; Sasaki,Hayato; Iwamoto,Naohumi; Mishima,Akihumi; Hiji,Toshiharu; Masuda, Contact probe and probe device.
  105. Khandros Igor Y. ; Mathieu Gaetar L., Contact structure device for interconnections, interposer, semiconductor assembly and package using the same and method.
  106. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Alec Madsen ; Gaetan L. Mathieu, Contact structures with blades having a wiping motion.
  107. Yang Steven J. R.,TWX ; Chang Jane Huei-Chen,TWX ; Chang Chung-Tao,TWX ; Lee Hsiu-Tsang,TWX, Contact type prober automatic alignment.
  108. Katsuragawa Mitsuhiro,JPX, Converting adapter for interchangeable lens assembly.
  109. Lao Binneg Y. (Rancho Palos Verdes CA) Rowe David A. (Redondo Beach CA), Coplanar and stripline probe card apparatus.
  110. Letron Yves (Fontenay Aux Roses FRX), Coupling device between a metal wave guide, a dielectric wave guide and a semiconductor component and a mixer using this.
  111. Miller, Charles A., Cross-correlation timing calibration for wafer-level IC tester interconnect systems.
  112. Carroll Charles E. (Landenberg PA), Crush-resistant coaxial transmission line.
  113. Thomas, Thomas P.; Stunkard, Douglas N.; Reshotko, Miriam R.; Barnett, Brandon C.; Young, Ian A., Current probe device having an integrated amplifier.
  114. Takaoka Michio (Chiba JPX) Motai Tsuneaki (Yachiyo JPX) Ono Motoyuki (Sakura JPX) Yoshida Shotaro (Tokyo JPX) Niwa Toshio (Yachiyo JPX) Takahashi Toru (Tokyo JPX) Kataoka Keiichiro (Ichikawa JPX) Yam, DC electric power cable.
  115. Bright Billy J. ; Dacus Steven L., Dental infection control system.
  116. McQueeney, Kenneth A., Detecting field from different ignition coils using adjustable probe.
  117. Beausoleil,Raymond G.; Munro,William J.; Spiller,Timothy P.; Nemoto,Kae; Barrett,Sean D., Detecting one or more photons from their interactions with probe photons in a matter system.
  118. Chan Tsing Yee Amy,GB3 ; Odlyha Marianne,GB3 ITX WC1H 0PP, Device and apparatus for measuring dielectric properties of materials.
  119. Knoll, Meinhard, Device and method for detecting analytes.
  120. Eroglu Adnan,CHX ; Knopfel Hans Peter,CHX ; Senior Peter,GB3, Device and method for injecting fuels into compressed gaseous media.
  121. Kassen Rudiger (Wildbad DEX) Klein Albert (Neunburg DEX) Weber Jean M. (Quentin DEX), Device for determining material parameters by means of microwave measurements.
  122. Lagowski Jacek ; Savtchouk Alexander ; Kochev Nick ; Schraver Charles, Device for electrically contacting a floating semiconductor wafer having an insulating film.
  123. Kempf Stefan,DEX ; Reising Michael,DEX, Device for gripping and holding substrates.
  124. Robertazzi,Raphael Peter, Device for probe card power bus noise reduction.
  125. Higgins H. Dan (323 E. Redfield Rd. Chandler AZ 85225) Normington Peter (516 Country Plz. South Gilbert AZ 85234), Die carrier apparatus.
  126. Leisten Oliver Paul,GBX ; Agboraw Ebinotambong,GBX, Dielectric-loaded antenna.
  127. Leisten, Oliver Paul, Dielectrically-loaded antenna.
  128. Sweet, Charles M.; Dryden, Cameron D.; Lewinnek, David W., Differential coaxial contact array for high-density, high-speed signals.
  129. Peabody Hume L., Differential thermopile heat flux transducer.
  130. Gilboe,Derek, Direct resistance measurement corrosion probe.
  131. Richard S. Roy ; Charles A. Miller, Distributed interface for parallel testing of multiple devices using a single tester channel.
  132. Roy, Richard S.; Miller, Charles A., Distributed interface for parallel testing of multiple devices using a single tester channel.
  133. Smith Monty (Forest Grove OR) Campbell Julie A. (Portland OR), Double insulated floating high voltage test probe.
  134. Marzhauser, Heinz, Drive system for a microscope stage or the like.
  135. Abrami Anthony J. (Poughkeepsie) Bullard Stuart H. (Pleasant Valley) del Puerto Santiago E. (Wappingers Falls) Gaschke Paul M. (Pleasantville) LaForce Mark R. (Pleasant Valley) Roggemann Paul J. (Hop, Dry interface thermal chuck temperature control system for semiconductor wafer testing.
  136. Blass Judd (Haifa ILX) Keren Hanan (Haifa ILX), Dual frequency surface probes.
  137. St. Onge Gary F. (Ballston Lake NY), Dual level test fixture.
  138. Crouch David D. ; Dolash William E., Dual-window high-power conical horn antenna.
  139. Santana, Jr.,Miguel; Powell,Robert, Dynamically adjustable probe tips.
  140. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.
  141. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y; Mathieu, Gaetan L., ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF MOUNTING.
  142. Bullock Roddy M. (San Marcos TX) Cedrone Alfredo (Austin TX), Easy strip composite dielectric coaxial signal cable.
  143. Gifford, Carl B.; Uyehara, Clyde T., Eddy current probe having sensing elements defined by first and second elongated coils and an associated inspection method.
  144. Shoji,Shigeru, Eddy-current probe.
  145. Yamano Akihiko (Yokohama JPX) Nose Hiroyasu (Zama JPX) Kawase Toshimitsu (Atsugi JPX) Miyazaki Toshihiko (Isehara JPX) Oguchi Takahiro (Atsugi JPX), Edge detector.
  146. Tran,Allen, Effectively balanced dipole microstrip antenna.
  147. Charles A. Miller ; Richard S. Roy, Efficient parallel testing of integrated circuit devices using a known good device to generate expected responses.
  148. Miller, Charles A.; Roy, Richard S., Efficient parallel testing of semiconductor devices using a known good device to generate expected responses.
  149. Rath Alan R. (Fremont CA), Efficient remote transmission line probe tuning for NMR apparatus.
  150. Gross Hal D. (San Diego CA) Hudon Gerard M. (St. Paul MN), Elastic membrane probe.
  151. Petinelli Jean-Claude (Dusseldorf DEX) Bertier Dominique (Mortain FRX), Electric cable construction and uses therefor.
  152. Kittrell,Michael E., Electric conductivity water probe.
  153. Miyata Eiji (Fuchu JPX) Sugiyama Masahiko (Nirasaki JPX) Kohno Masahiko (Yamanashi JPX) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  154. Miyata Eiji (Fuchu) Sugiyama Masahiko (Nirasaki) Kohno Masahiko (Yamanashi) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  155. Zifcak Mark S. (Putnam CT) Kosa Bruce G. (Woodstock CT), Electrical circuit board interconnect.
  156. Calma John A. (Selden NY) Joy Thomas M. (Medford NY), Electrical circuit board text fixture having movable platens.
  157. Hasegawa Yoshiei,JPX ; Osato Eichi,JPX, Electrical connecting apparatus for electrically connecting a device to be tested.
  158. Ho Francis ; Bloom David M., Electrical contact probe for sampling high frequency electrical signals.
  159. Benjamin N. Eldridge, Electrical contactor especially wafer level contactor using fluid pressure.
  160. Fujihara Kaoru,JPX ; Kuji Motohiro,JPX, Electrical inspecting apparatus with ventilation system.
  161. Rivera Alexander F. (Hawthorne CA) McElhaney Vincent Q. (Oakland CA), Electrical probe and method for measuring gaps and other discontinuities in enclosures using electrical inductance for R.
  162. Guiol Eric (Pleinfeld DEX), Electro-magnetic shielding.
  163. Robert H. Svenson ; Serguei Y. Semenov ; Vladimir Y. Baranov, Electromagnetical imaging and therapeutic (EMIT) systems.
  164. Miller, Charles A., Electromagnetically coupled interconnect system.
  165. Khandros, Igor Y.; Pedersen, David V.; Eldridge, Benjamin N.; Roy, Richard S.; Mathieu, Gaetan, Electronic component overlapping dice of unsingulated semiconductor wafer.
  166. Sauerland Franz L. (Chagrin Falls OH), Electronic component temperature test system with flat ring revolving carriage.
  167. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals.
  168. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals.
  169. Hedrick James Lupton ; Shih Da-Yuan, Electronic devices comprising dielectric foamed polymers.
  170. LaMeres,Brock J.; Johnson,Kenneth W., Electronic probe extender.
  171. Zamborelli Thomas J. ; Draving Steven D., Electronic probe for measuring high impedance tri-state logic circuits.
  172. Smith Nathan R. (Vincentown NJ), Electronic test head positioner for test systems.
  173. Hofmann Gunter A., Electroporation employing user-configured pulsing scheme.
  174. Collins Kenneth S. ; Tsui Joshua Chin-Wing ; Buchberger Douglas, Electrostatic chuck with an impregnated, porous layer that exhibits the Johnson-Rahbeck effect.
  175. Cronin David V. (Peabody MA), Electrostatic discharge protection device.
  176. Keith Penny GB; Francis E Amoah GB; Colin Charles Owen Goble GB, Electrosurgical instrument.
  177. Esrig Paul (Saratoga CA) Rosengaus Eliezer (Palo Alto CA) Van Gelder Ezra (Belmont CA), Emission microscopy system.
  178. Farnworth,Warren M.; Grief,Malcolm; Sandhu,Gurtej S., Engagement probe having a grouping of projecting apexes for engaging a conductive pad.
  179. Margozzi Paul D. (San Jose CA), Environmental box for automated wafer probing.
  180. Blackham David V. ; Chodora Jason ; Dunsmore Joel P., Error correction method for reflection measurements of reciprocal devices in vector network analyzers.
  181. Swart Mark A. (Upland CA), Expandable diaphragm test modules and connectors.
  182. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L., Fabricating interconnects and tips using sacrificial substrates.
  183. Eldridge, Benjamin N.; Khandros, Igor Y., Fan out of interconnect elements attached to semiconductor wafer.
  184. Ronnekleiv,Erlend; Berg,Arne; Kringlebotn,Jon Thomas; Ellingsen,Reinold; Hjeime,Dag Roar, Fiber optic probes.
  185. Miller Charles A., Filter structures for integrated circuit interfaces.
  186. Miller, Charles A., Filter structures for integrated circuit interfaces.
  187. Smith Kenneth R., Fine pitch contact device employing a compliant conductive polymer bump.
  188. Paul M. Meaney ; Keith D. Paulsen ; Margaret W. Fanning, Fixed array microwave imaging apparatus and method.
  189. McBride Donald G. (Binghamton NY) Ellis Theron L. (Vestal NY), Flexible carrier for an electronic device.
  190. Parks Howard L. (Woodland Hills CA) Kuronen John M. (Camarillo CA), Flexible connector cable.
  191. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
  192. Baker Gary H., Flexible darkness adapting viewer.
  193. Crumly William R. (Anaheim CA), Flexible electrical cable connector with double sided dots.
  194. MacKay Colin A. (Austin TX), Flexible electrical interconnect and method of making.
  195. Barker Lynn M. (13229 Circulo Largo NE. Albuquerque NM 87112), Flexible fiber optic probe for high-pressure shock experiments.
