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Methods of forming semiconductor light emitting device packages by liquid injection molding

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/00
출원번호 UP-0507191 (2006-08-21)
등록번호 US-7763478 (2010-08-13)
발명자 / 주소
  • Loh, Ban P.
  • Medendorp, Jr., Nicholas W.
출원인 / 주소
  • Cree, Inc.
대리인 / 주소
    Myers Bigel Sibley & Sajovec, PA
인용정보 피인용 횟수 : 8  인용 특허 : 31

초록

Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is

대표청구항

What is claimed is: 1. A semiconductor light emitting device packaging method comprising: fabricating a substrate member configured to mount a semiconductor light emitting device thereon; mounting the semiconductor light emitting device on the substrate member; electrically connecting the semicondu

이 특허에 인용된 특허 (31)

  1. Edmond John A. (Apex NC), Blue light emitting diode formed in silicon carbide.
  2. Edmond John A. (Apex NC), Blue light emitting diode formed in silicon carbide.
  3. Edmond John A. (Apex NC) Kong Hua-Shuang (Raleigh NC) Dmitriev Vladimir (Fuquay-Varina NC) Bulman Gary E. (Cary NC), Blue light-emitting diode with degenerate junction structure.
  4. Edmond John A. (Apex NC) Kong Hua-Shuang (Raleigh NC), Blue light-emitting diode with high external quantum efficiency.
  5. Edmond John A. (Apex NC) Dmitriev Vladimir (Fuquay-Varina NC) Irvine Kenneth (Cary NC), Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices.
  6. Edmond John A. ; Kong Hua-Shuang, Double heterojunction light emitting diode with gallium nitride active layer.
  7. Edmond John A. ; Kong Hua-Shuang, Double heterojunction light emitting diode with gallium nitride active layer.
  8. Shaddock, David Mulford, Dual encapsulation for an LED.
  9. Edmond John Adam ; Kong Hua-Shuang ; Doverspike Kathleen Marie ; Leonard Michelle Turner, Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure.
  10. Edmond John Adam ; Kong Hua-Shuang ; Doverspike Kathleen Marie ; Leonard Michelle Turner, Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlayer structure.
  11. Negley Gerald H., High efficiency light emitting diodes.
  12. Carter ; Jr. Calvin H. (Raleigh NC), High efficiency light emitting diodes from bipolar gallium nitride.
  13. Carey Julian A. ; Collins ; III William David ; Posselt Jason L., High stability optical encapsulation and packaging for light-emitting diodes in the green, blue, and near UV range.
  14. Bortscheller, Jacob C.; Wojnarowski, Robert J., LED cross-linkable phospor coating.
  15. Shimizu Yoshinori,JPX ; Sakano Kensho,JPX ; Noguchi Yasunobu,JPX ; Moriguchi Toshio,JPX, Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material.
  16. Shimizu Yoshinori,JPX ; Sakano Kensho,JPX ; Noguchi Yasunobu,JPX ; Moriguchi Toshio,JPX, Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material.
  17. Shimizu,Yoshinori; Sakano,Kensho; Noguchi,Yasunobu; Moriguchi,Toshio, Light emitting device with blue light LED and phosphor components.
  18. Shimizu,Yoshinori; Sakano,Kensho; Noguchi,Yasunobu; Moriguchi,Toshio, Light emitting device with blue light led and phosphor components.
  19. Soules Thomas Frederick ; Beers William Winder ; Srivastava Alok Mani ; Levinson Lionel Monty ; Duggal Anil Raj, Light emitting device with phosphor composition.
  20. Negley Gerald H. (Hillsborough NC), Method for producing high efficiency light-emitting diodes and resulting diode structures.
  21. Edmond John A. (Cary NC) Suvorov Alexander V. (Durham NC), Method of forming green light emitting diode in silicon carbide.
  22. Edmond John A. (Apex NC), Method of production of light emitting diodes.
  23. Lowery Christopher Haydn, Multiple encapsulation of phosphor-LED devices.
  24. Itoh Shigeo,JPX ; Toki Hitoshi,JPX ; Kataoka Fumiaki,JPX ; Kanie Hisashi,JPX, Phosphor and method for producing same.
  25. Duclos, Steven Jude; Jansma, Jon; Bortscheller, Jacob C.; Wojnarowski, Robert J., Phosphor coating with self-adjusting distance from LED chip.
  26. Osaka Norihisa (Tajimi JPX) Ikegami Yukihiro (Nagoya JPX), Phosphor paste compositions and phosphor coatings obtained therefrom.
  27. Roberts, John K.; Reese, Spencer D., Radiation emitter device having an encapsulant with different zones of thermal conductivity.
  28. Negley,Gerald H., Semiconductor light emitting devices including flexible film having therein an optical element.
  29. Carey Julian A. ; Collins ; III William D. ; Loh Ban Poh ; Sasser Gary D., Surface mountable LED package.
  30. Vriens Leendert,NLX ; Acket Gerard,NLX ; Ronda Cornelis,DEX, UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light.
  31. Edmond John A. (Cary NC) Bulman Gary E. (Cary NC) Kong Hua-Shuang (Raleigh NC) Dmitriev Vladimir (Fuquay-Varina NC), Vertical geometry light emitting diode with group III nitride active layer and extended lifetime.

이 특허를 인용한 특허 (8)

  1. Emerson, David Todd; Rosado, Raymond; Donofrio, Matthew; Edmond, John Adam, Gap engineering for flip-chip mounted horizontal LEDs.
  2. Park, Young Sam; Lee, Seung Ick; Hahm, Hun Joo; Kim, Hyung Suk; Kim, Bum Jin; Jeong, Young June; Ahn, Ho Sik; Park, Jung Kyu, LED package frame and LED package having the same.
  3. Wilcox, Kurt S.; Keller, Bernd; Lowes, Ted; Andrews, Peter S., LED-array light source with aspect ratio greater than 1.
  4. Okazaki, Tomokazu, Light emitting device.
  5. Jaeger, Harald; Brunner, Herbert; Schneider, Albert; Zeiler, Thomas, Method for the manufacture of an optoelectronic component and an optoelectronic component.
  6. Marquardt, Craig Eugene; Chen, Jie; Weiss, Daniel Aaron, Optic for a light source.
  7. Donofrio, Matthew; Edmond, John Adam; Andrews, Peter Scott; Chang, David Der Chi, Reflective mounting substrates for flip-chip mounted horizontal LEDs.
  8. Kim, Daniel; You, Jae-sung; Park, Jong-kil, Semiconductor package and method of manufacturing the same.
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