Surface mount light emitting diode assembly and backlight module using the same
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F21V-003/00
F21V-029/00
출원번호
UP-0013920
(2008-01-14)
등록번호
US-7762692
(2010-08-13)
우선권정보
CN-2007 1 0201358(2007-08-14)
발명자
/ 주소
Lai, Chih-Ming
Hsu, Hung-Kuang
출원인 / 주소
Foxsemicon Integrated Technology, Inc.
대리인 / 주소
Knapp, Jeffrey T.
인용정보
피인용 횟수 :
22인용 특허 :
7
초록▼
A surface mount LED assembly (10) comprises a substrate (11), a bonding pad, an LED chip (12) and a lens package (13). The bonding pad, the LED chip and the lens package are positioned on the substrate. The LED chip is electrically connected with the bonding pad. The lens package covers the LED chip
A surface mount LED assembly (10) comprises a substrate (11), a bonding pad, an LED chip (12) and a lens package (13). The bonding pad, the LED chip and the lens package are positioned on the substrate. The LED chip is electrically connected with the bonding pad. The lens package covers the LED chip. The lens package comprises a light emitting surface (132) located away from the LED chip. The light emitting surface is a curved surface protruding away from the substrate.
대표청구항▼
What is claimed is: 1. A surface mount LED assembly comprising: a substrate; a bonding pad formed on the substrate; an LED chip electrically connected with the bonding pad; and a lens covering the LED chip; wherein the lens comprises a first light emitting surface facing away from the LED chip, and
What is claimed is: 1. A surface mount LED assembly comprising: a substrate; a bonding pad formed on the substrate; an LED chip electrically connected with the bonding pad; and a lens covering the LED chip; wherein the lens comprises a first light emitting surface facing away from the LED chip, and the first light emitting surface is a curved surface protruding in a direction away from the substrate; wherein the lens comprises a second light emitting surface and a third light emitting surface located at two opposite sides of the first light emitting surface, and the second emitting surface and the third light emitting surface are selected to be two curved surfaces each having a different radius of curvature from the first light emitting surface, or one plane surface and one curved surface having a different radius of curvature from the first light emitting surface, or both plane surfaces. 2. The surface mount LED assembly as described in claim 1, wherein the curved surface of the first light emitting surface of the lens has a spherically-shaped profile or a paraboloidally-shaped profile. 3. The surface mount LED assembly as described in claim 2, wherein the curved surface of the first light emitting surface of the lens is a hemispherical surface. 4. The surface mount LED assembly as described in claim 1, wherein the lens is comprised of a transparent material selected from the group consisting of resin, glass and silicone. 5. A backlight module comprising: a surface mount LED assembly; and a light guiding plate; wherein the light guiding plate comprises a first surface, the surface mount LED assembly comprises a substrate, a bonding pad formed on the substrate, an LED chip electrically connected with the bonding pad and a lens covering the LED chip, the lens comprises a first light emitting surface facing away from the LED chip, the first light emitting surface is a curved surface protruding in a direction away from the substrate, the light guiding plate comprises a recess defined in the first surface, and the lens is received in the recess; wherein the lens further comprises a second light emitting surface and a third light emitting surface located at two opposite sides of the first light emitting surface, and the second emitting surface and the third light emitting surface are selected to be two curved surfaces each having a different radius of curvature from the first light emitting surface, or one plane surface and one curved surface having a different radius of curvature from the first light emitting surface, or both plane surfaces. 6. The backlight module as described in claim 5, wherein the lens is comprised of a transparent material selected from the group consisting of resin, glass and silicone. 7. The backlight module as described in claim 5, wherein the curved surface of the first light emitting surface of the lens has a spherically-shaped profile or a paraboloidally-shaped profile. 8. The backlight module as described in claim 7, wherein the curved surface of the first light emitting surface of the lens is a hemispherical surface. 9. The backlight module as described in claim 5, wherein an inner surface in the recess of the light guiding plate is a curved surface, a radius of curvature of the inner surface of the recess is larger than or equal to that of the first light emitting surface of the lens. 10. The backlight module as described in claim 9, wherein a light permeable material is arranged between the first light emitting surface of the lens and the inner surface in the recess of the light guiding plate. 11. The backlight module as described in claim 10, wherein a refractive index of the light permeable material is equal to that of the lens and the light guiding plate. 12. The backlight module as described in claim 10, wherein the light permeable material comprises a fluorescent powder mixed therein or a fluorescent powder layer formed on a surface thereof. 13. The backlight module as described in claim 10, wherein the light permeable material is selected from the group consisting of colloid, gelatin, epoxy, glass and silicone. 14. The backlight module as described in claim 10, wherein a refractive index of the light permeable material is in a range between a refractive index of the lens and a refractive index of the light guiding plate. 15. The backlight module as described in claim 14, wherein the refractive index of the light permeable material is in a range of 1.4˜1.5. 16. A backlight module comprising: a light guiding plate having a light incident surface with a recess defined in the light incident surface, the light guiding plate having an inner concave surface in the recess; a substrate; an LED chip electrically mounted on the substrate; a lens attached on the substrate, the lens and the substrate cooperatively enveloping the LED chip therein, the lens being received in the recess of the light guiding plate, the LED chip being located outside the recess of the light guiding plate, the lens comprising a convex surface facing toward the inner concave surface of the light guiding plate, a radius of curvature of the inner concave surface of the light guiding plate being greater than that of the convex surface of the lens; and a light permeable material filled between the inner concave surface of the light guiding plate and the convex surface of the lens; wherein the convex surface of the lens is taken as a first light emitting surface of the lens, the lens further comprises a second light emitting surface and a third light emitting surface located at two opposite sides of the first light emitting surface, and the second emitting surface and the third light emitting surface are selected to be two curved surfaces each having a different radius of curvature from the first light emitting surface, or one plane surface and one curved surface having a different radius of curvature from the first light emitting surface, or both plane surfaces. 17. The backlight module as described in claim 16, wherein a refractive index of the light permeable material is in the range from the minimum of that of the light guiding plate and the lens to the maximum of that of the light guiding plate and the lens.
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