  196. Harayama Chiharu (Atugi JPX), Flexible flat cable.
  197. Mazur, Robert G., Flexible membrane probe and method of use thereof.
  198. David Harry Eppes ; Michael Richard Bruce, Flip chip defect analysis using liquid crystal.
  199. Yanagawa Kouichi (Hachiojishi JPX) Yagi Kazuyuki (Hachiojishi JPX), Floating driver circuit and a device for measuring impedances of electrical components.
  200. Fogel Keith Edward ; Hedrick James Lupton ; Lauro Paul Alfred ; Liao Yun-Hsin ; Shih Da-Yuan, Foamed elastomers for wafer probing applications and interposer connectors.
  201. Huff Richard E. (Belmont CA) Leslie Brian (Cupertino CA), Force delivery system for improved precision membrane probe.
  202. Eldridge, Benjamin N.; Wenzel, Stuart W., Forming tool for forming a contoured microelectronic spring mold.
  203. Roman Frank (Star Rte. 113 Long Pond PA 18334), Fuel economizing device.
  204. Sogard, Michael, Gas cooled electrostatic pin chuck for vacuum applications.
  205. Shihadeh Elias E.,ILX ; Weiler Peter M., General purpose assembly programmable multi-chip package substrate.
  206. Godfrey Mark K. ; Crane Jessie G. ; Zadworniak Paul, Grid array package test contactor.
  207. Douglas,Philip Norris, Hand held voltage detection probe.
  208. Heigl Helmuth,DEX, Handling device.
  209. Frosch Robert A. Administrator of the National Aeronautics and Space Administration ; with respect to an invention of ( Westwood MA) Tschirch Richard P. (Westwood MA) Sidman Kenneth R. (Wayland MA), Heat sealable, flame and abrasion resistant coated fabric.
  210. Oliver Paul Leisten GB, Helical antenna.
  211. Ogawa, Koichi; Iwai, Hiroshi; Koyanagi, Yoshio, Helical antenna apparatus provided with two helical antenna elements, and radio communication apparatus provided with same helical antenna apparatus.
  212. Leisten Oliver Paul,GB2, Helical antenna having a solid dielectric core.
  213. Cannon, James E., High bandwidth oscilloscope probe with replaceable cable.
  214. Miller Charles A., High bandwidth passive integrated circuit tester probe card assembly.
  215. Chou,Min Chieh; Huang,Ya Ju; Wang,Horng Chieh, High conducting thin-film nanoprobe card and its fabrication method.
  216. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yaun, High density cantilevered probe for electronic devices.
  217. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density cantilevered probe for electronic devices.
  218. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density cantilevered probe for electronic devices.
  219. Chapin Fletcher W. (Vestal NY) Dranchak David W. (Endwell NY) Engle David E. (Vestal NY) Hall Richard R. (Endwell NY) Macek Thomas G. (Endicott NY), High density connector.
  220. Albrecht Thomas R. (San Jose CA) Mamin Harry J. (Palo Alto CA) Rugar Daniel (Palo Alto CA), High density data storage system with topographic contact sensor.
  221. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, High density integrated circuit apparatus, test probe and methods of use thereof.
  222. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Maurice Heathcote Norcott ; Da-Yuan Shih ; George Frederick Walker, High density integrated circuit apparatus, test probe and methods of use thereof.
  223. Feldman, Steven, High density probe device.
  224. Ardezzone Frank J. (Santa Clara CA), High density probe-head with isolated and shielded transmission lines.
  225. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density test probe with rigid surface structure.
  226. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan, High density test probe with rigid surface structure.
  227. Bove Ronald (Wappingers Falls NY) Hubacher Eric M. (Wappingers Falls NY), High density wafer contacting and test system.
  228. Wilson, Lester; Rincon, Reynaldo M.; Broz, Jerry; Arnold, Richard W., High density, area array probe card apparatus.
  229. Blanz John H. (Carlisle MA), High efficiency cryogenic test station.
  230. Hechtman Charles D. (Plainsboro NJ), High frequency in-circuit test fixture.
  231. Hreish, Emad B.; Miller, Charles A., High frequency printed circuit board via.
  232. Hreish, Emad B.; Miller, Charles A., High frequency printed circuit board via.
  233. Katoh Takayuki (Itami JPX), High frequency wafer probe including open end waveguide.
  234. Walker Douglas,GBX ; Iddon Robin,GBX, High impedance probe for monitoring fast ethernet LAN links.
  235. Chraft, Matthew; Henson, Roy J.; Miller, Charles A.; Tseng, Chih-Chiang, High performance probe system.
  236. Hollman, Kenneth F., High resolution analytical probe station.
  237. Bowman Douglas (Shrewsbury MA) Fay Fredric (Worcester MA) Rodgers Cyril (Paxton MA) Tuft Richard (Bolton MA), High speed digital imaging microscope.
  238. Scott ; Paul F., High speed frequency response measurement.
  239. Roch ; Jacques L., High speed precision chuck assembly.
  240. Roch Jacques L. (San Jose CA), High speed precision chuck assembly.
  241. Gleason K. Reed (Portland OR) Jones Keith E. (Aloha OR), High-frequency active probe having replaceable contact needles.
  242. Godshalk Edward M. (Beaverton OR) Williams Jeffrey A. (Beaverton OR) Burr Jeremy N. (Portland OR), High-frequency probe tip assembly.
  243. Johnson Robert B. (Laguna Beach CA), High-temperature, low-noise coaxial cable assembly with high strength reinforcement braid.
  244. Ohlsson Magnus,SEX ; Marcus Carina,SEX ; Fredriksson H.ang.kan,SEX, Horn antenna.
  245. Kovacs Gregory T. A. ; Borkholder David A., Hybrid biosensors.
  246. Kovacs Gregory T. A. ; Borkholder David A., Hybrid biosensors.
  247. Kiyokawa Toshiyuki (Kitakatsushika JPX) Hayama Hisao (Gyoda JPX), IC test equipment.
  248. Martel Anthony Paul ; McQuade Francis T., Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment.
  249. Bell Theodore F. (c/o Norbell Corp. ; 400 Fentress Blvd. Daytona Beach FL 32014), Index table.
  250. Khoshaba Mushie (Elk Grove Village IL), Indexing chuck.
  251. Spaziani Stephen (Nashua NH) Vaccaro Kenneth (Acton MA) Waters William (Bedford MA), Infrared receiver wafer level probe testing.
  252. Nikawa Kiyoshi,JPX, Inspection method and wiring current observation method for semiconductor device and apparatus of the same.
  253. Grube, Gary W., Insulative covering of probe tips.
  254. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Integral rigid chip test probe.
  255. Devoe, Daniel; Devoe, Alan; Devoe, Lambert, Integrated broadband ceramic capacitor array.
  256. Stockstad, Troy, Integrated circuit and method of controlling output impedance.
  257. Cole ; Jr. Edward I. (2116 White Cloud St. ; NE. Albuquerque NM 87112), Integrated circuit failure analysis by low-energy charge-induced voltage alteration.
  258. Charles A. Miller, Integrated circuit interconnect system.
  259. Miller, Charles A., Integrated circuit interconnect system.
  260. Miller, Charles A., Integrated circuit interconnect system.
  261. Miller, Charles A., Integrated circuit interconnect system.
  262. Charles A. Miller, Integrated circuit interconnect system forming a multi-pole filter.
  263. Grangroth Robert H. (Osseo MN) Loy Jerald M. (Anoka MN), Integrated circuit interface.
  264. Fritz Donald S., Integrated circuit package fabrication method.
  265. Schwartz Rodney E. ; Wirick Glenn M. ; Rogers Gary B., Integrated circuit probe card inspection system.
  266. Snyder Delmer E. (Hillsboro OR) Veenendaal Cornelis T. (Cornelius OR) Creedon Theodore G. (Lake Oswego OR), Integrated circuit probe station.
  267. Boll Gregory G. (Watchung NJ) Boll Harry J. (Berkeley Heights NJ), Integrated circuit probing apparatus.
  268. Boll Gregory G. (Naples FL) Boll Harry J. (Naples FL), Integrated circuit probing apparatus including a capacitor bypass structure.
  269. Hamburgen William R. (Menlo Park CA), Integrated circuit test fixture and method.
  270. Swapp Mavin C. (Gilbert AZ), Integrated circuit test with programmable source for both AC and DC modes of operation.
  271. Charles A. Miller, Integrated circuit tester with high bandwidth probe assembly.
  272. Miller, Charles A., Integrated circuit tester with high bandwidth probe assembly.
  273. Miller, Charles A., Integrated circuit tester with high bandwidth probe assembly.
  274. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Shih, Da-Yuan, Integrated compliant probe for wafer level test and burn-in.
  275. Henderson Watson R. (Broomfield CO) Paurus Floyd G. (Boulder CO) Szerlip Stanley R. (Longmont CO), Integrated decoupling capacitive core for a printed circuit board and method of making same.
  276. Robillard David R. (Westboro MA) Michals Robert L. (Marlboro MA), Integrated test and assembly device.
  277. Eldridge, Benjamin N.; Mathieu, Gaetan, Interconnect assemblies and methods.
  278. Khandros Igor Y. ; Pedersen David V. ; Eldridge Benjamin N. ; Roy Richard S. ; Mathieu Gaetan, Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device.
  279. Mathieu, Gaetan L.; Eldridge, Benjamin N., Interconnect for microelectronic structures with enhanced spring characteristics.
  280. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Madsen, Alec; Mathieu, Gaetan L., Interconnection element with contact blade.
  281. Khandros Igor Y. ; Mathieu Gaetan L., Interconnection substrates with resilient contact structures on both sides.
  282. Cowan, Joseph W., Interconnector and method of connecting probes to a die for functional analysis.
  283. Shih Da-Yuan ; Lauro Paul ; Fogel Keith Edward ; Beaman Brian ; Norcott Maurice, Interconnector with contact pads having enhanced durability.
  284. Shih Da-Yuan ; Lauro Paul ; Fogel Keith Edward ; Beaman Brian ; Norcott Maurice, Interconnector with contact pads having enhanced durability.
  285. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Interposer, socket and assembly for socketing an electronic component and method of making and using same.
  286. Back Gerald W. ; Mirowski Joseph A., Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits.
  287. Alani, Reza, Ion beam milling system and method for electron microscopy specimen preparation.
  288. Friend,Stephen H.; Stoughton,Roland; Linsley,Peter S.; Burchard,Julja, Iterative probe design and detailed expression profiling with flexible in-situ synthesis arrays.
  289. Khandros, Igor Y; Pedersen, David V.; Whitten, Ralph G., Large contactor with multiple, aligned contactor units.
  290. Kister January (Palo Alto CA), Large scale protrusion membrane for semiconductor devices under test with very high pin counts.
  291. Park Sang-il (Palo Alto CA) Smith Ian R. (Los Gatos CA) Kirk Michael D. (San Jose CA), Large stage system for scanning probe microscopes and other instruments.
  292. Bruce, Victoria J., Laser intrusive technique for locating specific integrated circuit current paths.
  293. Wang,Shixin, Lift-out probe having an extension tip, methods of making and using, and analytical instruments employing same.
  294. Kirk Duane B., Light-tight enclosure and joint connectors for enclosure framework.
  295. Mileski Paul (Mystic CT) Kornblith Jeffrey (Mystic CT), Lightweight deployable antenna system.
  296. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Lithographic contact elements.
  297. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Lithographic contact elements.
  298. Sayre Tracy L. ; Slutz Robert A. ; Kanack Kris J., Loaded-board, guided-probe test fixture.
  299. Taura Toru,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Matsunaga Kouji,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX ; Tsugane Hironori,JPX, Longitudinal type high frequency probe for narrow pitched electrodes.
  300. Aisenbrey,Thomas, Low cost electronic probe devices manufactured from conductive loaded resin-based materials.
  301. Ferlier Jean-Pierre (Yerres FRX), Low noise cable.
  302. Singles David T. (Newark DE) Walter Grant (Newark DE) Mortimer ; Jr. William P. (Conowingo MD), Low noise signal transmission cable.
  303. Littlebury Hugh W. (Chandler AZ) Simmons Marion I. (Tempe AZ), Low resistance probe for semiconductor.
  304. Tervo Paul A. ; Cowan Clarence E., Low-current pogo probe card.
  305. Schwindt Randy J., Low-current probe card with reduced triboelectric current generating cables.
  306. Boucher John N. (110 Coveridge La. Longwood FL 32779) Bajune David E. (6800 W. S.R. 46 Sanford FL 32773), Machine tool rotary table locking apparatus.
  307. Shin, Sung Chul; Choe, Sug Bong, Magneto-optical microscope magnetometer.
  308. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Making discrete power connections to a space transformer of a probe card assembly.
  309. Hattori, Atsuo; Yoshino, Toshitaka; Hamano, Tetsutsugu; Sugiura, Masahiro, Manufacture of probe unit having lead probes extending beyond edge of substrate.
  310. Bhatt Anilkumar Chinuprasad ; Magnuson Roy Harvey ; Miller Thomas Richard ; Markovich Voya Rista ; Sambucetti Carlos J. ; Tisdale Stephen Leo, Manufacturing computer systems with fine line circuitized substrates.
  311. Chong, Fu Chiung; Mok, Sammy, Massively parallel interface for electronic circuits.
  312. del Rio Eddy H. (Jupiter FL), Means to orbit and rotate target wafers supported on planet member.
  313. Mitchell David H. (Pacific Palisades CA) Mitchell Ralph M. (Pacific Palisades CA), Measurement of ligand/anti-ligand interactions using bulk conductance.
  314. Habu Satoshi (Hachioji JPX), Measuring cable and measuring system.
  315. Sepponen Raimo E. (Pitkansillanranta 7-9 C 111 00530 Helsinki 53 FIX), Medical diagnostic microwave scanning apparatus.
  316. Crumly William R. (Anaheim CA), Membrane connector with stretch induced micro scrub.
  317. Kister January ; Lobacz Jerzy, Membrane for holding a probe tip in proper location.
  318. Huff Richard E. (Belmont CA), Membrane probe contact bump compliancy system.
  319. Egitto,Frank D.; Miller,Keith J.; Nguyen,Manh Quan T., Membrane probe with anchored elements.
  320. Huff Richard E. (1408 Solana Dr. Belmont CA 94002) Perlaki Miklos (1406 Sage Rd. Colfax CA 95713), Membrane probe with automatic contact scrub action.
  321. Liu Ken K. F. (Saratoga CA) Min Byoung-Youl (Cupertino CA) Moti Robert J. (San Jose CA) Husain Syed A. (Milpitas CA), Membrane probing of circuits.
  322. Gleason Reed ; Bayne Michael A. ; Smith Kenneth ; Lesher Timothy ; Koxxy Martin, Membrane probing system.
  323. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  324. Tervo, Paul A.; Smith, Kenneth R.; Cowan, Clarence E.; Dauphinais, Mike P.; Koxxy, Martin J., Membrane probing system.
  325. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  326. Gleason K. Reed ; Smith Kenneth R. ; Bayne Mike, Membrane probing system with local contact scrub.
  327. Harvey C. Hamel ; Charles H. Perry ; Yuet-Ying Yu, Metal buckling beam probe.
  328. Phillips James Patrick, Method and antenna for providing an omnidirectional pattern.
  329. Roman Vitenberg IL, Method and apparatus for RF common-mode noise rejection in a DSL receiver.
  330. Beckous,Frank R.; Czikora,Paul A.; Squires,John J., Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts.
  331. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L., Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component.
  332. Cabot Richard C., Method and apparatus for asynchronously measuring frequency shifted signals.
  333. Graham Daniel J. ; Holt Alyn R. ; Matthiessen Robert E. ; Weilerstein I. Marvin ; West Christopher L., Method and apparatus for automated docking of a test head to a device handler.
  334. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Method and apparatus for burning-in semiconductor devices in wafer form.
  335. Bockelman David E. ; Eisenstadt William R., Method and apparatus for calibrating a network analyzer.
  336. Marcuse, Arno G.; Most, Robert A.; North, Edward S., Method and apparatus for cleaning electronic test contacts.
  337. Marin, Irina A.; Gehrmann, Thomas, Method and apparatus for contemporaneous utilization of a higher order probe in pre-stack and post-stack seismic domains.
  338. Mathieu Gaetan L., Method and apparatus for controlling plating over a face of a substrate.
  339. Mathieu, Gaetan L., Method and apparatus for controlling plating over a face of a substrate.
  340. Chapman, Robert G.; Hefti, John; Bartell, Barrett J.; Rhodes, Mark A.; Zhao, Min; Palmer, Tyler, Method and apparatus for detection of molecular events using temperature control of detection environment.
  341. Kaplan Russell ; Scherp Ralph, Method and apparatus for direct probe sensing.
  342. Thomas S. Tarter ; Nhon T. Do, Method and apparatus for electrical characterization of an integrated circuit package using a vertical probe station.
  343. Chen Kuo-Chun (Birmingham MI), Method and apparatus for electromagnetic radiation of biological material.
  344. James Michael (Sunrise FL) Frazer James T. (Coral Springs FL) Scott David (Coral Springs FL), Method and apparatus for facilitating loop take time adjustment in multi-needle quilting machine.
  345. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method and apparatus for handling wafers.
  346. Klingenbeck Klaus (Hessdorf DEX) Regn Judith (Nuremberg DEX), Method and apparatus for identifying the distribution of the dielectric constants in an object.
  347. Farnworth Warren (Nampa ID) Wood Alan (Boise ID), Method and apparatus for manufacturing known good semiconductor die.
  348. Blaess Gerhard (Olching DEX), Method and apparatus for measurement of attenuation and distortion by a test object.
  349. Fryer Michael O. ; Hills Andrea J. ; Morrison John L., Method and apparatus for measuring butterfat and protein content using microwave absorption techniques.
  350. Martin Samuel Suresh, Method and apparatus for measuring electrical noise in devices.
  351. Heffner Brian L. (Redwood City CA), Method and apparatus for measuring polarization sensitivity of optical devices.
  352. Misra Devendra K. (Whitefish Bay WI), Method and apparatus for measuring the permittivity of materials.
  353. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage.
  354. Back, Gerald W.; Dang, Son; Tunaboylu, Bahadir, Method and apparatus for probe tip cleaning and shaping pad.
  355. Adamian Vahe A. (Lexington MA), Method and apparatus for providing and calibrating a multiport network analyzer.
  356. Milesky Lawrence (Needham MA) AbiChaker David G. (West Roxbury MA), Method and apparatus for sensing a fluid handling.
  357. Khandros, Igor Y.; Dozier, Thomas H.; Grube, Gary W.; Mathieu, Gaetan L., Method and apparatus for shaping spring elements.
  358. Khandros, Igor Y.; Dozier, Thomas H.; Grube, Gary W.; Mathieu, Gaetan L., Method and apparatus for shaping spring elements.
  359. Reano, Ronald M.; Whitaker, John F.; Katehi, Linda P. B., Method and apparatus for simultaneous measurement of electric field and temperature using an electrooptic semiconductor probe.
  360. Abercrombie David A. (Cedar Park TX) Waldo Whitson G. (Hutto TX), Method and apparatus for testing an integrated circuit.
  361. Hidehira,Yorio, Method and apparatus for testing circuit boards.
  362. Ondricek, Douglas S.; Pedersen, David V., Method and apparatus for the transport and tracking of an electronic component.
  363. Eldridge Benjamin N. (Danville CA) Mathieu Gaetan L. (Livermore CA), Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires.
  364. Brady Michael John ; Duan Dah-Weih, Method and apparatus for wireless radio frequency testing of RFID integrated circuits.
  365. Burns Mark A. (Garland TX), Method and apparatus of eliminating interference in an undersettled electrical signal.
  366. Burns Mark, Method and apparatus to measure non-coherent signals.
  367. Nelson, Michael D.; Lesea, Austin H.; Agatep, Antolin S., Method and apparatus using a semiconductor die integrated antenna structure.
  368. Mathieu,Gaetan L., Method and system for compensating thermally induced motion of probe cards.
  369. Eldridge, Benjamin N.; Brandemuehl, Mark W.; Graef, Stefan; Parent, Yves, Method and system for designing a probe card.
  370. Eldridge, Benjamin N.; Juergen Zschiegner, Stefan Jan, Method and system for detecting an arc condition.
  371. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method for constructing a membrane probe using a depression.
  372. Abiko Tohru,JPX, Method for detecting a contact position between an object to be measured and measuring pins.
  373. John Hefti, Method for detecting and classifying nucleic acid hybridization.
  374. Schreiber Christopher M. (Newport Beach CA) Feigenbaum Haim (Irvine CA), Method for electrodepositing corrosion barrier on isolated circuitry.
  375. Feldberg Simon,ILX, Method for enumerating bacterial populations.
  376. Farnworth Warren M. (Nampa ID), Method for fabricating a penetration limited contact having a rough textured surface.
  377. Matsunaga,Noriaki; Shibata,Hideki; Hayasaka,Nobuo, Method for fabricating a probe pin for testing electrical characteristics of an apparatus.
  378. Miller, Charles A., Method for fabricating an IC interconnect system including an in-street integrated circuit wafer via.
  379. Lu, Nai-Cheng; Liao, Yu-Ting; Liu, Fu-Sung, Method for fabricating microelectronic fabrication electrical test apparatus electrical probe tip having pointed tips.
  380. Kouji Matsunaga JP; Hirobumi Inoue JP; Masao Tanehashi JP; Toru Taura JP; Masahiko Nikaidou JP; Yuuichi Yamagishi JP; Satoshi Hayakawa JP, Method for fabricating probe tip portion composed by coaxial cable.
  381. Elder Richard A. (Dallas TX) Wilson Arthur M. (Dallas TX) Bagen Susan V. (Dallas TX) Miller Juanita G. (Richardson TX), Method for fabrication of probe card for testing of semiconductor devices.
  382. Akram Salman (Boise ID) Farnworth Warren M. (Nampa ID) Wood Alan G. (Boise ID), Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrica.
  383. Anderson Karl F., Method for guarding electrical regions having potential gradients.
  384. Kister, January, Method for making a probe apparatus for testing integrated circuits.
  385. Kister January, Method for making a probe preserving a uniform stress distribution under deflection.
  386. Leedy Glenn (1061 E. Mountain Dr. Santa Barbara CA 93108), Method for making an interconnection structure for integrated circuits.
  387. Smyth ; Jr. John B. (Corvallis OR) Tappon Ellen R. (Corvallis OR), Method for making flexible circuit card with laser-contoured vias and machined capacitors.
  388. Henson, Roy, Method for manufacturing a multi-layer printed circuit board.
  389. Khandros Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  390. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  391. Khandros, Igor Y., Method for manufacturing raised electrical contact pattern of controlled geometry.
  392. Mautz Karl Emerson, Method for measuring a characteristic of a semiconductor wafer using cylindrical control.
  393. Ondricek, Douglas S.; Pedersen, David V., Method for mounting an electronic component.
  394. Fyfield, Margaret S., Method for probing a semiconductor wafer.
  395. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Method for probing an electrical device having a layer of oxide thereon.
  396. Ondricek, Douglas S.; Pederson, David V., Method for processing an integrated circuit including placing dice into a carrier and testing.
  397. Thomas M. Moore ; Rocky D. Kruger ; Cheryl Hartfield, Method for sample separation and lift-out with one cut.
  398. Igor Y. Khandros ; Thomas H. Dozier ; Gary W. Grube ; Gaetan L. Mathieu, Method for shaping spring elements.
  399. Arwin ; Hans R. ; Lundstrom ; Kurt I., Method for studying enzymatic and other biochemical reactions.
  400. Strunk Timothy L. (Lexington KY) Westerman Glenn S. (Lexington KY), Method for testing DC motors.
  401. Swapp Mavin C. (Gilbert AZ), Method for testing integrated devices.
  402. Ralph G. Whitten ; Benjamin N. Eldridge, Method for testing signal paths between an integrated circuit wafer and a wafer tester.
  403. Peter Nayler FR; Nicholas Smears FR; Philippe Planelle FR, Method for the calibration of an RF integrated circuit probe.
  404. Cheng David (711 Hibernia Ct. Sunnyvale CA 94087), Method for transporting and testing wafers.
  405. Eldridge, Benjamin N., Method of assembling and testing an electronics module.
  406. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of burning-in semiconductor devices.
  407. Kamitani, Gaku, Method of correcting measurement error and electronic component characteristic measurement apparatus.
  408. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.
  409. Miller, Charles A.; Long, John M., Method of designing, fabricating, testing and interconnecting an IC to external circuit nodes.
  410. Martin,Samuel S.; Baker,Brian R., Method of establishing benchmark for figure of merit indicative of amplifier flicker noise.
  411. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Wenzel, Stuart W., Method of fabricating shaped springs.
  412. Trobough Douglas W. (Beaverton OR), Method of forming a conductive contact bump on a flexible substrate and a flexible substrate.
  413. Beaman, Brian Samuel; Fogel, Keith Edward; Lauro, Paul Alfred; Norcott, Maurice Heathcote; Shih, Da-Yuan, Method of forming a structure for electronic devices contact locations.
  414. Beaman Brain S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Method of forming a three dimensional high performance interconnection package.
  415. Yamaguchi Masao (Tokyo JPX), Method of identifying probe position and probing method in prober.
  416. Ubbens Henricus D. U. (Eindhoven NLX) Langeveld Peer (Eindhoven NLX), Method of interconnecting conductors of different layers of a multilayer printed circuit board.
  417. Woith Blake F. (Orange CA) Pasiecznik ; Jr. John (Malibu CA) Crumly William R. (Anaheim CA) Betz Robert K. (Long Beach CA), Method of making a cast elastomer/membrane test probe assembly.
  418. Leedy Glenn J. (1061 E. Mountain Dr. Santa Barbara CA 93108), Method of making a flexible tester surface for testing integrated circuits.
  419. Chen Jimmy Kuo-Wei ; Eldridge Benjamin N. ; Dozier Thomas H. ; Yeh Junjye J. ; Herman Gayle J., Method of making a product with improved material properties by moderate heat-treatment of a metal incorporating a dilute additive.
  420. Mathieu Gaetan L. ; Eldridge Benjamin N. ; Grube Gary W., Method of making and using lithographic contact springs.
  421. Etsuji Suzuki JP; Akira Yonezawa JP; Toshio Okuno JP, Method of making conductive bump on wiring board.
  422. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making contact tip structures.
  423. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice H. ; Shih Da-Yuan ; Walker George Frederick, Method of making high density integral test probe.
  424. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Method of making lithographic contact springs.
  425. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Method of making microelectronic contact structures.
  426. Eldridge Benjamin N. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V., Method of making microelectronic spring contact elements.
  427. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of making temporary connections between electronic components.
  428. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L., Method of manufacturing a probe card.
  429. Grube, Gary W.; Khandros, Igor Y.; Eldridge, Benjamin N.; Mathieu, Gaetan L.; Lotfizadeh, Poya; Tseng, Chih-Chiang, Method of manufacturing a probe card.
  430. Chance Randal W. (Boise ID), Method of manufacturing edge connected semiconductor die.
  431. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  432. Ackerman David A. (Hopewell NJ) Camarda Renato M. (Fanwood NJ) Hartman Robert L. (Warren NJ) Spector Magaly (Wyomissing PA), Method of manufacturing high-quality semiconductor light-emitting devices.
  433. Roberts Joseph A. (Grafton NH), Method of manufacturing printed circuits.
  434. Saijyo, Masakatsu; Kato, Toshiaki, Method of measuring contact resistance of probe and method of testing semiconductor device.
  435. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y ; Mathieu Gaetan L., Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method.
  436. Khandros Igor Y., Method of mounting free-standing resilient electrical contact structures to electronic components.
  437. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of mounting resilient contact structures to semiconductor devices.
  438. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of planarizing tips of probe elements of a probe card assembly.
  439. Lee William T. (San Jose CA) Soetarman Ronny (San Jose CA) Talbot Christopher G. (Menlo Park CA), Method of probing a net of an IC at an optimal probe-point.
  440. Collins Kenneth S. ; Buchberger Douglas, Method of processing a wafer within a reaction chamber.
  441. Watanabe Takashi,JPX ; Yoshida Minako,JPX, Method of producing micro contact structure and contact probe using same.
  442. Eldridge Benjamin N. ; Mathieu Gaetan L., Method of severing bond wires and forming balls at their ends.
  443. Khandros Igor Y. ; Mathieu Gaetan L., Method of stacking electronic components.
  444. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of temporarily, then permanently, connecting to a semiconductor device.
  445. Khoury Theodore Andrew ; Goode Raun L. ; Bustos Larry J., Method of testing a semiconductor device by automatically measuring probe tip parameters.
  446. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Method of testing semiconductor.
  447. Budnaitis John J. ; Leong Jimmy, Method of wafer level burn-in.
  448. Pearce Charles Walter ; Billig Michael Steven, Method to selectively heat semiconductor wafers.
  449. Aitren, John M.; Chen, Fen; Condon, Kevin L.; Dionne, Mark F.; Nuttall, Gregory E., Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studies.
  450. Swartz Harold M. ; Goda Fuminori ; Walczak Tadeusz ; Liu Ke Jian, Methodology for determining oxygen in biological systems.
  451. Hershel, Ron; Campbell, Rich; Killeen, Timothy S.; Snow, Donald B., Methods and apparatus for determining the relative positions of probe tips on a printed circuit board probe card.
  452. Gordon Gary B. ; Dellinger Douglas J., Methods and devices for carrying out chemical reactions.
  453. Hefti, John, Methods for analyzing protein binding events.
  454. Gaetan L. Mathieu ; Benjamin N. Eldridge ; Gary W. Grube, Methods for making spring interconnect structures.
  455. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods.
  456. McLean, James S., Metrology antenna system utilizing two-port, sleeve dipole and non-radiating balancing network.
  457. Cherian,Gabe, Micro probe.
  458. Palagonia Anthony Michael ; Pikna Paul Joseph ; Maddix John Thomas, Micro probe assembly and method of fabrication.
  459. Carver Thomas E. (Mountain View CA), Microcasting of microminiature tips.
  460. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  461. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Microelectronic contact structures, and methods of making same.
  462. Benjamin N. Eldridge ; Gary W. Grube ; Igor Y. Khandros ; Gaetan L. Mathieu, Microelectronic spring contact element and electronic component having a plurality of spring contact elements.
  463. Eldridge, Benjamin N.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V., Microelectronic spring contact elements.
  464. Grube, Gary W.; Mathieu, Gaetan L., Microelectronic spring contact repair.
  465. Grube, Gary W., Microelectronic spring with additional protruding member.
  466. Akram Salman ; Hembree David R. ; Wood Alan G., Micromachined probe card having compliant contact members for testing semiconductor wafers.
  467. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
  468. DeNure Charles R., Microscope collision protection apparatus.
  469. Marzan Jose M. (Northridge CA), Microstrip probe.
  470. Murphy Earl R. (Scottsdale AZ), Microstrip to waveguide transition.
  471. Lo Chiwoei Wayne ; Perez Pierre, Microstructure defect detection.
  472. Faxvog Frederick R. (Rochester MI) Krage Mark K. (Royal Oak MI), Microwave acoustic spectrometer.
  473. Bridges Jack E. ; Taflov Allen ; Hagness Susan C. ; Sahakian Alan, Microwave antenna for cancer detection system.
  474. Kasevich Raymond S. ; Selkowitz Stuart M., Microwave devices for medical hyperthermia, thermotherapy and diagnosis.
  475. Bridges Jack E., Microwave method and system to detect and locate cancers in heterogenous tissues.
  476. Kashima Yukiro,JPX, Microwave mixing circuit.
  477. King Ray J. (Pleasanton CA) King Karl V. (Pleasanton CA), Microwave needle dielectric sensors.
  478. Bereskin Alexander B. (452 Riddle Rd. Cincinnati OH 45220), Microwave test fixtures for determining the dielectric properties of a material.
  479. Larsen Lawrence E. (Silver Spring MD) Jacobi John H. (Bowie MD), Microwave time delay spectroscopic methods and apparatus for remote interrogation of biological targets.
  480. Svenson Robert H. ; Semenov Serguei Y.,RUX ; Baranov Vladimir Y.,RUX, Microwave tomographic spectroscopy system and method.
  481. Gleason K. Reed (Portland OR) Jones Keith E. (Beaverton OR) Strid Eric W. (Portland OR), Microwave wafer probe having replaceable probe tip.
  482. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe.
  483. Majidi-Ahy Gholamreza (Sunnyvale CA) Bloom David M. (Portola Valley CA), Millimeter-wave active probe system.
  484. Lo Jiann-Chang ; Servedio Michael ; Hammond James Michael, Miniature probe positioning actuator.
  485. Kister, January, Modular probe apparatus.
  486. Cheng, Shih-Jye; Liu, An-Hong; Wang, Yeong-Her; Chao, Yeong-Ching; Lee, Yao-Jung, Modularized probe head.
  487. January Kister ; Jean-Michel Jurin FR; Isabelle George FR, Modulated space transformer for high density buckling beam probe and method for making the same.
  488. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Mounting spring elements on semiconductor devices.
  489. Eggers Mitchell D. (10 Plum Ct. The Woodlands TX 77381) Hogan Michael E. (103 Golden Shadow Cir. The Woodlands TX 77381) Beattie Kenneth Loren (2 Hollymead Dr. The Woodlands TX 77381) Shumaker John (, Multi site molecule detection method.
  490. Buchoff Leonard S. (Bloomfield NJ) Dalamangas Chris A. (Union NJ), Multi-conductor probe.
  491. Smolley Robert (Porteughese Bend CA), Multi-element circuit construction.
  492. Satya, Akella V. S.; Adler, David L.; Tsai, Bin-Ming Benjamin; Walker, David J., Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices.
  493. Phillips James P. (Lake in the Hills IL) Krenz Eric L. (Crystal Lake IL), Multi-port radio frequency signal transformation network.
  494. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength laser system, probe station and laser cutter system using the same.
  495. Leong Tony P. ; North Edward S. ; Herbst Richard Linsley, Multi-wavelength variable attenuator and half wave plate.
  496. Arnold Allen J. (LaGrangeville NY) Bariether Michael E. (LaGrangeville NY) Chiang Shin-Wu (Hopewell Junction NY) Dalal Hormazdyar M. (Wappingers Falls NY) Miller Robert A. (Walden NY) Montegari Frank, Multilayer capacitor.
  497. Hafeman Dean G. (San Bruno CA) McConnell Harden M. (Stanford CA), Multiple chemically modulated capacitance determination.
  498. Mitchell, Scott W.; Rincon, Reynaldo M.; Broz, Jerry; Laugier, Gerard, Multiple contact vertical probe solution enabling Kelvin connection benefits for conductive bump probing.
  499. Miller, Charles A., Multiple die interconnect system.
  500. Yasunaga Soichiro (Kawasaki JPX), Multiple function type D/A converter.
  501. Greub Hans J. (Troy NY) Garuts Valdis E. (Beaverton OR), Multiple lead probe for integrated circuits in wafer form.
  502. Altmann, Stephan Maximilian; H?rber, Johann Karl Heinrich, Multiple local probe measuring device and method.
  503. Altmann, Stephen Maximilian; Hörber, Johann Karl Heinrich, Multiple local probe measuring device and method.
  504. Hwang,David, Multiple two axis floating probe block assembly using split probe block.
  505. Rincon,Reynaldo M.; Arnold,Richard W., Multiple-chip probe and universal tester contact assemblage.
  506. Pasiecznik ; Jr. John (Malibu CA), Multiport membrane probe for full-wafer testing.
  507. Hasegawa, Kenichi; Saguchi, Toshihiro, NMR probe.
  508. Lim, Yit Aun; Maas, Werner E., NMR probe circuit for generating close frequency resonances.
  509. Choma ; Jr. John (Hacienda Heights CA), NPN Operational amplifier.
  510. Ryken, Jr., Marvin L.; Davis, Albert F., Near field probe.
  511. Mitsuoka,Yasuyuki; Chiba,Norio; Kasama,Nobuyuki; Niwa,Takashi; Nakajima,Kunio, Near-field optical probe.
  512. Jun, Tae-Un, Needle assembly of probe card.
  513. Yu, Hyun-Sik; Choi, Ji-Man; Shin, In-Dae, Needle fixture of a probe card in semiconductor inspection equipment and needle fixing method thereof.
  514. Smith Thane (Middletown MD) Huang Ho-Chung (Potomac MD) Lee Chi Hsiang (Potomac MD), Non-destructive semiconductor wafer probing system using laser pulses to generate and detect millimeter wave signals.
  515. Bridges Jack E., Non-invasive system for breast cancer detection.
  516. Sawyer David E. (Rockville MD), Nondestructive method for detecting defects in photodetector and solar cell devices.
  517. Wang,Changting; Plotnikov,Yuri Alexeyevich; Nath,Shridhar Champaknath; McKnight,William Stewart; Gambrell,Gigi Olive, Omnidirectional eddy current probe and inspection system.
  518. Hollis Mark A. (Concord MA) Ehrlich Daniel J. (Lexington MA) Murphy R. Allen (Boxboro MA) Kosicki Bernard B. (Acton MA) Rathman Dennis D. (Ashland MA) Chen Chang-Lee (Sudbury MA) Mathews Richard H. (, Optical and electrical methods and apparatus for molecule detection.
  519. Hollis Mark A. ; Ehrlich Daniel J. ; Murphy R. Allen ; Kosicki Bernard B. ; Rathman Dennis D. ; Mathews Richard H. ; Burke Barry E. ; Eggers Mitch D. ; Hogan Michael E. ; Varma Rajender Singh, Optical and electrical methods and apparatus for molecule detection.
  520. Hideo, Hosono; Masahiro, Hirano; Masanori, Oto; Gen, Tochitani; Susumu, Ohneda; Shinnya, Kikugawa, Optical fiber for transmitting ultraviolet ray, optical fiber probe, and method of manufacturing the optical fiber probe.
  521. Ravel Mihir K. (Portland OR) Jones Michael D. (Portland OR) Pepper Steven H. (Portland OR), Optical module for an optically based measurement system.
  522. Johannessen,Kjetil, Optical probe for wafer testing.
  523. Lee William T. (San Jose CA) Soetarman Ronny (San Jose CA) Talbot Christopher Graham (Menlo Park CA), Optimal probe point placement.
  524. Mullen Ruth A. (Malibu CA), Opto-electronic membrane probe.
  525. Henson, Roy, PC board having clustered blind vias.
  526. Richard S. Roy ; Charles A. Miller, Parallel testing of integrated circuit devices using cross-DUT and within-DUT comparisons.
  527. Nikawa Kiyoshi,JPX, Parasitic MIM structural spot analysis method for semiconductor device and parasitic MIM structure spot analysis method for silicon semiconductor device.
  528. Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Partially-overcoated elongate contact structures.
  529. Godfrey Mark K. ; Crane Jesse G. ; Zadworniak Paul ; Marinac Daniel C, Peripherally leaded package test contactor.
  530. Smith ; III Richard S., Photonic field probe and calibration means thereof.
  531. Viswanath Ram S., Pickup chuck with an integral heat pipe.
  532. Knibbe Jan C. (Detroit MI) McPhee Willard J. (Bloomfield Hills MI), Piercing apparatus.
  533. Veenendaal Cornelis T. (Cornelius OR), Piezoelectric pressure sensing apparatus for integrated circuit testing stations.
  534. Bryson Stephen W. (Cupertino CA) Kondo Alan T. (Cupertino CA) Lee Don N. (San Jose CA), Pin driver amplifier.
  535. Mahler,Wolfgang; Landstorfer,Friedrich; Motzer,J체rgen, Planar antenna and antenna system.
  536. Gaspari Russell A. (6656 W. 87th Place Los Angeles CA 90045), Planar balun.
  537. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W., Planarizer for a semiconductor contactor.
  538. Mauney Terry Lee (25 Cross Ridge Ct. Germantown MD 20874), Plant growing system.
  539. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Pluggable chip scale package.
  540. Anderson Richard L. (Austin TX), Pneumatic energy fluxmeter.
  541. Anderson Richard L. (Austin TX), Pneumatic energy fluxmeter.
  542. Lass Bennett D. (85 Harman Rd. Edison NJ 08837), Portable collapsible darkroom.
  543. Colvin James Barry, Portable emission microscope workstation for failure analysis.
  544. Inoue Mitsuru (Utsunomiya JPX), Positioning stage device exposure apparatus and device manufacturing method utilizing the same.
  545. Eldridge, Benjamin N.; Miller, Charles A., Predictive, adaptive power supply for an integrated circuit under test.
  546. Li Du ; Zou Rose, Preparation of transmission electron microscope samples.
  547. Aksu Akin (739 E. 223rd St. Carson CA 90745), Printed circuit board testing means.
  548. Yamaguchi Masao (Tokyo JPX), Probe apparatus.
  549. Yoshioka, Haruhiko, Probe apparatus.
  550. Takebuchi, Ryuichi, Probe apparatus and method of alignment for the same.
  551. Mori, Shigeoki; Karasawa, Wataru, Probe apparatus for probing an object held above the probe card.
  552. Abe Yuichi (Tokyo JPX) Yamaguchi Masao (Tokyo JPX) Nagasaka Munetosi (Yamanashi-ken JPX), Probe apparatus for testing multiple integrated circuit dies.
  553. January Kister, Probe apparatus having removable beam probes.
  554. Mochizuki Kohei,JPX ; Habu Satoshi,JPX, Probe apparatus with RC circuit connected between ground and a guard.
  555. Mori Shigeoki (Ayase CA JPX) Karasawa Wataru (Cupertino CA) Fujihara Hitoshi (Yamanashi JPX) Suzuki Masaru (Kofu JPX) Yokota Keiichi (Nirasaki JPX), Probe apparatus with a swinging holder for an object of examination.
  556. Nakajima Hisashi,JPX ; Yoshioka Haruhiko,JPX, Probe apparatus with tilt correction mechanisms.
  557. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Lander Jack (Danbury CT), Probe assembly for testing integrated circuit devices.
  558. January Kister, Probe assembly having floatable buckling beam probes and apparatus for abrading the same.
  559. Ji, Joon-Su; Hwang, In-Seok; Lee, Doo-Seon; Kim, Byoung-Joo; Ro, Young-Kyo; Lee, Ho-Yeol, Probe card.
  560. Sugawara, Shinichi, Probe card.
  561. Sharif, Adam K., Probe card and probe needle for high frequency testing.
  562. David R. Hembree ; Warren M. Farnworth ; Salman Akram ; Alan G. Wood ; C. Patrick Doherty ; Andrew J. Krivy, Probe card and test system for semiconductor wafers.
  563. Higgins H. Dan, Probe card apparatus.
  564. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.
  565. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Probe card assembly.
  566. Eldridge, Benjamin Niles; Grube, Gary William; Khandros, Igor Yan; Mathieu, Gaetan L., Probe card assembly and kit, and methods of making same.
  567. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Probe card assembly and kit, and methods of using same.
  568. Eldridge, Benjamin N.; Grube, Gary W.; Mathieu, Gaetan L., Probe card assembly for contacting a device with raised contact elements.
  569. Yamagata Kazumi,JPX, Probe card attaching mechanism.
  570. Sinsheimer Roger (Petaluma CA) Richards Tom (Petaluma CA), Probe card changer system and method.
  571. Miller, Charles A., Probe card cooling assembly with direct cooling of active electronic components.
  572. Lou, Choon-Leong; Hsu, Mei-Shu, Probe card for electrical testing a chip in a wide temperature range.
  573. Boll, Harry J.; Boll, Gregory G., Probe card for high speed testing.
  574. Yoon,Soo, Probe card for testing semiconductor device.
  575. Kirby, Kyle K., Probe card for use with microelectronic components, and methods for making same.
  576. Okubo Kazumasa (Kanagawa JPX) Okubo Masao (Nishinomiya JPX) Yoshimitsu Yasuro (Takatsuki JPX) Sugaya Kiyoshi (Amagasaki JPX), Probe card in which contact pressure and relative position of each probe end are correctly maintained.
  577. Anderson James C. (Santa Rosa CA) Phillips Brian P. (Glenn Ellen CA) Honek Charles (Santa Rosa CA), Probe card system and method.
  578. Sporck, A. Nicholas; Shinde, Makarand S., Probe card with coplanar daughter card.
  579. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card with plural probe tips on a unitary flexible tongue.
  580. Fink,Steven T.; Windhorn,Thomas H., Probe cartridge assembly and multi-probe assembly.
  581. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Probe construction using a recess.
  582. Aldaz, Robert Edward; Khoury, Theodore A., Probe contract system having planarity adjustment mechanism.
  583. Matsumoto,Toshiko; Nakashige,Ryo; Nozaki,Yasuyuki; Ueno,Shingo; Tamura,Takuro, Probe designing apparatus and probe designing method.
  584. Kawaguchi, Koji; Shimizu, Masashi, Probe device.
  585. Ikeda Towl (Kofu JPX), Probe device having micro-strip line structure.
  586. Hayden, Leonard; Rumbaugh, Scott; Andrews, Mike, Probe for combined signals.
  587. Hayden, Leonard; Rumbaugh, Scott; Andrews, Mike, Probe for combined signals.
  588. Pasiecznik ; Jr. John (Malibu CA), Probe for jesting an electrical circuit chip.
  589. Furuta Masaji,JPX ; Yanagawa Koichi,JPX, Probe for measuring signals.
  590. McMurtry David R. (Wotton-Under-Edge GBX) Thomas David K. (Stinchcombe GBX), Probe for measuring surface roughness by sensing fringe field capacitance effects.
  591. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Probe for testing a device under test.
  592. Aksu ; Akin, Probe head for testing printed circuit boards.
  593. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  594. Chaya,Hiromi; Hayashi,Takahisa; Komatsu,Shigekazu, Probe mark reading device and probe mark reading method.
  595. Tanaka Hideaki,JPX ; Akaike Shinji,JPX ; Marumo Yoshihito,JPX, Probe method and apparatus with improved probe contact.
  596. Maeda, Yasuhiro; Takayanagi, Fumikazu, Probe module and a testing apparatus.
  597. Mizuta Masaharu,JPX, Probe needle for vertical needle type probe card and fabrication thereof.
  598. Okumura,Katsuya; Furuya,Kunihiro, Probe pins zero-point detecting method, and prober.
  599. Brown John ; Costello Matthew J. ; DosSantos Luciano P. ; Ruck Robin, Probe station adapter for backside emission inspection.
  600. Streib George H. ; Schwindt Randy J., Probe station for low current, low voltage parametric measurements using multiple probes.
  601. Schwindt Randy (Portland OR), Probe station having conductive coating added to thermal chuck insulator.
  602. Brian Samuel Beaman ; Keith Edward Fogel ; Paul Alfred Lauro ; Yun-Hsin Liao ; Daniel Peter Morris ; Da-Yuan Shih, Probe structure having a plurality of discrete insulated probe tips.
  603. Karavakis, Konstantine N.; Nguyen, Tom T., Probe structures using clamped substrates with compliant interconnectors.
  604. Hiroshi Noda JP, Probe stylus.
  605. Boll Gregory George ; Boll Harry Joseph, Probe tip structure.
  606. Donald A Whiteman, Probe tip terminating device providing an easily changeable feed-through termination.
  607. Martens, Jon S., Probe tone S-parameter measurements.
  608. Brassell, Gilbert; Wickland, Terry J.; Popish, Darold M., Probe with integral vent, sampling port and filter element.
  609. Kobayashi, Masahito; Yoshioka, Haruhiko; Fujita, Takafumi, Prober.
  610. Watts Michael P. C. (Portola Valley CA) Hendler Lawrence (Cupertino CA), Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane.
  611. Sinsheimer Roger, Prober-tester electrical interface for semiconductor test.
  612. Sakai Takamasa (Kusatsu JPX) Kono Motohiro (Kyoto JPX) Umaba Takayuki (Kusatsu JPX) Nakagawa Yoshiyuki (Kyoto JPX) Koyama Yoshihiro (Takatsuki JPX), Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer.
  613. Kasukabe, Susumu; Hasebe, Akio, Probing device and manufacturing method thereof, as well as testing apparatus and manufacturing method of semiconductor with use thereof.
  614. Sakagawa, Hideo; Watanabe, Takashi, Probing method and prober.
  615. Kobayashi,Masahito; Ishii,Kazunari, Probing method and probing apparatus.
  616. Sun, Luen-Chian, Probing of device elements.
  617. Ohno Akira (Yamanashi JPX) Ohtsuka Tetsuo (Kawasaki JPX) Matsumoto Naotaka (Tama JPX), Probing test device.
  618. Stevens, Mac, Process and apparatus for adjusting traces.
  619. Stevens, Mac; Parent, Yves, Process and apparatus for finding paths through a routing space.
  620. Nosov Eugene (Omaha NE), Process and apparatus for microwave diagnostics and therapy.
  621. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastomeric polymer.
  622. Hedrick Jeffrey Curtis ; Hedrick James Lupton ; Hilborn Jons Gunnar,CHX ; Liao Yun-Hsin ; Miller Robert Dennis ; Shih Da-Yuan, Process for making a foamed elastometric polymer.
  623. Hedrick Jeffrey Curtis (Park Ridge NJ) Hedrick James Lupton (Pleasanton CA) Liao Yun-Hsin (W. Nyack NY) Miller Robert Dennis (San Jose CA) Shih Da-Yuan (Poughkeepsie NY), Process for making a foamed polymer.
  624. Yoshizawa Tetsuo (Yokohama JPX) Miyazaki Toyohide (Inashiki JPX) Kondo Hiroshi (Osaka JPX) Sakaki Takashi (Tokyo JPX) Terayama Yoshimi (Odawara JPX) Tamura Yoichi (Tokyo JPX) Okabayashi Takahiro (Tok, Process for preparing electrical connecting member.
  625. Wakabayashi Hidechika,JPX ; Takahashi Toru,JPX ; Sakamoto Masaru,JPX ; Sano Rieko,JPX, Process for preparing water-soluble tricarboxypolysaccharide.
  626. Ayala-Esquilin Juan (San Jose CA) Beaman Brian S. (Hyde Park NY) Haring Rudolf A. (Cortlandt Manor NY) Hedrick James L. (Pleasanton CA) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Process of making pinless connector.
  627. Chang Sung Chul ; Khandros Igor Y. ; Smith William D., Process of mounting spring contacts to semiconductor devices.
  628. Verkuil Roger L., Product wafer junction leakage measurement using corona and a kelvin probe.
  629. Paul Bryant ; Martin Silverstein ; Larry W. Fullerton, Programmable active microwave ultrafine resonance spectrometer (PAMURS) method and systems.
  630. Chong Fu Chiung, Programmable high-density electronic device testing.
  631. Akins ; Jr. Robert E. (Ashford CT) Tuan Rocky S. (Chester Springs PA), Protein assay using microwave energy.
  632. Richard K. Williams ; Robert Blattner, Pseudo-Schottky diode.
  633. Plotnikov, Yuri Alexeyevich; Batzinger, Thomas James; Nath, Shridhar Champaknath; Dewangan, Sandeep Kumar; Lester, Carl Stephen; Herd, Kenneth Gordon; Rose, Curtis Wayne, Pulsed eddy current sensor probes and inspection methods.
  634. Thornton ; Jr. Max C. (Palm Bay FL) Kuntz Paul (Melbourne FL) Meyer Russell L. (Melbourne FL) Rosier Kenneth M. (Rockledge FL), Pulsed linear integrated circuit tester.
  635. Michael R. Bruce ; Victoria J. Bruce ; Jeffrey D. Birdsley ; Rosalinda M. Ring ; Rama R. Goruganthu ; Brennan V. Davis, Quadrant avalanche photodiode time-resolved detection.
  636. Guo Wendy W. (10618 Tanager La. Potomac MD 20854) Guo Theodore C. (10618 Tanager La. Potomac MD 20854), Quantitative dielectric imaging system.
  637. Anlage, Steven Mark; Steinhauer, David E.; Vlahacos, Constantine P.; Wellstood, Frederick C., Quantitative imaging of dielectric permittivity and tunability.
  638. Hopkins,Michael; Heynen,Paul, Radio frequency Langmuir probe.
  639. Fuller Milton E. ; Deamer David W. ; Iverson Mark N. ; Koshy ; deceased Ajit J., Radio frequency spectral analysis for in-vitro or in-vivo environments.
  640. Igor Y. Khandros ; Gaetan L. Mathieu, Raised contact structures (solder columns).
  641. Davis, Brennan V., Real-time photoemission detection system.
  642. Worledge, Daniel, Reduction of positional errors in a four point probe resistance measurement.
  643. Fenton Jay Thomas, Repeatably positionable nozzle assembly.
  644. Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L., Resilient contact structures for interconnecting electronic devices.
  645. Khandros Igor Y. ; Mathieu Gaetar L., Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components.
  646. John Hefti, Resonant bio-assay device and test system for detecting molecular binding events.
  647. Inuta Kazuo (Yokaichi JPX), Rotary board treating apparatus.
  648. Yanagisawa Ken (Matsumoto JPX), Rotary drive positioning system for an indexing table.
  649. Sago Hiroyoshi (Kanagawa JPX) Mizuki Hideyuki (Kanagawa JPX) Kudo Katsuhiko (Kanagawa JPX), Rotary-cup coating apparatus.
  650. Teramachi Hiroshi (34-8 ; Higashitamagawa 2-chome Setagaya-ku ; Tokyo JPX), Rotational positioning device.
  651. Mahant-Shetti Shivaling S. (Richardson TX) Aton Thomas J. (Dallas TX) Gale Rebecca J. (Richardson TX), Scanning electron microscope based parametric testing method and apparatus.
  652. Linker Frederick I. (Menlo Park CA) Kirk Michael D. (San Jose CA) Alexander John D. (Sunnyvale CA) Park Sang-il (Palo Alto CA) Park Sung-il (San Jose CA) Smith Ian R. (Los Gatos CA), Scanning probe microscope.
  653. Peach Robert,CAX ; Svensson Nicholas,CAX ; Vo Thai,CAX, Scattering parameter calibration system and method.
  654. Falk Robert Aaron, Schlieren method for imaging semiconductor device properties.
  655. McPherson Hugh (Milnathort GB6), Security system and signal carrying member thereof.
  656. Eslamy, Mohammad; Pedersen, David V; Cobb, Harry D., Segmented contactor.
  657. Schaeffer, Ralph; Crump, Brett, Selectively configurable microelectronic probes.
  658. Huff Richard E. (Belmont CA) Matta Farid (Mountain View CA), Self-leveling membrane probe.
  659. Hirano Toshiki,JPX ; Kimura Atsuo,JPX ; Mori Shinichiro,JPX, Semi-conductor chip test probe and process for manufacturing the probe.
  660. Nikawa Kiyoshi,JPX, Semiconductor device evaluation system using optical fiber.
  661. Kang,Tae Jin; Lee,Woon Bok, Semiconductor device for reducing the number of probing pad used during wafer test and method for testing the same.
  662. Masuoka, Sadaaki, Semiconductor device including gate insulation films having different thicknesses.
  663. Khandros Igor Y. ; Mathieu Gaetar L., Semiconductor devices with integral contact structures.
  664. Benjamin N. Eldridge, Semiconductor fuse covering.
  665. Hembree David R. ; Akram Salman, Semiconductor probe card having resistance measuring circuitry and method fabrication.
  666. Davis ; Jr. James C. (Carlisle MA), Sensor for articles such as wafers on end effector.
  667. Dogaru, Teodor; Smith, Stuart T., Sensors and probes for mapping electromagnetic fields.
  668. Afshari Bahram (Menlo Park CA) Matta Farid (Mountain View CA) Hanlon Lawrence (Menlo Park CA), Shearing stress interconnection apparatus and method.
  669. Coccioli, Roberto; Megahed, Mohamed A.; Trinh, Trang N.; Vittorini, Larry D.; Walley, John S., Shielded antenna in a semiconductor package.
  670. Rabinowitz Mario (Redwood City CA) Perry E. Robert (Portola Valley CA), Shielded electrical cable.
  671. Sinclair, William Y., Shielded integrated circuit probe.
  672. Smith Kenneth L. (23 Barberry La. Meriden CT 06450), Shielded radio frequency transmission cable.
  673. Ryan Carl R. (Gilbert AZ), Signal probe.
  674. Lahr Roy J. (Sierra Madre CA), Signal processing system.
  675. Bruce, Michael R.; Goruganthu, Rama R., Single point high resolution time resolved photoemission microscopy system and method.
  676. Self, Bob J.; Hall, Kevin M, Single point probe structure and method.
  677. Edward J. Hager ; Rondal K. Harmon, Jr., Single tip Kelvin probe.
  678. Rahmel Richard J. (Monroe NY) Strinkovsky Leonid (Spring Valley NY), Slide positioning and holding device.
  679. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
  680. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L. ; Pedersen David V. ; Stadt Michael A., Sockets for "springed" semiconductor devices.
  681. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pedersen, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
  682. Dozier, II, Thomas H.; Eldridge, Benjamin N.; Grube, Gary W.; Khandros, Igor Y.; Mathieu, Gaetan L.; Pederson, David V.; Stadt, Michael A., Sockets for "springed" semiconductor devices.
  683. Dozier ; II Thomas H. ; Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Sockets for electronic components and methods of connecting to electronic components.
  684. Drake Robert E. (Somers NY) Faris Sadeg M. (Pleasantville NY) Patt Roy M. (Walden NY) Shen Zhi-Yuan (Ossining NY), Soft probe for providing high speed on-wafer connections to a circuit.
  685. Dozier ; II Thomas H. ; Khandros Igor Y., Solder preforms.
  686. Munson, Eric Jon; Offerdahl, Thomas James; Schieber, Loren Joseph, Solid-state nuclear magnetic resonance probe.
  687. Benjamin N. Eldridge ; Igor Y. Khandros ; David V. Pedersen ; Ralph G. Whitten, Special contact points for accessing internal circuitry of an integrated circuit.
  688. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  689. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  690. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Special contact points for accessing internal circuitry of an integrated circuit.
  691. Mazur Robert G. ; Stephenson Robert C. ; Andy Mark J. ; Hartford Catherine L. ; Rogers John R., Spreading resistance profiling system.
  692. Mathieu, Gaetan L.; Eldridge, Benjamin N.; Grube, Gary W.; Larder, Richard A., Spring interconnect structures.
  693. Hemmie Dale L. (Burlington IA) Evans Robert M. (Hightstown NJ), Stacked dual dipole MMDS feed.
  694. Eldridge, Benjamin N., Stacked semiconductor device assembly with microelectronic spring contacts.
  695. Khandros Igor Y. ; Pedersen David V., Stacking semiconductor devices, particularly memory chips.
  696. Satya, Akella V. S.; Adler, David L.; Richardson, Neil; Pinto, Gustavo A.; Walker, David J., Stepper type test structures and methods for inspection of semiconductor integrated circuits.
  697. Mehltretter, Ludwig, Structural antenna for flight aggregates or aircraft.
  698. Platz Albin (Ried-Baindlkirch DEX) Schweitzer Klaus (Niederpoecking DEX) Adam Peter (Dachau DEX), Structural component with a protective coating having a nickel or cobalt basis and method for making such a coating.
  699. Coccioli, Roberto; Megahed, Mohamed; Hashemi, Hassan S., Structure and method for fabrication of a leadless chip carrier with embedded antenna.
  700. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Shih Da-Yuan, Structures and processes to create a desired probetip contact geometry on a wafer test probe.
  701. Leich, Martin; Schlectweg, Michael, Supply voltage decoupling device for HF amplifier circuits.
  702. Woollam, John A.; Pfeiffer, Galen L.; Thompson, Daniel W.; Johs, Blaine D.; Herzinger, Craig M., System and method enabling simultaneous investigation of sample with two beams of electromagnetic radiation.
  703. Piety Richard W. ; Bowers ; III Stewart V. ; Gaddis David Q., System and method for measuring and analyzing electrical signals on the shaft of a machine.
  704. Godfrey Gary M., System and method for tasking processing modules based upon temperature.
  705. Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
  706. Miller, Charles A., System for calibrating timing of an integrated circuit wafer tester.
  707. Long, John, System for measuring signal path resistance for an integrated circuit tester interconnect structure.
  708. Kreimer, David I.; Yevin, Oleg A.; Weber, Robert, Systems and methods for filter based spectrographic analysis.
  709. Das,Gobinda; Motika,Franco, TFI probe I/O wrap test method.
  710. Thiessen, William F., Temperature compensated vertical pin probing device.
  711. Paul A. Getchel ; Kenneth M. Cole, Sr. ; Henry A. Lyden, Temperature control system for a workpiece chuck.
  712. Costello, Simon; Pham, Tuyen Paul, Temperature controlled wafer chuck system with low thermal resistance.
  713. Blanz John H. (Carlisle MA), Temperature stable cryogenic probe station.
  714. McGhee James M. ; O'Hara Tetsuya, Tent material product and method of making tent material product.
  715. Ishii Tatsuya (Itami JPX) Miyamoto Kazutoshi (Itami JPX), Test analysis apparatus and analysis method for semiconductor wafer using OBIC analysis.
  716. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
  717. Eldridge, Benjamin N.; Khandros, Igor Y.; Pedersen, David V.; Whitten, Ralph G., Test assembly including a test die for testing a semiconductor product die.
  718. Swart Mark A. (Upland CA) Johnston Charles J. (Walnut CA) Van Loan David R. (Diamond Bar CA), Test fixture alignment system for printed circuit boards.
  719. Stanford ; Melvin E., Test fixture employing plural platens for advancing some or all of the probes of the test fixture.
  720. Flatley Robert (Ashland MA) Hobson David (Waltham MA), Test fixture for tab circuits and devices.
  721. Eldridge, Benjamin N.; Wenzel, Stuart W., Test head assembly for electronic components with plurality of contoured microelectronic spring contacts.
  722. Fujimoto Akihiro (Meiwa-mura JPX), Test head cooling system.
  723. Fujimoto Akihiro,JPX, Test head cooling system.
  724. Kwong, Herman; Goulette, Richard R.; Marcanti, Larry, Test point monitor using embedded passive resistance.
  725. Evans Arthur (Brookfield Center CT) Baker Joseph R. (New Milford CT) Rising Robert P. (Trumbull CT), Test probe assembly for testing integrated circuit devices.
  726. Lee, Sang-Bin; Kliman, Gerald Burt; Mall, Waheed Tony, Test probe for electrical devices having low or no wedge depression.
  727. Beaman Brian Samuel ; Fogel Keith Edward ; Lauro Paul Alfred ; Norcott Maurice Heathcote ; Shih Da-Yuan ; Walker George Frederick, Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof.
  728. Beaman Brian S. (Hyde Park NY) Fogel Keith E. (Bardonia NY) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Shih Da-Yuan (Poughkeepsie NY) Walker George F. (New York NY), Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer.
  729. Miller, Charles A., Test signal distribution system for IC tester.
  730. Hancock Robert D. (Carson City NV) Hollman Kenneth F. (Carson City NV) Porter Gene A. (Carson City NV), Test station.
  731. Blanz John H. (Carlisle MA), Test station having vibrationally stabilized X, Y and Z movable integrated circuit receiving support.
  732. Henley Francois J. (Mountain View CA), Test system for VLSI digital circuit and method of testing.
  733. Miller, Charles A., Tester channel to multiple IC terminals.
  734. Lau James C. K. (Torrance CA) Malmgren Richard P. (Castaic CA) Lui Kenneth (Fountain Valley CA), Testing device for integrated circuits on wafer.
  735. Carrieri, Arthur H.; Roese, Erik S.; Colclough, Stephen J.; Schlitzkus, Peter J.; Younger, V. Kenneth; Orndoff, James R., Thermal luminescence liquid monitoring system and method.
  736. Cole ; Jr. Edward I., Thermally-induced voltage alteration for integrated circuit analysis.
  737. Byrnes Herbert P. (Poughkeepsie NY) Halbout Jean-Marc (Larchmont NY) Scheuermann Michael R. (Katonah NY) Shapiro Eugene (Stamford CT), Thin interface pellicle for dense arrays of electrical interconnects.
  738. Stanbro William D. (Columbia MD), Three dimensional binding site array for interfering with an electrical field.
  739. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
  740. Sullivan Mark T. (1661 18th Ave. San Francisco CA 94122) Mansfield Joseph A. (531 NW. Canyon Dr. Redmond OR 097756), Tilting kinematic mount.
  741. Barr, Andrew Harvey; Logan, Gary, Tip and tip assembly for a signal probe.
  742. Matsunaga Kouji,JPX ; Inoue Hirobumi,JPX ; Tanehashi Masao,JPX ; Taura Toru,JPX ; Nikaidou Masahiko,JPX ; Yamagishi Yuuichi,JPX ; Hayakawa Satoshi,JPX, Tip portion structure of high-frequency probe and method for fabrication probe tip portion composed by coaxial cable.
  743. Robb S. Gillespie ; Steven A. Rogacki, Tool tip conductivity contact sensor and method.
  744. Iwakura Kenichi (Kawasaki JPX) Ohtsuka Tetsuo (Kawasaki JPX), Touch sensor unit of prober for testing electric circuit and electric circuit testing apparatus using the touch sensor u.
  745. Masaru Suzuki JP, Transfer mechanism for use in exchange of probe card.
  746. Schmidt Ewald,DEX ; Voigtlander Klaus,DEX ; Mayer Hermann,DEX ; Lucas Bernhard,DEX ; Dennerlein Gerd,DEX ; Beez Thomas,DEX ; Muller Roland,DEX ; Olbrich Herbert,DEX ; Martin Siegbert,DEX ; Dutzi Joac, Transition from a waveguide to a strip transmission line.
  747. Jacobs,Lawrence W.; Campbell,Julie A., Transmission line input structure test probe.
  748. Hurley Daniel T. (San Ramon CA) Chiang Ching-Lang (San Jose CA) Khurana Neeraj (Monte Sereno CA), Transportable image emission microscope.
  749. Rabjohn Gordon G. (Kanata CAX), Tunable microwave wafer probe.
  750. Faz Albert (San Antonio TX) Coronado Rodolfo U. (San Antonio TX), Turntable for rotating a wafer carrier.
  751. Meaney Paul M. ; Paulsen Keith D., Two-dimensional microwave imaging apparatus and methods.
  752. Ference Thomas G. ; Howell Wayne J., Ultra fine probe contacts.
  753. Capps,Charles P.; Johnson,Brian W.; Gloudemans,Jeffrey M.; Lane,John A., Ultra-broadband differential voltage probes.
  754. Tam, Alan K.; Lao, Binneg Y., Ultra-wideband power amplifier module apparatus and method for optical and electronic communications.
  755. Lindemann Gert,DEX ; Schmoll Klaus-Peter,DEX ; Keuper Gerhard,DEX ; Wallaschek Jorg,DEX, Ultrasonic driving element.
  756. Sleva Michael Z. (Atlanta GA) Hunt William D. (Decatur GA) Connuck David M. (Augusta GA) Briggs Ronald D. (Duluth GA), Ultrasonic transducer and method for using same.
  757. Avneri Israel,ILX ; Duzi Eyal,ILX ; Keren Dvir,ILX ; Regev Avner,ILX, Vacuum chuck having vacuum-nipples wafer support.
  758. Jen, Hung-Min; Su, David K., Variable gain amplifier.
  759. Chheda, Sachin Navin; Dobbs, Robert William; Barr, Andrew, Variable impedance test probe.
  760. Kapetanic, Peter; Martens, Jon; Rangel, David, Vector network measurement system.
  761. Mizuta Masaharu,JPX, Vertical needle type probe card, method of manufacturing thereof, method of replacing defective probe needle and test method of wafer using the probe card.
  762. Tsuchiya Yutaka (Shizuoka JPX) Aoshima Shinichiro (Shizuoka JPX) Nakamura Takuya (Shizuoka JPX), Voltage detector.
  763. McTigue, Michael Thomas, Voltage probe.
  764. Reeds John W. (Thousand Oaks CA), Wafer alignment and positioning apparatus for chip testing by voltage contrast electron microscopy.
  765. Chen, Fu-Sheng, Wafer chuck system.
  766. Niori Yusuke (Nagoya JPX) Nobori Kazuhiro (Haguri JPX) Ushikoshi Ryusuke (Handa JPX) Umemoto Koichi (Toyota JPX), Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means.
  767. Carbone, Mark Charles; Uher, Frank Otto; Andberg, John William; Lobacz, Jerzy; Richmond, II, Donald Paul, Wafer level burn-in and test methods.
  768. Lockwood Larry R. (McMinnville OR) Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR), Wafer probe.
  769. Strid Eric W. (Portland OR) Gleason Kimberly R. (Portland OR), Wafer probe.
  770. Sang Emmanuel (Portland OR) Estabrook Gary L. (Vancouver WA), Wafer probe head.
  771. Hollman, Kenneth F., Wafer probe station.
  772. Schwindt Randy J. ; Harwood Warren K. ; Tervo Paul A. ; Smith Kenneth R. ; Warner Richard H., Wafer probe station for low-current measurements.
  773. Harwood,Warren K.; Tervo,Paul A.; Koxxy,Martin J., Wafer probe station having environment control enclosure.
  774. Schwindt Randy J. (Portland OR) Harwood Warren K. (Vancouver WA) Tervo Paul A. (Vancouver WA), Wafer probe station having full guarding.
  775. Harwood Warren K. (Vancouver WA) Koxxy Martin J. (Hillsboro OR) Tervo Paul A. (Vancouver WA), Wafer probe station with integrated environment control enclosure.
  776. Grace Martin I. ; Oldfield William W., Wafer probe with built in RF frequency conversion module.
  777. Barsotti Christina C. (Vancouver WA) Schamel Alfred H. (West Linn OR), Wafer probe with transparent loading member.
  778. Sato Mitsuya (Yokohama JPX), Wafer prober.
  779. Sato Mitsuya (Yokohama JPX) Ukaji Takao (Yokohama JPX) Yamaguchi Nobuhito (Yokohama JPX) Ohmori Taro (Yokohama JPX) Murakami Eiichi (Yokohama JPX), Wafer prober.
  780. Sato Mitsuya (Yokohama JPX), Wafer prober and a probe card to be used therewith.
  781. Gleason Kimberly R. (Portland OR) Strid Eric W. (Portland OR) Flegal Robert T. (Beaverton OR) McCamant Angus J. (Aloha OR), Wafer probes.
  782. Mallory Roy E. (Bedford MA) Domenicali Peter (Montepelier VT) Poduje Noel S. (Needham Heights MA) Belyaev Alexander (Wayland MA) Harvey Peter A. (Wilmington MA) Smith Richard S. (Harvard MA), Wafer testing and self-calibration system.
  783. Khandros Igor Y. ; Pedersen David V., Wafer-level burn-in and test.
  784. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  785. Khandros, Igor Y.; Pedersen, David V., Wafer-level burn-in and test.
  786. Frank Otto Uher ; John William Andberg ; Mark Charles Carbone ; Donald Paul Richmond, II, Wafer-level burn-in and test cartridge.
  787. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Wafer-level test and burn-in, and semiconductor process.
  788. Blackwood,Jeffrey, Wafer-mounted micro-probing platform.
  789. Hatazawa Kenji (Minamikawachi JPX) Mukai Hiroyuki (Yao JPX) Somei Junichi (Yamatokoriyama JPX), Waveguide to microstrip conversion means in a satellite broadcasting adaptor.
  790. du Toit, Cornelis Frederik; Ramesh, Mangipudi, Waveguide to microstrip transition.
  791. Sedivec Darrel F. (Lawrence MA), Waveguide to stripline transition assembly.
  792. Weinreb Sander ; Bowyer Dean N., Waveguide to transmission line transition.
  793. Martin, John T., Waveguide with adjustable backshort.
  794. Igarashi Sadao (Soma JPX), Waveguide-microstrip line converter.
  795. Wu You-Sun (Hamilton NJ), Waveguide-to-microstrip transition.
  796. Satomura,Hiroaki; Fujita,Shinya; Ukita,Junichi; Watanabe,Katsuhiko, Wavelength dispersion probing system.
  797. Patrick G. Kim ; Donald L. Smith ; Andrew S. Alimonda, Wear-resistant spring contacts.
  798. Kleinberg Robert L. (Ridgefield CT) Clark Brian (Missouri City TX) Chew Weng C. (Champaign IL) Mariani David (Darien CT), Well logging apparatus for determining dip, azimuth, and invaded zone conductivity.
  799. Zamborelli Thomas J. (Colorado Springs CO), Wide bandwidth passive probe.
  800. Howland, Jr.,William H.; Hillard,Robert J.; Hung,Steven Chi Shin, Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof.

이 특허를 인용한 특허 (5)

  1. Lewinnek, David Walter; Sinsheimer, Roger Allen; Valiente, Luis Antonio; DiPalo, Craig Anthony, Interconnect for transmitting signals between a device and a tester.
  2. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  3. Terada, Shohei; Kaji, Kazutoshi; Isakozawa, Shigeto, Method and apparatus for observing inside structures, and specimen holder.
  4. Sinsheimer, Roger Allen, Structure for transmitting signals in an application space between a device under test and test electronics.
  5. Suto, Anthony J.; Wrinn, Joseph Francis; Toscano, John P.; Arena, John Joseph, Test fixture.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로